SCHEMBL487223

SCHEMBL487223

Nc1nc(-c2ccccc2)nc(N(CO)CO)n1

nearest known ligand 0.58

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ADORA2A P29274 7/20 0.58
ADORA1 P30542 7/20 0.58
ADORA3 P0DMS8 4/20 0.58
ADORA2B P29275 2/20 0.58
POLB P06746 1/20 0.58
TSHR P16473 2/20 0.53
ALOX15 P16050 1/20 0.53
NPSR1 Q6W5P4 2/20 0.46
HSP90AA1 P07900 1/20 0.46
HSP90AB1 P08238 1/20 0.46
MEN1 O00255 2/20 0.44
KMT2A Q03164 2/20 0.44
HTT P42858 1/20 0.44
SMN1; SMN2 Q16637 2/20 0.44
MAPT P10636 2/20 0.44
HTR1A P08908 1/20 0.42
GPR68 Q15743 1/20 0.42
HRH4 Q9H3N8 1/20 0.41
DPP4 P27487 1/20 0.39
ALDH1A1 P00352 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL197197 0.88 MEN1 (0.42) ADORA2AADORA1ADORA3ADORA2BPOLB
SCHEMBL11540843 0.80 ADORA2A (0.50) ADORA2AADORA1ADORA3ADORA2BPOLB
SCHEMBL13140697 0.80 ADORA2A (0.53) ADORA2AADORA1ADORA3ADORA2BPOLB
SCHEMBL31055391 0.80 ADORA2A (0.53) ADORA2AADORA1ADORA3ADORA2BPOLB
SCHEMBL14662826 0.80 ADORA2A (0.53) ADORA2AADORA1ADORA3ADORA2BPOLB
SCHEMBL9064816 0.79 ADORA2A (0.67) ADORA2AADORA1ADORA3ADORA2BPOLB
SCHEMBL18649110 0.79 KMT2A (0.39) ADORA2AADORA1ADORA3ADORA2BPOLB
SCHEMBL7608701 0.77 SMN1; SMN2 (0.69) ADORA2AADORA1ADORA3ADORA2BPOLB
SCHEMBL17960899 0.77 ADORA2A (0.50) ADORA2AADORA1ADORA3ADORA2BPOLB
Benzoguanamine SCHEMBL17477302 0.77 ADORA2A (0.76) ADORA2AADORA1ADORA3ADORA2BPOLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 85 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-3045662-A None JP disclosed
CN-117940516-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device 富士胶片株式会社 2024-04-26 CN disclosed
CN-117881745-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and compound 富士胶片株式会社 2024-04-12 CN disclosed
CN-117836715-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and alkali generator 富士胶片株式会社 2024-04-05 CN disclosed
CN-117751326-A Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device 富士胶片株式会社 2024-03-22 CN disclosed
CN-117730280-A Method for producing cured product, method for producing laminate, method for producing semiconductor device, resin composition, cured product, laminate, and semiconductor device 富士胶片株式会社 2024-03-19 CN disclosed
CN-117715982-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device 富士胶片株式会社 2024-03-15 CN disclosed
CN-117642442-A Resin composition, cured product, laminate, method for producing cured product, method for producing laminate, method for producing semiconductor device, and semiconductor device 富士胶片株式会社 2024-03-01 CN disclosed
CN-117295794-A Resin composition, cured product, laminate, method for producing cured product, semiconductor device, and compound 富士胶片株式会社 2023-12-26 CN disclosed
CN-117203265-A Resin composition, cured product, laminate, method for producing cured product, semiconductor device, and resin 富士胶片株式会社 2023-12-08 CN disclosed
EP-0421027-B1 Use of a thermosetting covering sheet for forming hard coatings on the surface of substrates SEIKISUI CHEMICAL CO LTD (JP) 1994-07-27 EP disclosed
US-5312868-A Reactive acrylic resin and blocked isocyanates SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1994-05-17 US disclosed
EP-0421027-A1 Use of a thermosetting covering sheet for forming hard coatings on the surface of substrates SEKISUI KAGAKU KOGYO KABUSHIKI KAISHA (JP) 1991-04-10 EP disclosed
JP-H0345662-A PIGMENT DISPERSANT, PIGMENT COMPOSITION, PAINT, AND PRINTING INK TOYO INK MFG CO LTD 1991-02-27 JP disclosed
EP-0377998-A2 Injection-molding thermosetting resin composition MITSUI TOATSU CHEMICALS, Inc. (JP) 1990-07-18 EP disclosed
US-4322508-A High solids paint composition comprising hydroxy functional oligoesters and hydroxy functional copolymers FORD MOTOR COMPANY (US) 1982-03-30 US disclosed
US-4292417-A CROSSLINKED SULFATED POLYETHER DAICEL LTD. (JP) 1981-09-29 US disclosed
US-4200726-A Semipermeable membrane of phenoxy resin containing sulfuric acid groups or salts thereof DAICEL LTD. (JP) 1980-04-29 US disclosed
US-4024100-A BENZOGUANAMINE, POLYESTER BAYER AKTIENGESELLSCHAFT (DT) 1977-05-17 US disclosed
US-4002699-A ACRYLIC POLYMER AS FLOW CONTROL AGENT FORD MOTOR COMPANY (US) 1977-01-11 US disclosed