Predicted protein targets (top 11)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | THRB | P10828 | 6/20 | 0.42 |
| ▸ | THRA | P10827 | 5/20 | 0.42 |
| ▸ | PPARA | Q07869 | 5/20 | 0.41 |
| ▸ | PPARG | P37231 | 4/20 | 0.41 |
| ▸ | ZDHHC2 | Q9UIJ5 | 1/20 | 0.39 |
| ▸ | GAA | P10253 | 1/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.38 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.38 |
| ▸ | MBOAT4 | Q96T53 | 1/20 | 0.38 |
| ▸ | FDPS | P14324 | 1/20 | 0.36 |
| ▸ | EGFR | P00533 | 1/20 | 0.36 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29013471 | 0.89 | PPARG (0.42) | PPARAPPARGGAAFDPS | |
| SCHEMBL11228526 | 0.89 | PPARG (0.42) | PPARAPPARGGAAFDPS | |
| SCHEMBL8465062 | 0.89 | PPARG (0.42) | PPARAPPARGGAAFDPS | |
| Acrylic Acid SCHEMBL9191995 | 0.89 | THRB (0.55) | THRBTHRAMEN1KMT2A | |
| Acrylic Acid SCHEMBL27883411 | 0.87 | THRB (0.39) | THRBTHRAPPARAPPARGZDHHC2 | |
| Acrylic Acid SCHEMBL15376926 | 0.85 | MEN1 (0.41) | THRBTHRAPPARAPPARGZDHHC2 | |
| Acrylic Acid SCHEMBL8414681 | 0.85 | MEN1 (0.41) | THRBTHRAPPARAPPARGZDHHC2 | |
| Acrylic Acid SCHEMBL15322566 | 0.85 | MEN1 (0.41) | THRBTHRAPPARAPPARGZDHHC2 | |
| SCHEMBL9453368 | 0.82 | PPARG (0.44) | PPARAPPARGZDHHC2GAAFDPS | |
| SCHEMBL1527669 | 0.82 | PPARG (0.44) | PPARAPPARGZDHHC2GAAFDPS |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| JP-8134157-A | — | — | None | — | — | JP | disclosed |
| JP-9228294-A | — | — | None | — | — | JP | disclosed |
| US-20250259903-A1 | SEMICONDUCTOR ENCAPSULATION COMPOSITION AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-08-14 | — | — | US | disclosed |
| US-20250210448-A1 | DIE ATTACH FILM AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-06-26 | — | — | US | disclosed |
| US-20250132280-A1 | CHIP ATTACH FILM, SEMICONDUCTOR PACKAGE INCLUDING THE SAME, AND METHOD OF MANUFACTURING SEMICONDUCTOR PACKAGE | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2025-04-24 | — | — | US | disclosed |
| CN-116997856-A | Method for manufacturing flexible printed board | 株式会社钟化 | 2023-11-03 | — | — | CN | disclosed |
| CN-115918275-B | Method for manufacturing flexible printed board | 株式会社钟化 | 2023-10-27 | — | — | CN | disclosed |
| CN-115918275-A | Method for manufacturing flexible printed board | 株式会社钟化 | 2023-04-04 | — | — | CN | disclosed |
| US-20230005872-A1 | ADHESIVE SHEET AND SEMICONDUCTOR PACKAGE INCLUDING THE SAME | SAMSUNG ELECTRONICS CO., LTD. (KR) | 2023-01-05 | — | — | US | disclosed |
| WO-2022202080-A1 | METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD | 株式会社カネカ | 2022-09-29 | — | — | WO | disclosed |
| US-20040048978-A1 | Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board | KANEKA CORPORATION (JP) | 2004-03-11 | — | — | US | disclosed |
| EP-1116964-B1 | UV-curable fresnel lens resin composition, fresnel lens, and back projection screen | SANYO CHEMICAL IND LTD (JP) | 2004-02-25 | — | — | EP | disclosed |
| US-6605353-B2 | Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming | KANEKA CORPORATION (JP) | 2003-08-12 | — | — | US | disclosed |
| US-20010056174-A1 | Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide | KANEKA CORPORATION (JP) | 2001-12-27 | — | — | US | disclosed |
| EP-1116964-A2 | UV-curable fresnel lens resin composition, fresnel lens, and back projection screen | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 2001-07-18 | — | — | EP | disclosed |
| US-5805358-A | BASED ON A METHYL METHACRYLATE POLYMER OR COPOLYMER | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 1998-09-08 | — | — | US | disclosed |
| JP-H09228294-A | GLAZE-FINISHED SHEET | OJI PAPER CO LTD | 1997-09-02 | — | — | JP | disclosed |
| EP-0757261-A2 | UV-curable fresnel lens resin composition, fresnel lens, and back projection screen | SANYO CHEMICAL INDUSTRIES, LTD. (JP) | 1997-02-05 | — | — | EP | disclosed |
| JP-H08134157-A | PHOTO-SETTING RESIN COMPOSITION | SUMITOMO CHEM CO LTD | 1996-05-28 | — | — | JP | disclosed |
| US-4902440-A | BLEND OF URETHANE ACRYLATE AND ACRYLIC POLYMER | THE YOKOHAMA RUBBER CO., LTD. (JP) | 1990-02-20 | — | — | US | disclosed |