Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | PRKDC | P78527 | 2/20 | 0.36 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.35 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.35 |
| ▸ | HTT | P42858 | 2/20 | 0.35 |
| ▸ | LMNA | P02545 | 1/20 | 0.35 |
| ▸ | TP53 | P04637 | 1/20 | 0.35 |
| ▸ | MAPT | P10636 | 1/20 | 0.35 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.35 |
| ▸ | ALOX12 | P18054 | 1/20 | 0.35 |
| ▸ | MCL1 | Q07820 | 1/20 | 0.35 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.35 |
| ▸ | NPSR1 | Q6W5P4 | 1/20 | 0.35 |
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.35 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.34 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.34 |
| ▸ | PIK3CD | O00329 | 1/20 | 0.33 |
| ▸ | XRCC6 | P12956 | 1/20 | 0.33 |
| ▸ | XRCC5 | P13010 | 1/20 | 0.33 |
| ▸ | APAF1 | O14727 | 1/20 | 0.33 |
| ▸ | CDC25B | P30305 | 1/20 | 0.33 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10897712 | 0.88 | KDM4E (0.39) | ALDH1A1KDM4ELMNAMAPTSMN1; SMN2 | |
| SCHEMBL19259375 | 0.83 | CYP1A2 (0.41) | ALDH1A1KDM4ETP53MAPTSMN1; SMN2 | |
| Morpholine SCHEMBL11515192 | 0.83 | APEX1 (0.32) | CYP1A2 | |
| SCHEMBL73568 | 0.82 | CYP1A2 (0.40) | ALDH1A1KDM4ETP53MAPTSMN1; SMN2 | |
| SCHEMBL1314570 | 0.82 | CYP1A2 (0.40) | ALDH1A1KDM4ETP53MAPTSMN1; SMN2 | |
| SCHEMBL911163 | 0.82 | CYP1A2 (0.40) | ALDH1A1KDM4ETP53MAPTSMN1; SMN2 | |
| Ammonia Solution, Strong SCHEMBL1035827 | 0.82 | CYP1A2 (0.40) | ALDH1A1KDM4ETP53MAPTSMN1; SMN2 | |
| Phosphine SCHEMBL3288817 | 0.82 | CYP1A2 (0.40) | ALDH1A1KDM4ETP53MAPTSMN1; SMN2 | |
| SCHEMBL445634 | 0.82 | CYP1A2 (0.40) | ALDH1A1KDM4ETP53MAPTSMN1; SMN2 | |
| Hydrogen Sulfide SCHEMBL17372873 | 0.82 | CYP1A2 (0.40) | ALDH1A1KDM4ETP53MAPTSMN1; SMN2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 193 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-119072454-A | Zeolite, method for producing zeolite, composition, liquid sealing agent, resin composite material, sealing material, method for producing sealing material, and electronic device | 三菱化学株式会社 | 2024-12-03 | — | — | CN | disclosed |
| CN-118510843-A | Liquid sealing resin composition and semiconductor device | 松下知识产权经营株式会社 | 2024-08-16 | — | — | CN | disclosed |
| CN-113185807-B | Resin composition for underfill, electronic component device, and method for manufacturing electronic component device | 株式会社力森诺科 | 2024-03-29 | — | — | CN | disclosed |
| CN-113195582-A | Resin composition for sealing and electronic component device | 昭和电工材料株式会社 | 2021-07-30 | — | — | CN | disclosed |
| EP-2557121-B1 | RESIN COMPOSITION, PREPREG AND LAMINATE | MITSUBISHI GAS CHEMICAL CO (JP) | 2020-03-04 | — | — | EP | disclosed |
| CN-105418970-B | Inorganic filler and composition epoxy resin comprising the inorganic filler | LG伊诺特有限公司 | 2019-10-18 | — | — | CN | disclosed |
| CN-106024654-B | Semiconductor device | 日立化成株式会社 | 2019-07-02 | — | — | CN | disclosed |
| EP-2662395-B1 | Epoxy resin, epoxy resin compound comprising the same, and radiant heat circuit board using the compound | LG INNOTEK CO LTD (KR) | 2019-06-26 | — | — | EP | disclosed |
| CN-105461921-B | Polyimide resin composition, adhesive compound, paint base composition, laminated body and the copper foil with resin | 荒川化学工业株式会社 | 2019-05-10 | — | — | CN | disclosed |
| CN-105874028-B | Printing distributing board adhesive composite, plywood and flexible printing patch panel | 荒川化学工业株式会社 | 2019-04-26 | — | — | CN | disclosed |
| EP-1273608-A1 | FLAME-RETARDANT EPOXY RESIN COMPOSITION, MOLDED OBJECT THEREOF, AND ELECTRONIC PART | OTSUKA KAGAKU KABUSHIKI KAISHA (JP) | 2003-01-08 | — | — | EP | disclosed |
| US-6495270-B1 | ADDITION PRODUCT OF A HETEROCYCLIC AMIDINE AND A QUINONE IS ACCELERATOR; ENCAPSULATION OF ELECTRONIC COMPONENT PARTS; RAPID CURABILITY, CURABILITY AFTER MOISTURE ABSORPTION UNDER MOIST CONDITION, POT LIFE AND FLOW PROPERTIES | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2002-12-17 | — | — | US | disclosed |
| CN-1383446-A | Resin compsn. for electric and electronic appliances | KYOWA CHEM IND CO LTD (JP) | 2002-12-04 | — | — | CN | disclosed |
| EP-1114834-B1 | EPOXY RESIN COMPOSITION AND PROCESS FOR PRODUCING SILANE-MODIFIED EPOXY RESIN | ARAKAWA CHEM IND (JP) | 2002-10-16 | — | — | EP | disclosed |
| US-6441106-B1 | CURING AGENT FOR EPOXY RESIN COMPRISING A SILOXANE-MODIFIED PHENOLIC RESIN OBTAINED BY DEALCOHOLIZATION CONDENSATION BETWEEN A PHENOLIC RESIN AND A HYDROLYZABLE ALKOXYSILANE SUCH AS A POLYSILICATE | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2002-08-27 | — | — | US | disclosed |
| CN-1318077-A | Partial condensate of alkoxysilane containing glycidyl ether group, silane-modified resin, composition thereof and process for producing the same | ARAKAWA CHEM IND (JP) | 2001-10-17 | — | — | CN | disclosed |
| EP-1123944-A1 | GLYCIDYL ETHER GROUP-CONTAINING PARTIAL ALKOXYSILANE CONDENSATE, SILANE-MODIFIED RESIN, COMPOSITIONS OF THESE, AND PROCESSES FOR PRODUCING THESE | ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) | 2001-08-16 | — | — | EP | disclosed |
| EP-1114834-A1 | EPOXY RESIN COMPOSITION AND PROCESS FOR PRODUCING SILANE-MODIFIED EPOXY RESIN | Arakawa Chemical Industries, Ltd. (JP) | 2001-07-11 | — | — | EP | disclosed |
| EP-1086972-A1 | HARDENER FOR EPOXY RESIN, EPOXY RESIN COMPOSITION, AND PROCESS FOR PRODUCING SILANE-MODIFIED PHENOLIC RESIN | Arakawa Chemical Industries, Ltd. (JP) | 2001-03-28 | — | — | EP | disclosed |
| EP-1057817-A1 | NOVEL COMPOUNDS, HARDENING ACCELERATOR, RESIN COMPOSITION, AND ELECTRONIC PART DEVICE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2000-12-06 | — | — | EP | disclosed |