SCHEMBL496658

SCHEMBL496658

C=C(C)C(=O)OCCC(C)CCOC(=O)C(=C)C

nearest known ligand 0.57

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.57
THRB P10828 1/20 0.53
ALOX15 P16050 1/20 0.47
ALDH1A1 P00352 2/20 0.41
POLB P06746 1/20 0.39
APEX1 P27695 1/20 0.39
HTT P42858 1/20 0.39
TDP1 Q9NUW8 1/20 0.39
CHRNB2 P17787 3/20 0.34
CHRNA4 P43681 3/20 0.34
CHRNB4 P30926 1/20 0.34
CHRNA3 P32297 1/20 0.34
CYP19A1 P11511 1/20 0.32
CA1 P00915 1/20 0.31
CA2 P00918 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1903520 0.92 TSHR (0.55) TSHRTHRBALOX15ALDH1A1POLB
SCHEMBL154616 0.92 TSHR (0.50) TSHRTHRBALOX15ALDH1A1POLB
SCHEMBL18927188 0.91 TSHR (0.48) TSHRTHRBALOX15ALDH1A1POLB
SCHEMBL1903309 0.90 THRB (0.53) TSHRTHRBALOX15ALDH1A1POLB
SCHEMBL2156739 0.90 TSHR (0.62) TSHRTHRBALOX15ALDH1A1POLB
SCHEMBL1499700 0.90 TSHR (0.52) TSHRTHRBALOX15ALDH1A1POLB
SCHEMBL25220357 0.89 TSHR (0.52) TSHRTHRBALOX15ALDH1A1POLB
SCHEMBL9326798 0.89 TSHR (0.47) TSHRTHRBALOX15ALDH1A1POLB
SCHEMBL11528787 0.89 TSHR (0.61) TSHRTHRBALOX15ALDH1A1POLB
SCHEMBL5941686 0.89 TSHR (0.52) TSHRTHRBALOX15ALDH1A1POLB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 185 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116003702-A 3D printing resin and application 深圳市纵维立方科技有限公司 2023-04-25 CN claimed
EP-4748210-A1 SOLAR CELL COMPRISING A POLYMER LAYER COMPRISING ACRYLATES Avantama AG (CH) 2026-05-27 EP disclosed
WO-2025105404-A1 SHEET-LIKE MEMBER, RESIN COMPOSITION FOR MOLDING, AND ELECTRONIC COMPONENT DEVICE 株式会社レゾナック 2025-05-22 WO disclosed
US-20250155808-A1 RESIST COMPOSITION AND METHOD OF FORMING RESIST PATTERN ZEON CORPORATION (JP) 2025-05-15 US disclosed
US-20250066616-A1 A rosin polymer to be used as inert component in a coating, in particular a radiation curing coating such as a radiation curing printing ink HUBERGROUP DEUTSCHLAND GMBH (DE) 2025-02-27 US disclosed
WO-2025021278-A1 SOLAR CELL COMPRISING A POLYMER LAYER COMPRISING ACRYLATES AVANTAMA AG (CH) 2025-01-30 WO disclosed
US-20240384106-A1 CURABLE RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD OF ARTICLE CANON KABUSHIKI KAISHA (JP) 2024-11-21 US disclosed
US-12097714-B2 Ink jet recording method FUJIFILM CORPORATION (JP) 2024-09-24 US disclosed
WO-2024165880-A1 UV-CURABLE INKJET INK, AND INKJET RECORDING METHOD artience株式会社 2024-08-15 WO disclosed
WO-2024143072-A1 COMPOSITION AND CURED PRODUCT 株式会社ADEKA 2024-07-04 WO disclosed
EP-1480071-A1 METHOD FOR PRODUCING LIQUID CRYSTAL DISPLAY CELL AND SEALING AGENT FOR LIQUID CRYSTAL DISPLAY CELL Mitsui Chemicals, Inc. (JP) 2004-11-24 EP disclosed
US-20040048978-A1 Photosensitive resin composition, solder resist comprising the same, cover lay film, and printed circuit board KANEKA CORPORATION (JP) 2004-03-11 US disclosed
US-6605353-B2 Polyimide derived from a dianhydride and diamine having hydroxyl or carboxyl groups, which are modified with a diepoxide or unsaturated group-containing epoxide; curable; heat resistance, dielectric, film-forming KANEKA CORPORATION (JP) 2003-08-12 US disclosed
EP-1295899-A2 Active energy beam-curable composition, ink containing the same, and printer accommodating the same ink BROTHER KOGYO KABUSHIKI KAISHA (JP) 2003-03-26 EP disclosed
US-20010056174-A1 Epoxy-modified polyimide, photosensitive composition, coverlay film, solder resist, and printed wiring board using the epoxy-modified polyimide KANEKA CORPORATION (JP) 2001-12-27 US disclosed
EP-0909752-B1 DI(METH)ACRYLATES KYOWA YUKA KK (JP) 2001-09-05 EP disclosed
EP-0909752-A1 DI(METH)ACRYLATES Kyowa Yuka Co., Ltd. (JP) 1999-04-21 EP disclosed
EP-0492509-B1 Vinyl polymer having (meth)acryloyl groups on the side chains and method for preparing same KYOEISHA CHEMICAL CO LTD (JP) 1995-09-20 EP disclosed
US-5274063-A Vinyl polymer having (meth)acryloyl groups on the side chains and method for preparing same KYOEISHA CHEMICAL CO., LTD. (JP) 1993-12-28 US disclosed
EP-0492509-A1 Vinyl polymer having (meth)acryloyl groups on the side chains and method for preparing same KYOEISHA CHEMICAL CO., LTD. (JP) 1992-07-01 EP disclosed