SCHEMBL486858

SCHEMBL486858

Nc1cccc(Cc2ccccc2Cc2cccc(N)c2)c1

nearest known ligand 0.59

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MAOB P27338 3/20 0.59
MAOA P21397 3/20 0.59
CYP19A1 P11511 1/20 0.52
CYP3A4 P08684 1/20 0.48
CASP1 P29466 1/20 0.48
RECQL P46063 1/20 0.48
HTR2A P28223 1/20 0.47
CA1 P00915 2/20 0.46
CA2 P00918 2/20 0.46
CA9 Q16790 2/20 0.46
SIGMAR1 Q99720 1/20 0.41
CYP11B1 P15538 1/20 0.41
CYP11B2 P19099 1/20 0.41
BCL2 P10415 1/20 0.40
BCL2L1 Q07817 1/20 0.40
PARP1 P09874 1/20 0.40
ALDH1A1 P00352 2/20 0.39
CA12 O43570 1/20 0.39
CA7 P43166 1/20 0.39
TDP1 Q9NUW8 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL841645 0.90 MAOB (0.53) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL28158901 0.88 MAOB (0.52) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL27369620 0.86 HSPA5 (0.54) MAOBMAOACYP19A1CYP3A4CA1
SCHEMBL30583096 0.85 MAOB (0.62) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL49433 0.85 MAOB (0.62) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL399652 0.84 MAOB (0.68) MAOBMAOACYP19A1CYP3A4CASP1
Hydrochloric Acid SCHEMBL10936113 0.83 MAOB (0.64) MAOBMAOACYP19A1CYP3A4CASP1
Hydrochloric Acid SCHEMBL8644377 0.83 MAOB (0.64) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL9719335 0.83 MAOB (0.60) MAOBMAOACYP19A1CYP3A4CASP1
SCHEMBL9253121 0.82 MAOB (0.55) MAOBMAOACYP19A1CYP3A4CASP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2412743-B1 THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME HITACHI CHEMICAL CO LTD (JP) 2020-08-19 EP disclosed
US-10119047-B2 Thermosetting resin composition, and prepreg, insulating film with support, laminate plate, and printed wiring board, each obtained using same HITACHI CHEMICAL COMPANY, LTD. (JP) 2018-11-06 US disclosed
US-20150203715-A1 Thermosetting Resin Composition, and Prepreg, Insulating Film With Support, Laminate Plate, and Printed Wiring Board, Each Obtained Using Same RESONAC CORPORATION (JP) 2015-07-23 US disclosed
US-20130330563-A1 MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME HITACHI CHEMICAL COMPANY, LTD. (JP) 2013-12-12 US disclosed
EP-2666804-A1 MODIFIED SILICONE COMPOUND, AND THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE PLATE AND PRINTED WIRING BOARD USING SAME Hitachi Chemical Co., Ltd. (JP) 2013-11-27 EP disclosed
US-20120077401-A1 RESIN COMPOSITION FOR PRODUCTION OF CLAD LAYER, RESIN FILM FOR PRODUCTION OF CLAD LAYER UTILIZING THE RESIN COMPOSITION, AND OPTICAL WAVEGUIDE AND OPTICAL MODULE EACH UTILIZING THE RESIN COMPOSITION OR THE RESIN FILM HITACHI CHEMICAL COMPANY, LTD. (JP) 2012-03-29 US disclosed
EP-2412743-A1 THERMOSETTING RESIN COMPOSITION, AND PREPREG, INSULATING FILM WITH SUPPORT, LAMINATE PLATE, AND PRINTED WIRING BOARD, EACH OBTAINED USING SAME Hitachi Chemical Company, Ltd. (JP) 2012-02-01 EP disclosed