SCHEMBL4867066

SCHEMBL4867066

C=C(CC=CC#N)C(=O)OCCCC

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.45
HPGD P15428 1/20 0.45
ATM Q13315 1/20 0.43
HCAR2 Q8TDS4 3/20 0.39
ALDH1A1 P00352 2/20 0.38
NPSR1 Q6W5P4 2/20 0.35
MAPT P10636 1/20 0.35
RAB9A P51151 1/20 0.35
TP53 P04637 1/20 0.33
TDP1 Q9NUW8 1/20 0.32
L3MBTL1 Q9Y468 1/20 0.32
NAAA Q02083 1/20 0.32
RAD52 P43351 1/20 0.31
ZDHHC20 Q5W0Z9 1/20 0.31
ZDHHC2 Q9UIJ5 1/20 0.31
APP P05067 1/20 0.31
THRB P10828 1/20 0.31
LMNA P02545 1/20 0.30
ESR1 P03372 1/20 0.30
CYP1A2 P05177 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3194623 0.94 TSHR (0.51) TSHRHPGDATMHCAR2ALDH1A1
SCHEMBL5972384 0.91 TSHR (0.36) TSHRHPGDATMHCAR2ALDH1A1
SCHEMBL18062493 0.85 TSHR (0.55) TSHRHPGDATMHCAR2ALDH1A1
Methacrylic Acid SCHEMBL9453499 0.85 TSHR (0.40) TSHRHPGDATMHCAR2ALDH1A1
SCHEMBL9615737 0.84 ALDH1A1 (0.50) TSHRHPGDHCAR2ALDH1A1NPSR1
SCHEMBL9330576 0.83 TSHR (0.40) TSHRALDH1A1
SCHEMBL19180814 0.82 TSHR (0.58) TSHRHPGDATMHCAR2ALDH1A1
SCHEMBL2259513 0.78 ATM (0.50) TSHRHPGDATMHCAR2ALDH1A1
SCHEMBL250095 0.78 TSHR (0.47) TSHRHPGDATMHCAR2ALDH1A1
SCHEMBL313840 0.78 HCAR2 (0.53) TSHRHPGDATMHCAR2ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-104124415-A Composite gel polymer electrolyte as well as preparation method and application thereof SHENZHEN HYB BATTERY CO LTD 2014-10-29 CN claimed
CN-104124415-A Composite gel polymer electrolyte as well as preparation method and application thereof SHENZHEN HYB BATTERY CO LTD 2014-10-29 CN disclosed
CN-104124415-A Composite gel polymer electrolyte as well as preparation method and application thereof SHENZHEN HYB BATTERY CO LTD 2014-10-29 CN disclosed
US-7402376-B2 Photosensitive resin composition and photosensitive dry film containing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2008-07-22 US disclosed
EP-0888880-B1 CONDUCTIVE MULTILAYER BLOW MOLDING AND CONDUCTIVE RESIN COMPOSITION TORAY INDUSTRIES (JP) 2006-08-02 EP disclosed
US-20050238998-A1 Photosensitive resin composition and photosensitive dry film containing the same TOKYO OHKA KOGYO CO., LTD. (JP) 2005-10-27 US disclosed
US-6723400-B1 ELECTROCONDUCTIVE, MULTILAYERED HOLLOW MOLDINGS WITH GOOD, WELL-BALANCED HEAT RESISTANCE, HOT WATER RESISTANCE, CHEMICAL RESISTANCE, GASOHOL PERMEATION RESISTANCE, OUTWARD APPEARANCE, INTERLAYER ADHESION AND LOW-TEMP. STIFFNESS TORAY INDUSTRIES, INC. (JP) 2004-04-20 US disclosed
US-6641628-B1 Plastic particles are acrylonitrile/polyethylene chloride/styrene resin particles TOKYO OHKA KOGYO CO., LTD. (JP) 2003-11-04 US disclosed
EP-0890417-B1 Method for sandblast processing plasma display panel substrate using a plastic abrasive TOKYO OHKA KOGYO CO LTD (JP) 2003-05-07 EP disclosed
US-6368195-B1 Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters TOKYO OHKA KOGYO CO., LTD. (JP) 2002-04-09 US disclosed
US-6126513-A Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters TOKYO OHKA KOGYO CO., LTD. (JP) 2000-10-03 US disclosed
EP-0890417-A1 Plastic abrasive for sandblasting, method for sandblast processing plasma display panel substrate using the same and method for treating sandblasting waste matters TOKYO OHKA KOGYO CO., LTD. (JP) 1999-01-13 EP disclosed
EP-0888880-A1 CONDUCTIVE MULTILAYER BLOW MOLDING AND CONDUCTIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 1999-01-07 EP disclosed