⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methyl Alcohol SCHEMBL22394613 | 0.95 | — | — | |
| SCHEMBL239230 | 0.87 | — | — | |
| SCHEMBL8746924 | 0.87 | — | — | |
| SCHEMBL20158772 | 0.85 | — | — | |
| SCHEMBL734135 | 0.85 | — | — | |
| SCHEMBL24412331 | 0.85 | — | — | |
| SCHEMBL3379348 | 0.79 | — | — | |
| SCHEMBL27176752 | 0.79 | MEN1 (0.35) | — | |
| SCHEMBL23781517 | 0.77 | MEN1 (0.35) | — | |
| SCHEMBL13301296 | 0.77 | EPHX2 (0.33) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 24 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-114276768-B | Low-modulus high-strength fast-curing conductive adhesive and preparation method thereof | 烟台德邦科技股份有限公司 | 2023-05-23 | — | — | CN | claimed |
| CN-114276768-B | Low-modulus high-strength fast-curing conductive adhesive and preparation method thereof | 烟台德邦科技股份有限公司 | 2023-05-23 | — | — | CN | disclosed |
| CN-115605527-A | Novel epoxy resin and epoxy resin composition | 株式会社大赛璐（JP） | 2023-01-13 | — | — | CN | disclosed |
| CN-115135697-A | Process for producing polythioether compound | 株式会社大赛璐 | 2022-09-30 | — | — | CN | disclosed |
| CN-114479010-A | Molded epoxy resin article having special shape, and optical device provided with same | 株式会社大赛璐 | 2022-05-13 | — | — | CN | disclosed |
| CN-114276768-A | Low-modulus, high-strength and fast-curing conductive adhesive and preparation method thereof | 烟台德邦科技股份有限公司 | 2022-04-05 | — | — | CN | disclosed |
| CN-114096484-A | Surface-modified nanodiamond, nanodiamond dispersion composition, and method for producing surface-modified nanocarbon particles | 株式会社大赛璐 | 2022-02-25 | — | — | CN | disclosed |
| CN-107849222-B | Curable composition and cured product thereof | 株式会社大赛璐 | 2021-06-11 | — | — | CN | disclosed |
| CN-109400847-B | Curable composition for lens, and optical device | 株式会社大赛璐 | 2021-05-18 | — | — | CN | disclosed |
| CN-107922587-B | Curable composition and optical element using same | 株式会社大赛璐 | 2020-12-25 | — | — | CN | disclosed |
| EP-3006481-A1 | CURABLE COMPOSITION FOR SEALING OPTICAL SEMICONDUCTOR | Daicel Corporation (JP) | 2016-04-13 | — | — | EP | disclosed |
| US-20080200475-A1 | 4-Piperazinothieno[2,3-D] Pyrimidine Compounds As Platelet Aggregation Inhibitors | PFIZER INC. | 2008-08-21 | — | — | US | disclosed |
| EP-1866317-A1 | 4-PIPERAZINOTHIENO [2, 3-D] PYRIMIDINE COMPOUNDS AS PLATELET AGGREGATION INHIBITORS | Pharmacia & Upjohn Company LLC (US) | 2007-12-19 | — | — | EP | disclosed |
| US-20070265165-A1 | NOVEL HERBICIDES | SYNGENTA CROP PROTECTION, INC. (US) | 2007-11-15 | — | — | US | disclosed |
| US-20070265165-A1 | NOVEL HERBICIDES | SYNGENTA CROP PROTECTION, INC. (US) | 2007-11-15 | — | — | US | disclosed |
| US-7265230-B2 | For inhibiting undesirable plant growth | SYNGENTA PARTICIPATIONS AG (CH) | 2007-09-04 | — | — | US | disclosed |
| US-7265230-B2 | For inhibiting undesirable plant growth | SYNGENTA PARTICIPATIONS AG (CH) | 2007-09-04 | — | — | US | disclosed |
| WO-2006103555-A1 | 4-PIPERAZINOTHIENO [2, 3-D] PYRIMIDINE COMPOUNDS AS PLATELET AGGREGATION INHIBITORS | PHARMACIA & UPJOHN COMPANY LLC (US) | 2006-10-05 | — | — | WO | disclosed |
| US-4047963-A | ETHYLENE OXIDE COPOLYMER, UNSATURATED MONOMER, PHOTOINITIATOR | HERCULES INCORPORATED (US) | 1977-09-13 | — | — | US | disclosed |
| US-4009128-A | Polymerization of epoxides | HERCULES INCORPORATED (US) | 1977-02-22 | — | — | US | disclosed |