Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.62 |
| ▸ | TP53 | P04637 | 3/20 | 0.62 |
| ▸ | TSHR | P16473 | 3/20 | 0.62 |
| ▸ | HIF1A | Q16665 | 2/20 | 0.62 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.62 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.62 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.55 |
| ▸ | MAPT | P10636 | 4/20 | 0.51 |
| ▸ | HPGD | P15428 | 2/20 | 0.51 |
| ▸ | MEN1 | O00255 | 2/20 | 0.51 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.51 |
| ▸ | PKM | P14618 | 2/20 | 0.51 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.51 |
| ▸ | PPARG | P37231 | 1/20 | 0.51 |
| ▸ | LMNA | P02545 | 1/20 | 0.51 |
| ▸ | GAA | P10253 | 1/20 | 0.51 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.50 |
| ▸ | GLA | P06280 | 1/20 | 0.50 |
| ▸ | FGFR1 | P11362 | 1/20 | 0.48 |
| ▸ | SRC | P12931 | 1/20 | 0.48 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL18812785 | 0.94 | ALDH1A1 (0.56) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL18812737 | 0.92 | ALDH1A1 (0.58) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL7144482 | 0.92 | ALDH1A1 (0.57) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL18812779 | 0.90 | ALDH1A1 (0.60) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL18812888 | 0.88 | ALDH1A1 (0.66) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL18812740 | 0.88 | ALDH1A1 (0.53) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL730580 | 0.87 | ALDH1A1 (0.65) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL18812744 | 0.86 | ALDH1A1 (0.62) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL11871495 | 0.84 | ALDH1A1 (0.62) | ALDH1A1TP53TSHRHIF1ACYP3A4 | |
| SCHEMBL30277376 | 0.84 | ALDH1A1 (0.62) | ALDH1A1TP53TSHRHIF1ACYP3A4 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 19 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0384774-B1 | Semiconductor device encapsulant | TOSHIBA KK (JP) | 1997-01-22 | — | — | EP | claimed |
| EP-3165549-B1 | EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THEREOF AND ELECTRONIC MEMBER | DAINIPPON INK & CHEMICALS (JP) | 2021-06-16 | — | — | EP | disclosed |
| US-20170158807-A1 | EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THEREOF AND ELECTRONIC MEMBER | DIC CORPORATION (JP) | 2017-06-08 | — | — | US | disclosed |
| EP-3165549-A1 | EPOXY RESIN COMPOSITION FOR ELECTRONIC MATERIAL, CURED PRODUCT THEREOF AND ELECTRONIC MEMBER | DIC Corporation (JP) | 2017-05-10 | — | — | EP | disclosed |
| US-20160311967-A1 | EPOXY RESIN, METHOD FOR PRODUCING THE SAME, EPOXY RESIN COMPOSITION, AND CURED PRODUCT THEREOF | DAINIPPON INK & CHEMICALS (JP) | 2016-10-27 | — | — | US | disclosed |
| US-20140099496-A1 | HIGH STRENGTH AND HIGH ELASTICITY COMPOSITE MATERIALS AND METHODS OF REINFORCING SUBSTRATES WITH THE SAME | THE UNIVERSITY OF TENNESSEE RESEARCH FOUNDATION | 2014-04-10 | — | — | US | disclosed |
| US-20080138718-A1 | Holographic optical recording medium, manufacturing method thereof and holographic optical recording method | KABUSHIKI KAISHA TOSHIBA | 2008-06-12 | — | — | US | disclosed |
| US-20050068593-A1 | Holographic optical recording medium, manufacturing method thereof and holographic optical recording method | KABUSHIKI KAISHA TOSHIBA | 2005-03-31 | — | — | US | disclosed |
| US-6632523-B1 | Polyimidesiloxane made from a dianhydride, an aromatic diamine and a siloxanediamine, an epoxy resin, and a cyanate; tape | SUMITOMO BAKELITE COMPANY LIMITED (JP) | 2003-10-14 | — | — | US | disclosed |
| US-6017588-A | Method for reinforcing structures | MITSUBISHI CHEMICAL CORPORATION (JP) | 2000-01-25 | — | — | US | disclosed |
| US-5998509-A | BLEND OF AN EPOXY RESIN, POLYSILOXANE CURING AGENT AND FILLER | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-12-07 | — | — | US | disclosed |
| US-5965663-A | POLYARYLENE POLYETHER WITH CROSSLINKABLE UNSATURATED ENDGROUPS AND LOW CHLORINE AND ALKALI METAL CONTENT; FILLER; AND A COMPOUND OF MOLECULAR WEIGHT 5000 OR LESS HAVING AN UNSATURATED LINKAGE; MOLDABILTY, NON-HYGROSCOPIC | KABUSHIKI KAISHA TOSHIBA (JP) | 1999-10-12 | — | — | US | disclosed |
| EP-0861862-A2 | Method for reinforcing structures | Mitsubishi Chemical Corporation (JP) | 1998-09-02 | — | — | EP | disclosed |
| US-5641997-A | Plastic-encapsulated semiconductor device | KABUSHIKI KAISHA TOSHIBA (JP) | 1997-06-24 | — | — | US | disclosed |
| US-5637667-A | INCLUDES CURING AGENT, POLYSILANE COPOLYMER, AND INORGANIC FILLER | KABUSHIKI KAISHA TOSHIBA (JP) | 1997-06-10 | — | — | US | disclosed |
| EP-0384774-B1 | Semiconductor device encapsulant | TOSHIBA KK (JP) | 1997-01-22 | — | — | EP | disclosed |
| US-5438113-A | Heat and humidity resistant plastics having low internal stresses, for encapsulating semiconductors | KABUSHIKI KAISHA TOSHIBA (JP) | 1995-08-01 | — | — | US | disclosed |
| US-5258426-A | Semiconductor device encapsulant | KABUSHIKI KAISHA TOSHIBA (JP) | 1993-11-02 | — | — | US | disclosed |
| EP-0384774-A2 | Semiconductor device encapsulant | KABUSHIKI KAISHA TOSHIBA (JP) | 1990-08-29 | — | — | EP | disclosed |