SCHEMBL4882973

SCHEMBL4882973

CCC(CC)(C(=O)O)C(=O)O.CCC(CC)(C(=O)O)C(=O)O.CCC(CC)(C(=O)O)C(=O)O.[AlH3]

nearest known ligand 0.40

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
FFAR3 O14843 2/20 0.39
ALDH1A1 P00352 5/20 0.37
MEN1 O00255 2/20 0.37
CYP1A2 P05177 2/20 0.37
KMT2A Q03164 2/20 0.37
THRB P10828 1/20 0.37
TSHR P16473 3/20 0.37
CYP2D6 P10635 1/20 0.35
CYP2C19 P33261 1/20 0.35
HIF1A Q16665 1/20 0.35
HDAC3 O15379 1/20 0.33
HDAC1 Q13547 1/20 0.33
HDAC2 Q92769 1/20 0.33
HDAC8 Q9BY41 1/20 0.33
GRM2 Q14416 1/20 0.32
GRM3 Q14832 1/20 0.32
TDP1 Q9NUW8 2/20 0.32
TP53 P04637 1/20 0.32
ARG1 P05089 1/20 0.31
ARG2 P78540 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11203689 1.00 FFAR3 (0.39) FFAR3ALDH1A1MEN1CYP1A2KMT2A
SCHEMBL51201 0.97 FFAR3 (0.41) FFAR3ALDH1A1MEN1CYP1A2KMT2A
Hydrochloric Acid SCHEMBL8053454 0.93 FFAR3 (0.39) FFAR3ALDH1A1MEN1CYP1A2KMT2A
SCHEMBL9489101 0.93 FFAR3 (0.39) FFAR3ALDH1A1MEN1CYP1A2KMT2A
Hydrochloric Acid SCHEMBL808883 0.93 FFAR3 (0.39) FFAR3ALDH1A1MEN1CYP1A2KMT2A
SCHEMBL3673385 0.93 ALDH1A1 (0.39) FFAR3ALDH1A1MEN1CYP1A2KMT2A
SCHEMBL104624 0.93 FFAR3 (0.39) FFAR3ALDH1A1MEN1CYP1A2KMT2A
SCHEMBL17818653 0.93 FFAR3 (0.39) FFAR3ALDH1A1MEN1CYP1A2KMT2A
SCHEMBL4382923 0.93 FFAR3 (0.39) FFAR3ALDH1A1MEN1CYP1A2KMT2A
SCHEMBL28746064 0.93 FFAR3 (0.39) FFAR3ALDH1A1MEN1CYP1A2KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 16 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3514822-B1 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE TORAY INDUSTRIES (JP) 2023-04-26 EP disclosed
US-11094899-B2 Method for manufacturing field effect transistor and method for manufacturing wireless communication device TORAY INDUSTRIES, INC. 2021-08-17 US disclosed
EP-3514822-A1 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE Toray Industries, Inc. (JP) 2019-07-24 EP disclosed
US-20190198786-A1 METHOD FOR MANUFACTURING FIELD EFFECT TRANSISTOR AND METHOD FOR MANUFACTURING WIRELESS COMMUNICATION DEVICE TORAY INDUSTRIES, INC. (JP) 2019-06-27 US disclosed
US-8431681-B2 Polyester modified vinyl polymer with organometallic compound and organosilicon compound ORIGIN ELECTRIC COMPANY, LIMITED (JP) 2013-04-30 US disclosed
US-20080199705-A1 COATING COMPOSITION AND COAT ARTICLE COATED THEREWITH ORIGIN ELECTRIC COMPANY, LIMITED (JP) 2008-08-21 US disclosed
US-4816496-A HEAT AND LIGHT RESISTANT ADHESIVES AND FILMS KABUSHIKI KAISHA TOSHIBA (JP) 1989-03-28 US disclosed
EP-0091131-B1 PHOTO-CURABLE EPOXY RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1988-07-20 EP disclosed
EP-0103305-B1 PHOTO-CURABLE EPOXY RESIN COMPOSITION KABUSHIKI KAISHA TOSHIBA (JP) 1987-07-22 EP disclosed
US-4495042-A Photo-curable epoxy resin composition TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1985-01-22 US disclosed
US-4479860-A ORGANOALUMINUM COMPOUND AND PEROXYSILYL COMPOUND AS HARDENING CATALYST TOKYO SHIBAURA DENKI KABUSHIKI KAISHA (JP) 1984-10-30 US disclosed
EP-0103305-A1 Photo-curable epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1984-03-21 EP disclosed
EP-0091131-A2 Photo-curable epoxy resin composition KABUSHIKI KAISHA TOSHIBA (JP) 1983-10-12 EP disclosed
US-4359566-A CONTAINING A SILOXANE COPOLYMER OF PHENYL SILOXANE AND DIMETHYL SILOXANE DOW CORNING CORPORATION (US) 1982-11-16 US disclosed
EP-0056706-A2 Silicone-epoxy coating compositions DOW CORNING CORPORATION (US) 1982-07-28 EP disclosed
WO-1982002392-A1 SILICONE-EPOXY COATING COMPOSITIONS DOW CORNING (US) 1982-07-22 WO disclosed