SCHEMBL4871049

SCHEMBL4871049

CCCCCCCCOC(=O)C(C)(S)S.CCCC[Sn]CCCC

nearest known ligand 0.44

Predicted protein targets (top 14)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.44
EPHX1 P07099 1/20 0.42
TSHR P16473 3/20 0.41
HCAR2 Q8TDS4 1/20 0.39
RAD52 P43351 1/20 0.39
NPSR1 Q6W5P4 1/20 0.39
ALDH1A1 P00352 2/20 0.39
NPC1 O15118 1/20 0.39
MAPT P10636 1/20 0.39
RAB9A P51151 1/20 0.39
FAAH O00519 1/20 0.38
LMNA P02545 1/20 0.38
ACHE P22303 6/20 0.38
HTR2C P28335 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29151164 0.84 NAAA (0.42) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL2464360 0.81 NAAA (0.52) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL28443270 0.79 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL4679753 0.79 NAAA (0.53) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL4676466 0.77 NAAA (0.50) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL28647382 0.77 NAAA (0.56) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL5728047 0.77 NAAA (0.56) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL28678280 0.77 NAAA (0.47) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL11145744 0.77 NAAA (0.56) NAAAEPHX1TSHRHCAR2RAD52
SCHEMBL11602466 0.77 NAAA (0.56) NAAAEPHX1TSHRHCAR2RAD52

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7449519-B2 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2008-11-11 US disclosed
US-20060079605-A1 Curing resin, method for producing same and curing resin composition KONISHI CO., LTD. (JP) 2006-04-13 US disclosed
EP-1616886-A1 CURING RESIN, METHOD FOR PRODUCING SAME AND CURING RESIN COMPOSITION Konishi Co., Ltd. (JP) 2006-01-18 EP disclosed