Di(Hydroxyethyl)Ether

Di(Hydroxyethyl)Ether

SCHEMBL4892570

CC(N)CN.CC(N)CN.OCCOCCO

nearest known ligand 0.53

Full drug profile on Sugi Atlas →

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.53
ALDH1A1 P00352 2/20 0.53
MAPK1 P28482 1/20 0.53
MEN1 O00255 2/20 0.50
KMT2A Q03164 2/20 0.50
THRB P10828 1/20 0.39
HTT P42858 1/20 0.39
MAPT P10636 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Di(Hydroxyethyl)Ether SCHEMBL12813939 1.00 TSHR (0.53) TSHRALDH1A1MAPK1MEN1KMT2A
Triethylene Glycol SCHEMBL464797 0.97 MEN1 (0.55) TSHRALDH1A1MAPK1MEN1KMT2A
Di(Hydroxyethyl)Ether SCHEMBL16594863 0.82 TSHR (0.50) TSHRALDH1A1MAPK1MEN1KMT2A
SCHEMBL15582455 0.82
Di(Hydroxyethyl)Ether SCHEMBL14054643 0.82 TSHR (0.50) TSHRALDH1A1MAPK1MEN1KMT2A
SCHEMBL28066982 0.80 MEN1 (0.52) TSHRALDH1A1MAPK1MEN1KMT2A
Di(Hydroxyethyl)Ether SCHEMBL15463763 0.80 TSHR (0.71) TSHRALDH1A1MAPK1MEN1KMT2A
Ethylene Glycol SCHEMBL4015715 0.80
SCHEMBL3137828 0.79
SCHEMBL14872240 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20080138718-A1 Holographic optical recording medium, manufacturing method thereof and holographic optical recording method KABUSHIKI KAISHA TOSHIBA 2008-06-12 US disclosed
US-20070210476-A1 Machinable Resin Molded Product, Material For Forming The Same, And Model Made Of The Same SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2007-09-13 US disclosed
EP-1728832-A1 MOLDING OF RESIN FOR CUTTING OPERATION, MATERIAL FOR FORMATION THEREOF AND MODEL Sanyo Chemical Industries, Ltd. (JP) 2006-12-06 EP disclosed
US-6987137-B1 Material for forming resin suitable for cutting, molded resin product as raw material for model, and method for manufacturing model SANYO CHEMICAL INDUSTRIES, LTD. (JP) 2006-01-17 US disclosed
US-20050068593-A1 Holographic optical recording medium, manufacturing method thereof and holographic optical recording method KABUSHIKI KAISHA TOSHIBA 2005-03-31 US disclosed
US-6218482-B1 CONTAINING CYCLOHEXYLENE GROUPS NEW JAPAN CHEMICAL CO., LTD. (JP) 2001-04-17 US disclosed
EP-0695316-B1 URETHANE MODIFIED EPOXY RESIN COMPOSITIONS CIBA GEIGY AG (CH) 1997-12-29 EP disclosed
EP-0702042-A1 EPOXY RESIN, PROCESS FOR PRODUCING THE SAME, AND PHOTOCURABLE RESIN COMPOSITION AND POWDER COATING RESIN COMPOSITION BOTH CONTAINING SAID RESIN NEW JAPAN CHEMICAL CO.,LTD. (JP) 1996-03-20 EP disclosed
EP-0695316-A1 URETHANE MODIFIED EPOXY RESIN COMPOSITIONS Ciba SC Holding AG (CH) 1996-02-07 EP disclosed
WO-1995021879-A1 URETHANE MODIFIED EPOXY RESIN COMPOSITIONS CIBA-GEIGY AG (CH) 1995-08-17 WO disclosed
US-5128428-A Polymer of a maleimide compound and an aminovinylbenzyl compound SHOWA HIGHPOLYMER CO., LTD. (JP) 1992-07-07 US disclosed
US-4950701-A POLYSILOXANE ADHESIVE WITH A AROMATIC AMINE PROMOTER CEMEDINE COMPANY, LTD. (JP) 1990-08-21 US disclosed
US-4793886-A TWO PART-CYANOACRYLATE AND 1,1-DISUBSTITUTED COMPOUND WITH SELF-CURING ADHESIVE CEMEDINE CO., LTD. (JP) 1988-12-27 US disclosed