SCHEMBL493756

SCHEMBL493756

CCCCC(CC)CC(CCCCCCCCCC(=O)O)(CC(CC)CCCC)C(=O)O

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
GPR84 Q9NQS5 7/20 0.46
PPARG P37231 7/20 0.46
PPARD Q03181 7/20 0.46
PPARA Q07869 7/20 0.46
HDAC11 Q96DB2 5/20 0.46
TSHR P16473 5/20 0.46
PTPN1 P18031 3/20 0.46
TDP1 Q9NUW8 3/20 0.46
ALDH1A1 P00352 2/20 0.46
TLR2 O60603 2/20 0.46
FABP4 P15090 2/20 0.46
FFAR1 O14842 2/20 0.46
FFAR4 Q5NUL3 2/20 0.46
KMT2A Q03164 2/20 0.46
SLC22A6 Q4U2R8 1/20 0.46
SLC22A8 Q8TCC7 1/20 0.46
MEN1 O00255 1/20 0.46
ESR1 P03372 1/20 0.46
ALOX15 P16050 1/20 0.46
PDE4A P27815 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Sebacic Acid SCHEMBL599180 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL494563 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL495371 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL496109 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL493867 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL107048 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL18786501 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL495135 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL494655 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11
SCHEMBL494550 1.00 GPR84 (0.46) GPR84PPARGPPARDPPARAHDAC11

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-108697092-B Aqueous pest control liquid 住友化学株式会社 2023-11-10 CN claimed
US-6323275-B2 HAVING A LOWERED ADHESION TO THE SKIN TOAGOSEI CO., LTD. (JP) 2001-11-27 US claimed
US-20250197754-A1 LUBRICANT COMPOSITION AND METHOD FOR PRODUCING SAME IDEMITSU KOSAN CO.,LTD. (JP) 2025-06-19 US disclosed
EP-4502117-A1 LUBRICANT COMPOSITION AND METHOD FOR PRODUCING SAME Idemitsu Kosan Co.,Ltd. (JP) 2025-02-05 EP disclosed
WO-2024090400-A1 LUBRICATING OIL COMPOSITION 出光興産株式会社 2024-05-02 WO disclosed
CN-108697092-B Aqueous pest control liquid 住友化学株式会社 2023-11-10 CN disclosed
WO-2023190340-A1 LUBRICANT COMPOSITION AND METHOD FOR PRODUCING SAME 出光興産株式会社 2023-10-05 WO disclosed
CN-112969561-B Vinyl chloride resin composition, vinyl chloride resin molded article, and laminate 日本瑞翁株式会社 2023-04-14 CN disclosed
CN-112969561-A Vinyl chloride resin composition, vinyl chloride resin molded article, and laminate 日本瑞翁株式会社 2021-06-15 CN disclosed
EP-3121227-B1 VINYL CHLORIDE RESIN COMPOSITION, VINYL CHLORIDE RESIN MOLDED PRODUCT AND LAMINATE ZEON CORP (JP) 2020-04-22 EP disclosed
US-20170118977-A1 MITE REPELLENT, AND MITE-REPELLENT RESIN COMPOSITION AND MITE-REPELLENT PRODUCT USING SAME TOAGOSEI CO., LTD. (JP) 2017-05-04 US disclosed
US-7166362-B2 Film-forming composition, production process therefor, and porous insulating film FUJI PHOTO FILM CO., LTD. (JP) 2007-01-23 US disclosed
US-7151127-B2 Use of thermoplastic polyamide molding compositions with reduced formation of solid deposits and/or coverings EMS-CHEMIE AG (CH) 2006-12-19 US disclosed
US-20060148969-A1 Resin composition and molded object formed from the resin composition MITSUBISHI PLASTICS, INC. (JP) 2006-07-06 US disclosed
EP-1674527-A1 FLAME-RETARDANT INJECTION-MOLDED OBJECT MITSUBISHI PLASTICS INC. (JP) 2006-06-28 EP disclosed
EP-1596113-A1 Thermoplastic polyamide moulding matters EMS-Chemie AG (CH) 2005-11-16 EP disclosed
US-20050148728-A1 Use of thermoplastic polyamide moulding compositions with reduced formation of solid deposits and/or coverings EMS-CHEMIE AG (CH) 2005-07-07 US disclosed
EP-1550684-A2 Use of thermoplastic polyamide moulding compositions showing reduced formation of solid deposits EMS-Chemie AG (CH) 2005-07-06 EP disclosed
US-20050074556-A1 Film-forming composition, production process therefor, and porous insulating film FUJI PHOTO FILM CO., LTD. 2005-04-07 US disclosed
US-6323275-B2 HAVING A LOWERED ADHESION TO THE SKIN TOAGOSEI CO., LTD. (JP) 2001-11-27 US disclosed