SCHEMBL4862424

SCHEMBL4862424

C=Cc1c(COCC2CO2)cc(COCC2CO2)cc1COCC1CO1

nearest known ligand 0.43

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 4/20 0.43
TSHR P16473 3/20 0.35
SMN1; SMN2 Q16637 2/20 0.35
TDP1 Q9NUW8 2/20 0.33
TP53 P04637 1/20 0.33
CYP3A4 P08684 1/20 0.33
HIF1A Q16665 1/20 0.33
MAPK1 P28482 1/20 0.33
LMNA P02545 2/20 0.30
GAA P10253 1/20 0.30
PKM P14618 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3751496 0.83 ALDH1A1 (0.44) ALDH1A1TSHRSMN1; SMN2TDP1TP53
SCHEMBL4859403 0.82 ALDH1A1 (0.39) ALDH1A1TSHRSMN1; SMN2TP53CYP3A4
SCHEMBL3751458 0.81 ALDH1A1 (0.46) ALDH1A1TSHRSMN1; SMN2TDP1TP53
SCHEMBL29378506 0.81 ALDH1A1 (0.40) ALDH1A1TSHRSMN1; SMN2TDP1TP53
SCHEMBL3752522 0.81 ALDH1A1 (0.40) ALDH1A1TSHRSMN1; SMN2TDP1TP53
SCHEMBL28185451 0.79 TSHR (0.48) ALDH1A1TSHRSMN1; SMN2TDP1TP53
SCHEMBL4865007 0.78 ALDH1A1 (0.40) ALDH1A1TSHRSMN1; SMN2TDP1TP53
SCHEMBL17426916 0.78 ALDH1A1 (0.42) ALDH1A1TSHRSMN1; SMN2TDP1TP53
SCHEMBL4861699 0.77 ALDH1A1 (0.42) ALDH1A1TSHRSMN1; SMN2TDP1TP53
SCHEMBL1471512 0.77 ALDH1A1 (0.42) ALDH1A1TSHRSMN1; SMN2TDP1TP53

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 273 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4619477-A1 COATING COMPOSITION PPG Europe B.V. (NL) 2025-09-24 EP disclosed
EP-4126989-B1 COATING COMPOSITION COMPRISING A FILM-FORMING RESIN AND A CROSSLINKING MATERIAL PPG IND OHIO INC (US) 2025-07-09 EP disclosed
US-12252627-B2 Photosensitive resin composition, film prepared from the same, and electronic apparatus including the film SAMSUNG DISPLAY CO., LTD. (KR) 2025-03-18 US disclosed
EP-4512836-A2 A CROSSLINKING MATERIAL AND USES THEREOF PPG Industries Ohio, Inc. (US) 2025-02-26 EP disclosed
WO-2025017155-A1 COATING COMPOSITION PPG EUROPE B.V. (NL) 2025-01-23 WO disclosed
EP-4495193-A1 COATING COMPOSITION PPG Europe B.V. (NL) 2025-01-22 EP disclosed
US-20250019560-A1 ACRYLIC MATERIALS AND USES THEREOF PPG INDUSTRIES OHIO, INC. (US) 2025-01-16 US disclosed
EP-4126988-B1 A PACKAGE COMPRISING A COATING COMPOSITOIN COMPRISING A FILM-FORMING RESIN AND A CROSSLINKING MATERIAL PPG IND OHIO INC (US) 2025-01-08 EP disclosed
WO-2024252985-A1 CURABLE RESIN COMPOSITION, CURED FILM, DISPLAY DEVICE, AND SOLID-STATE IMAGING ELEMENT 住友化学株式会社 2024-12-12 WO disclosed
EP-4464711-A1 COMPOUND AND COLORED RESIN COMPOSITION Sumitomo Chemical Company, Limited (JP) 2024-11-20 EP disclosed
US-6797450-B2 ALKALI-SOLUBLE RESIN HAVING NO EPOXY GROUP AND A 1,2-QUINONEDIAZIDE COMPOUND JSR CORPORATION (JP) 2004-09-28 US disclosed
EP-1312982-A1 RADIATION-SENSITIVE COMPOSITION, INSULATING FILM AND ORGANIC EL DISPLAY ELEMENT JSR Corporation (JP) 2003-05-21 EP disclosed
US-20030068574-A1 Radiation sensitive resin composition, rib, rib forming method and display element JSR CORPORATION (JP) 2003-04-10 US disclosed
EP-1296186-A1 Radiation sensitive resin composition, rib, rib forming method and display element JSR Corporation (JP) 2003-03-26 EP disclosed
US-20030054284-A1 Radiation-sensitive composition, insulating film and organic el display element JSR CORPORATION (JP) 2003-03-20 US disclosed
EP-0880075-B1 Radiation sensitive resin composition JSR CORP (JP) 2001-10-17 EP disclosed
US-6168908-B1 COATING AN ALKALI-SOLUBLE THERMOSETTING RESIN ON A SUBSTRATE, AND BAKING IT, COATING A RADIATION SENSITIVE RESIN ON THE COATED FILM, AND BAKING, EXPOSING THE RADIATION SENSITIVE FILM TO A RADIATION THROUGH A MASK AND BAKING, DEVELOPING JSR CORPORATION (JP) 2001-01-02 US disclosed
US-5958648-A Radiation sensitive resin composition JSR CORPORATION (JP) 1999-09-28 US disclosed
EP-0908780-A1 Process for forming a cured film of a thermosetting resin JSR Corporation (JP) 1999-04-14 EP disclosed
EP-0880075-A1 Radiation sensitive resin composition JSR Corporation (JP) 1998-11-25 EP disclosed