SCHEMBL49467

SCHEMBL49467

CO[Si](C)(CCCNc1ccccc1)OC

nearest known ligand 0.55

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
MAPT P10636 3/20 0.55
ALDH1A1 P00352 1/20 0.55
KCNH3 Q9ULD8 5/20 0.42
L3MBTL1 Q9Y468 1/20 0.40
PPARG P37231 1/20 0.38
CYP1A2 P05177 1/20 0.38
CYP3A4 P08684 1/20 0.38
CYP2C19 P33261 1/20 0.38
GAA P10253 1/20 0.37
KDM1A O60341 1/20 0.36
EHMT2 Q96KQ7 1/20 0.36
RCOR1 Q9UKL0 1/20 0.36
HRH3 Q9Y5N1 1/20 0.36
MTNR1A P48039 1/20 0.36
MTNR1B P49286 1/20 0.36
ICMT O60725 1/20 0.36
LMNA P02545 1/20 0.36

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Hydrochloric Acid SCHEMBL31327345 0.98 MAPT (0.53) MAPTALDH1A1KCNH3L3MBTL1PPARG
SCHEMBL15361088 0.95 MAPT (0.53) MAPTALDH1A1KCNH3L3MBTL1PPARG
SCHEMBL31687255 0.93 MAPT (0.52) MAPTALDH1A1KCNH3L3MBTL1PPARG
SCHEMBL31687729 0.92 MAPT (0.50) MAPTALDH1A1KCNH3L3MBTL1PPARG
SCHEMBL31687718 0.92 MAPT (0.50) MAPTALDH1A1KCNH3L3MBTL1PPARG
SCHEMBL31687723 0.92 MAPT (0.50) MAPTALDH1A1KCNH3L3MBTL1PPARG
SCHEMBL18496781 0.90 MAPT (0.44) MAPTALDH1A1KCNH3L3MBTL1GAA
SCHEMBL15360346 0.89 MAPT (0.48) MAPTALDH1A1KCNH3L3MBTL1GAA
SCHEMBL974893 0.86 MAPT (0.55) MAPTALDH1A1KCNH3L3MBTL1PPARG
Azetidine SCHEMBL29245579 0.85 ALDH1A1 (0.40) MAPTALDH1A1KCNH3L3MBTL1PPARG

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 719 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-122037138-A Modified epoxy resin, preparation method thereof, epoxy plastic package material and application 深圳先进电子材料国际创新研究院 2026-05-15 CN claimed
WO-2025223681-A1 CROSS-LINKABLE COMPOSITIONS ON THE BASIS OF ORGANOSILICON COMPOUNDS WACKER CHEMIE AG (DE) 2025-10-30 WO claimed
CN-119735918-A Epoxy resin composition and packaging material 深圳先进电子材料国际创新研究院 2025-04-01 CN claimed
CN-119306939-A Carbamate silane end capped polyether, preparation method and application thereof 江西晨光新材料股份有限公司 2025-01-14 CN claimed
US-20240392073-A1 CROSSLINKABLE MASSES BASED ON ORGANYLOXY-GROUP-CONTAINING ORGANOPOLYSILOXANES WACKER CHEMIE AG (DE) 2024-11-28 US claimed
EP-4370597-A1 CROSSLINKABLE MASSES BASED ON ORGANYLOXY-GROUP-CONTAINING ORGANOPOLYSILOXANES Wacker Chemie AG (DE) 2024-05-22 EP claimed
CN-118019792-A Crosslinkable substances based on organopolysiloxanes containing organyloxy groups 瓦克化学股份公司 2024-05-10 CN claimed
CN-117487309-A Epoxy plastic package material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2024-02-02 CN claimed
CN-116970260-B Epoxy plastic package material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2024-01-23 CN claimed
CN-116970256-A High-flame-retardance epoxy plastic package material and preparation method and application thereof 深圳先进电子材料国际创新研究院 2023-10-31 CN claimed
CN-110546206-A crosslinkable substances based on organopolysiloxanes containing organyloxy groups WACKER CHEMIE AG 2019-12-06 CN claimed
US-10351656-B2 Silylated polyurethanes HUNTSMAN INTERNATIONAL LLC (US) 2019-07-16 US claimed
EP-3157970-B1 SILYLATED POLYURETHANES HUNTSMAN INT LLC (US) 2019-02-06 EP claimed
EP-3340253-A1 UV-RESISTANT ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP claimed
EP-3340252-A1 ELECTRODE ASSEMBLY Solvay SA (BE) 2018-06-27 EP claimed
US-20170198084-A1 SILYLATED POLYURETHANES HUNTSMAN INTERNATIONAL LLC 2017-07-13 US claimed
EP-2957582-A1 Isocyanate-based prepolymers HUNTSMAN INTERNATIONAL LLC (US) 2015-12-23 EP claimed
US-8709959-B2 Puncture resistant fabric KIMBERLY-CLARK WORLDWIDE, INC. (US) 2014-04-29 US claimed
US-7544727-B2 molding materials; fluidity; semiconductor chip arranged on a thin, multi-pin, long wire, narrow-pad-pitch, or a mounted substrate; free of molding defects, wire sweep, voids; HITACHI CHEMICAL CO., LTD. (JP) 2009-06-09 US claimed
US-20070048349-A1 Surface-modified medical devices and methods of making BAUSCH & LOMB INCORPORATED 2007-03-01 US claimed