Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MGLL | Q99685 | 13/20 | 0.69 |
| ▸ | FAAH | O00519 | 7/20 | 0.69 |
| ▸ | HSP90AA1 | P07900 | 4/20 | 0.58 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.56 |
| ▸ | PKM | P14618 | 2/20 | 0.56 |
| ▸ | HTT | P42858 | 2/20 | 0.56 |
| ▸ | ATM | Q13315 | 1/20 | 0.56 |
| ▸ | HPN | P05981 | 1/20 | 0.51 |
| ▸ | CCR6 | P51684 | 2/20 | 0.41 |
| ▸ | MAPT | P10636 | 1/20 | 0.41 |
| ▸ | HPGD | P15428 | 1/20 | 0.41 |
| ▸ | XBP1 | P17861 | 1/20 | 0.41 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.41 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.41 |
| ▸ | BCHE | P06276 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15875971 | 0.88 | MGLL (0.69) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL11835741 | 0.85 | MGLL (0.64) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL1838889 | 0.83 | MGLL (1.00) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL94730 | 0.83 | MGLL (1.00) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL28288333 | 0.82 | MGLL (0.75) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL30958998 | 0.81 | MGLL (0.95) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL11833971 | 0.80 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| Water SCHEMBL5808596 | 0.79 | MGLL (0.91) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL29663714 | 0.78 | MGLL (0.58) | MGLLFAAHHSP90AA1ALDH1A1PKM | |
| SCHEMBL3916468 | 0.78 | MGLL (0.72) | MGLLFAAHHSP90AA1ALDH1A1PKM |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2024150769-A1 | WIRING FORMING MEMBER, METHOD FOR FORMING WIRING LAYER, AND WIRING FORMED MEMBER | 株式会社レゾナック | 2024-07-18 | — | — | WO | disclosed |
| EP-4394000-A1 | THERMOSETTING RESIN COMPOSITION AND HEAT CURED PRODUCT | Polyplastics-Evonik Corporation (JP) | 2024-07-03 | — | — | EP | disclosed |
| US-20240092958-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE, METAL-CLAD LAMINATE, PRINTED WIRING BOARD, AND HIGH-SPEED COMMUNICATION COMPATIBLE MODULE | RESONAC CORPORATION (JP) | 2024-03-21 | — | — | US | disclosed |
| WO-2023152838-A1 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND WIRING FORMING MEMBER | 株式会社レゾナック | 2023-08-17 | — | — | WO | disclosed |
| WO-2023153445-A1 | MEMBER FOR FORMING WIRING, METHOD FOR FORMING WIRING LAYER USING MEMBER FOR FORMING WIRING, AND FORMED WIRING MEMBER | 株式会社レゾナック | 2023-08-17 | — | — | WO | disclosed |
| WO-2020166212-A1 | CURABLE RESIN COMPOSITION, CURED PRODUCT, ACID-MODIFIED MALEIMIDE RESIN, AND CURING AGENT | DIC株式会社 | 2020-08-20 | — | — | WO | disclosed |
| EP-2412743-B1 | THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME | HITACHI CHEMICAL CO LTD (JP) | 2020-08-19 | — | — | EP | disclosed |
| US-10119047-B2 | Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2018-11-06 | — | — | US | disclosed |
| US-20150203715-A1 | Thermosetting Resin Composition, and Prepreg, Insulating Film With Support, Laminate Plate, and Printed Wiring Board, Each Obtained Using Same | RESONAC CORPORATION (JP) | 2015-07-23 | — | — | US | disclosed |
| US-8735733-B2 | Resin composition, prepreg laminate obtained with the same and printed-wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2014-05-27 | — | — | US | disclosed |
| EP-2666825-A1 | RESIN COMPOSITION, AND PRINTED WIRING BOARD, LAMINATED SHEET, AND PREPREG USING SAME | Hitachi Chemical Co., Ltd. (JP) | 2013-11-27 | — | — | EP | disclosed |
| US-20120247820-A1 | RESIN COMPOSITION, PREPREG LAMINATE OBTAINED WITH THE SAME AND PRINTED-WIRING BOARD | RESONAC CORPORATION (JP) | 2012-10-04 | — | — | US | disclosed |
| US-20120077401-A1 | RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2012-03-29 | — | — | US | disclosed |
| EP-2412743-A1 | THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME | Hitachi Chemical Company, Ltd. (JP) | 2012-02-01 | — | — | EP | disclosed |