SCHEMBL4957431

SCHEMBL4957431

NC(N)[C@H]1CC2CCC1C2

nearest known ligand 0.38

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
HPGD P15428 2/20 0.38
LMNA P02545 1/20 0.38
SMN1; SMN2 Q16637 1/20 0.38
POLB P06746 1/20 0.33
KMT2A Q03164 2/20 0.31
ALDH1A1 P00352 2/20 0.31
NPC1 O15118 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3670072 1.00 HPGD (0.38) HPGDLMNASMN1; SMN2POLBKMT2A
SCHEMBL17818813 0.80 HPGD (0.43) HPGDLMNASMN1; SMN2POLBKMT2A
SCHEMBL4211835 0.80 HPGD (0.43) HPGDLMNASMN1; SMN2POLBKMT2A
SCHEMBL24245343 0.80 HPGD (0.40) HPGDLMNASMN1; SMN2POLBKMT2A
Hydrochloric Acid SCHEMBL17818918 0.78 HPGD (0.42) HPGDLMNASMN1; SMN2POLBKMT2A
SCHEMBL23302263 0.77 LMNA (0.34) HPGDLMNASMN1; SMN2ALDH1A1
SCHEMBL24584729 0.74 HPGD (0.46) HPGDLMNASMN1; SMN2POLBKMT2A
SCHEMBL19453116 0.74 HPGD (0.38) HPGDLMNASMN1; SMN2POLBKMT2A
SCHEMBL24583813 0.74 HPGD (0.46) HPGDLMNASMN1; SMN2POLBKMT2A
SCHEMBL3821014 0.74 HPGD (0.42) HPGDLMNASMN1; SMN2POLBKMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1321487-B1 POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE MITSUI CHEMICALS INC (JP) 2008-02-27 EP claimed
US-6710160-B2 VARNISH HAVING IMPROVED SMOOTHNESS, THERMAL RESISTANCE, MELT FLOWABILITY, OPTICAL PROPERTIES AND CHEMICAL RESISTANCE; DIELECTRICS MITSUI CHEMICALS, INC. (JP) 2004-03-23 US claimed
EP-1321487-A1 POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE Mitsui Chemicals, Inc. (JP) 2003-06-25 EP claimed
US-20020188090-A1 Polyamic acid, polyimide, process for producing these, and film of the polyimide MITSUI CHEMICALS, INC. (JP) 2002-12-12 US claimed
EP-1321487-B1 POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE MITSUI CHEMICALS INC (JP) 2008-02-27 EP disclosed
US-6710160-B2 VARNISH HAVING IMPROVED SMOOTHNESS, THERMAL RESISTANCE, MELT FLOWABILITY, OPTICAL PROPERTIES AND CHEMICAL RESISTANCE; DIELECTRICS MITSUI CHEMICALS, INC. (JP) 2004-03-23 US disclosed
EP-1321487-A1 POLYAMIC ACID, POLYIMIDE, PROCESS FOR PRODUCING THESE, AND FILM OF THE POLYIMIDE Mitsui Chemicals, Inc. (JP) 2003-06-25 EP disclosed
US-20020188090-A1 Polyamic acid, polyimide, process for producing these, and film of the polyimide MITSUI CHEMICALS, INC. (JP) 2002-12-12 US disclosed