SCHEMBL487362

SCHEMBL487362

CCN(O)C(C)=O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Acetic Acid SCHEMBL28644577 0.94 FFAR3 (0.41)
SCHEMBL1156661 0.76 MMP2 (0.36)
SCHEMBL5136363 0.75
SCHEMBL6158040 0.73
SCHEMBL1230800 0.73
SCHEMBL23879796 0.71 TDP1 (0.45)
SCHEMBL2221793 0.71
SCHEMBL11277722 0.71
SCHEMBL2107536 0.71
SCHEMBL691954 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 90 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12448545-B2 Silicon carbide (SIC) wafer polishing with slurry formulation and process ARACA, INC. (US) 2025-10-21 US claimed
US-20250101261-A1 CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND SYSTEMS AND METHODS FOR POLISHING SUBSTRATE USING THE SAME ARACA, INC. 2025-03-27 US claimed
EP-4449481-A1 CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND SYSTEMS AND METHODS FOR POLISHING SUBSTRATE USING THE SAME Araca, Inc. (US) 2024-10-23 EP claimed
US-20240191101-A1 SILICON CARBIDE (SIC) WAFER POLISHING WITH SLURRY FORMULATION AND PROCESS ARACA, INC. 2024-06-13 US claimed
EP-4305118-A1 SILICON CARBIDE (SIC) WAFER POLISHING WITH SLURRY FORMULATION AND PROCESS Araca, Inc. (US) 2024-01-17 EP claimed
CN-116875130-A Fireproof matte black coating with high chemical resistance and preparation method thereof 千浪化研新材料(上海)有限公司 2023-10-13 CN claimed
WO-2023149925-A1 CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND SYSTEMS AND METHODS FOR POLISHING SUBSTRATE USING THE SAME ARACA, INC. (US) 2023-08-10 WO claimed
WO-2022240842-A1 SILICON CARBIDE (SIC) WAFER POLISHING WITH SLURRY FORMULATION AND PROCESS ARACA, INC. (US) 2022-11-17 WO claimed
EP-0559677-B1 HYDROXAMIC ACIDS FOR PREVENTING REPERFUSION INJURY BRITISH TECH GROUP (GB) 1996-09-11 EP claimed
US-5506266-A CONTROLS FREE RADICAL INDUCED DAMAGE ARISING FROM MYOCARDIAL INFRACTION OR STROKE, PERTICULARYL HEART DAMAGE BRITISH TECHNOLOGY GROUP LIMITED (GB) 1996-04-09 US claimed
EP-0559677-A1 HYDROXAMIC ACIDS FOR PREVENTING REPERFUSION INJURY. BRITISH TECH GROUP (GB) 1993-09-15 EP claimed
WO-1992008453-A1 HYDROXAMIC ACIDS FOR PREVENTING REPERFUSION INJURY BRITISH TECHNOLOGY GROUP LTD (GB) 1992-05-29 WO claimed
US-20260035597-A1 SILICON CARBIDE (SIC) WAFER POLISHING WITH SLURRY FORMULATION AND PROCESS ARACA INC (US) 2026-02-05 US disclosed
US-12448545-B2 Silicon carbide (SIC) wafer polishing with slurry formulation and process ARACA, INC. (US) 2025-10-21 US disclosed
US-20250101261-A1 CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND SYSTEMS AND METHODS FOR POLISHING SUBSTRATE USING THE SAME ARACA, INC. 2025-03-27 US disclosed
EP-4449481-A1 CHEMICAL MECHANICAL PLANARIZATION SLURRY PROCESSING TECHNIQUES AND SYSTEMS AND METHODS FOR POLISHING SUBSTRATE USING THE SAME Araca, Inc. (US) 2024-10-23 EP disclosed
EP-0026675-B1 1-AZAXANTHONE-3-CARBOXYLIC ACIDS, THEIR PREPARATION AND PHARMACEUTICAL COMPOSITIONS CONTAINING THEM Takeda Chemical Industries, Ltd. (JP) 1984-03-14 EP disclosed
US-4334097-A Process for the preparation of N-α-alkoxyalkyl-carboxamides, and some representatives of this class of compounds and secondary products obtained therefrom HOECHST AKTIENGESELLSCHAFT (DE) 1982-06-08 US disclosed
US-4302463-A ANTIALLERGENS TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) 1981-11-24 US disclosed
EP-0026675-A1 1-Azaxanthone-3-carboxylic acids, their preparation and pharmaceutical compositions containing them Takeda Chemical Industries, Ltd. (JP) 1981-04-08 EP disclosed