SCHEMBL4943560

SCHEMBL4943560

CCCCCOC(=O)C(O)(CCCCC)C(O)C(=O)O

nearest known ligand 0.44

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
NAAA Q02083 1/20 0.40
HCAR2 Q8TDS4 2/20 0.39
EPHX1 P07099 1/20 0.38
CA12 O43570 2/20 0.37
CA1 P00915 2/20 0.37
CA2 P00918 2/20 0.37
CA9 Q16790 2/20 0.37
TSHR P16473 2/20 0.37
NPC1 O15118 1/20 0.36
LMNA P02545 1/20 0.36
RAB9A P51151 1/20 0.36
SMN1; SMN2 Q16637 1/20 0.36
GPR84 Q9NQS5 2/20 0.36
CPT2 P23786 1/20 0.36
ACLY P53396 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL422571 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1
SCHEMBL28452967 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1
SCHEMBL9723696 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1
SCHEMBL11219866 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1
SCHEMBL27788489 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1
SCHEMBL23749374 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1
SCHEMBL4270426 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1
SCHEMBL420117 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1
SCHEMBL2289015 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1
SCHEMBL17986645 0.98 NAAA (0.42) NAAAHCAR2EPHX1CA12CA1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 20 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-117402113-A Production method of 8-hydroxyquinoline copper 苏州华道生物药业股份有限公司 2024-01-16 CN claimed
US-20240351957-A1 ADMIXTURE TO CONTROL THE HEAT FLOW FROM MINERAL BINDER COMPOSITIONS, MINERAL BINDER COMPOSITIONS, AND PRODUCTION METHOD THEREOF SIKA TECHNOLOGY AG (CH) 2024-10-24 US disclosed
WO-2024175602-A1 LIGHTWEIGHT CEMENTITIOUS COMPOSITION HAVING KINETIC REGULATOR SIKA TECHNOLOGY AG (CH) 2024-08-29 WO disclosed
WO-2024175610-A1 METHODS FOR THE APPLICATION IN THICK LAYER OF CEMENTITIOUS COMPOSITIONS COMPRISING KINETIC REGULATOR SIKA TECHNOLOGY AG (CH) 2024-08-29 WO disclosed
EP-4417588-A1 LIGHTWEIGHT CEMENTITIOUS COMPOSITION HAVING KINETIC REGULATOR Sika Technology AG (CH) 2024-08-21 EP disclosed
EP-4417587-A1 METHODS FOR THE APPLICATION IN THICK LAYER OF CEMENTITIOUS COMPOSITIONS COMPRISING KINETIC REGULATOR Sika Technology AG (CH) 2024-08-21 EP disclosed
EP-4396150-A1 ADMIXTURE TO CONTROL THE HEAT FLOW FROM MINERAL BINDER COMPOSITIONS, MINERAL BINDER COMPOSITIONS, AND PRODUCTION METHOD THEREOF Sika Technology AG (CH) 2024-07-10 EP disclosed
CN-117677595-A Additive for controlling heat flow from mineral binder composition, mineral binder composition and method for producing the same SIKA技术股份公司 2024-03-08 CN disclosed
CN-117402113-A Production method of 8-hydroxyquinoline copper 苏州华道生物药业股份有限公司 2024-01-16 CN disclosed
WO-2023031273-A1 ADMIXTURE TO CONTROL THE HEAT FLOW FROM MINERAL BINDER COMPOSITIONS, MINERAL BINDER COMPOSITIONS, AND PRODUCTION METHOD THEREOF SIKA TECHNOLOGY AG (CH) 2023-03-09 WO disclosed
EP-4144708-A1 ADMIXTURE TO CONTROL THE HEAT FLOW FROM MINERAL BINDER COMPOSITIONS, MINERAL BINDER COMPOSITIONS, AND PRODUCTION METHOD THEREOF Sika Technology AG (CH) 2023-03-08 EP disclosed
CN-111253242-A Method for preparing olefin by dehydrating and deoxidizing polyhydroxy compound under catalysis of organic molybdenum 中国科学院大连化学物理研究所 2020-06-09 CN disclosed
US-20080000505-A1 Processing of semiconductor components with dense processing fluids AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-01-03 US disclosed
US-20080004194-A1 Processing of semiconductor components with dense processing fluids AIR PRODUCTS AND CHEMICALS, INC. (US) 2008-01-03 US disclosed
US-7267727-B2 Processing of semiconductor components with dense processing fluids and ultrasonic energy AIR PRODUCTS AND CHEMICALS, INC. (US) 2007-09-11 US disclosed
EP-1548810-A2 Processing of semiconductor components with dense processing fluids and ultrasonic energy AIR PRODUCTS AND CHEMICALS, INC. (US) 2005-06-29 EP disclosed
US-20050029492-A1 Processing of semiconductor substrates with dense fluids comprising acetylenic diols and/or alcohols VERSUM MATERIALS US, LLC 2005-02-10 US disclosed
EP-1505146-A1 Processing of substrates with dense fluids comprising acetylenic diols and/or alcohols AIR PRODUCTS AND CHEMICALS, INC. (US) 2005-02-09 EP disclosed
US-20040144399-A1 Processing of semiconductor components with dense processing fluids and ultrasonic energy AIR PRODUCTS AND CHEMICALS, INC. 2004-07-29 US disclosed
WO-1991010372-A1 LOW CALORIE NUTS WITH THE ORGANOLEPTIC CHARACTER OR FULL FAT NUTS NABISCO, INC. (US) 1991-07-25 WO disclosed