⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL15116682 | 0.80 | — | — | |
| SCHEMBL29255968 | 0.80 | TSHR (0.35) | — | |
| SCHEMBL13039796 | 0.80 | SLC1A3 (0.39) | — | |
| SCHEMBL13611203 | 0.80 | — | — | |
| SCHEMBL4661109 | 0.78 | — | — | |
| SCHEMBL27757059 | 0.76 | TSHR (0.38) | — | |
| SCHEMBL1786098 | 0.76 | SLC1A3 (0.36) | — | |
| SCHEMBL11326280 | 0.72 | TSHR (0.46) | — | |
| SCHEMBL9716580 | 0.72 | SLC1A3 (0.33) | — | |
| SCHEMBL1784785 | 0.72 | SLC1A3 (0.38) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-102799070-B | Double coating negative photoresist dry film | ZHUHAI NENGDONG TECHNOLOGY OPTICAL INDUSTRY CO LTD | 2014-03-05 | — | — | CN | disclosed |
| CN-102799070-A | Double coating negative photoresist dry film | ZHUHAI NENGDONG TECHNOLOGY OPTICAL INDUSTRY CO LTD | 2012-11-28 | — | — | CN | disclosed |
| US-20080081054-A1 | Aqueous Nail Polish Film | L'OREAL (FR) | 2008-04-03 | — | — | US | disclosed |
| US-5140079-A | Latent, curable, catalyzed mixtures of epoxy-containing and phenolic-hydroxyl-containing compounds containing compounds or complexes formed from contacting organic phosphines or arsines with weak nucleophilic acids | THE DOW CHEMICAL COMPANY (US) | 1992-08-18 | — | — | US | disclosed |
| EP-0443351-A2 | Latent,curable catalyzed mixtures of epoxy-containing and phenolic hydroxyl-containing compounds containing compounds or complexes formed from contacting organic phosphines or arsines with weak nucleophilic acids | THE DOW CHEMICAL COMPANY (US) | 1991-08-28 | — | — | EP | disclosed |
| CN-1053924-A | Compound or title complex that organic phosphine or arsine and weak nucleophilic acids form, what contain them contains epoxy compounds and phenolic hydroxyl compound compositions | DOW CHEMICAL CO (US) | 1991-08-21 | — | — | CN | disclosed |
| US-4252530-A | USING A BASE AS DISCHARGE AGENT IN A DISCHARGE RESIST PASTE AND HEATING | CASSELLA AKTIENGESELLSCHAFT (DE) | 1981-02-24 | — | — | US | disclosed |