SCHEMBL4866958

SCHEMBL4866958

Cc1nccn1C#N

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3836003 0.76
SCHEMBL25420049 0.74
SCHEMBL11878317 0.74 MYC (0.40)
SCHEMBL28301854 0.71
SCHEMBL29012440 0.71
SCHEMBL28058962 0.71
SCHEMBL27510983 0.71
SCHEMBL6689445 0.70 KDR (0.31)
SCHEMBL27451389 0.67
Water SCHEMBL30363159 0.67 LPO (0.50)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 38 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7314701-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2008-01-01 US claimed
WO-2025053257-A1 METHOD FOR PRODUCING COMPOUND ENCODED BY OLIGONUCLEOTIDE, AND APPLICATION THEREOF 旭化成ファーマ株式会社 2025-03-13 WO disclosed
CN-119463413-A Resin composition, build-up film, preparation method of build-up film and packaging carrier plate 清华珠三角研究院 2025-02-18 CN disclosed
CN-119410123-A Flame-retardant resin composition, build-up film, preparation method of build-up film and packaging carrier plate 清华珠三角研究院 2025-02-11 CN disclosed
CN-119384417-A Glycidyl group-containing compound, curable resin composition, cured product, and laminate DIC株式会社 2025-01-28 CN disclosed
CN-119242018-A Toughening resin composition, build-up film, preparation method of build-up film and packaging carrier plate 清华珠三角研究院 2025-01-03 CN disclosed
CN-119137110-A Glycidyl ether group-containing compound, curable resin composition, cured product, and laminate DIC株式会社 2024-12-13 CN disclosed
CN-119095895-A Glycidyl ether group-containing compound, curable resin composition, cured product, and laminate DIC株式会社 2024-12-06 CN disclosed
CN-116829353-A Epoxy resin composition, cured product thereof, and laminate DIC株式会社 2023-09-29 CN disclosed
US-20220177639-A1 LATENT CURING CATALYSTS AND RESIN COMPOSITION CONTAINING THE SAME NAMICS CORPORATION (JP) 2022-06-09 US disclosed
CN-100422282-C Adhesive composition for lignin cellulose type hot-press forming body and producing method of hot-press forming body NIPPON POLYURETHANE KOGYO KK (JP) 2008-10-01 CN disclosed
CN-100406488-C Polyisocyanate solution, and adhesive and coating using the same NIPPON POLYURETHANE KOGYO KK (JP) 2008-07-30 CN disclosed
US-7314701-B2 Radiation-sensitive resin composition JSR CORPORATION (JP) 2008-01-01 US disclosed
US-20050095527-A1 Radiation-sensitive resin composition JSR CORPORATION (JP) 2005-05-05 US disclosed
CN-1504490-A Polyisocyanate solution, and adhesive and coating using the same 日本聚氨酯工业株式会社 2004-06-16 CN disclosed
CN-1368528-A Adhesive composition for lignin cellulose type hot-press forming body and producing method of hot-press forming body NIPPON POLYURETHANE KOGYO KK (JP) 2002-09-11 CN disclosed
CN-1084746-C 1, 2, 3 -benzothiadiazole derivatives BAYER AGROCHEM KK (JP) 2002-05-15 CN disclosed
CN-1075071-C (R)-(E)-(4-substituted-phenyl-1,3-dithiolan-3-dithiolan-2-ylidene)-1-imidazolylacetonitrile, antifungal composition contg. same, and method for producing same NIHON NOHYAKU CO LTD (JP) 2001-11-21 CN disclosed
CN-1192438-A (R)-(E)-(4-substituted-phenyl-1,3-dithiolan-3-dithiolan-2-ylidene)-1-imidazolylacetonitrile, antifungal composition contg. same, and method for producing same NIHON NOHYAKU CO LTD (JP) 1998-09-09 CN disclosed
CN-1172111-A 1, 2, 3 -benzothiadiazole derivatives BAYER AGROCHEM KK (JP) 1998-02-04 CN disclosed