SCHEMBL4881278

SCHEMBL4881278

CCI.Oc1ccccc1C=Cc1ccc2ccccc2n1

nearest known ligand 0.83

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ ECE2 P0DPD6 2/20 0.83
▸ NPC1 O15118 10/20 0.56
▸ RAB9A P51151 9/20 0.56
▸ SMN1; SMN2 Q16637 6/20 0.56
▸ L3MBTL1 Q9Y468 3/20 0.56
▸ PKM P14618 2/20 0.56
▸ NFKB1 P19838 1/20 0.56
▸ NFKB2 Q00653 1/20 0.56
▸ RELA Q04206 1/20 0.56
▸ MEN1 O00255 7/20 0.52
▸ KMT2A Q03164 7/20 0.52
▸ MAPT P10636 6/20 0.52
▸ KDM4E B2RXH2 6/20 0.52
▸ LMNA P02545 5/20 0.52
▸ ALDH1A1 P00352 3/20 0.52
▸ MAPK1 P28482 2/20 0.50
▸ CYSLTR2 Q9NS75 1/20 0.49
▸ CYSLTR1 Q9Y271 1/20 0.49
▸ HTT P42858 2/20 0.49
▸ CYP1A2 P05177 1/20 0.49

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10325190 0.91 ECE2 (1.00) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1
SCHEMBL31060773 0.91 ECE2 (1.00) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1
SCHEMBL10325191 0.91 ECE2 (1.00) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1
SCHEMBL15549880 0.91 ECE2 (1.00) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1
SCHEMBL30163114 0.91 ECE2 (1.00) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1
Hydrochloric Acid SCHEMBL15550705 0.90 ECE2 (0.97) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1
Hydrochloric Acid SCHEMBL15550704 0.90 ECE2 (0.97) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1
SCHEMBL9867671 0.81 ECE2 (0.79) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1
SCHEMBL9867682 0.81 ECE2 (0.79) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1
SCHEMBL15548940 0.77 ECE2 (0.72) ECE2NPC1RAB9ASMN1; SMN2L3MBTL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080171440-A1 Pre-polishing treatment solution for interconnect substrate, polishing method, and method and apparatus for manufacturing interconnect substrate EBARA CORPORATION (JP) 2008-07-17 — — US disclosed
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