Ethylene Glycol

Ethylene Glycol

SCHEMBL4969618

COCCCO.OCCO

nearest known ligand 0.40

Full drug profile on Sugi Atlas →

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 6/20 0.40
GAA P10253 1/20 0.37
TSHR P16473 6/20 0.36
SMN1; SMN2 Q16637 1/20 0.35
LMNA P02545 2/20 0.33
MEN1 O00255 2/20 0.33
KMT2A Q03164 2/20 0.33
HSD17B10 Q99714 1/20 0.33
MAPK1 P28482 1/20 0.32
RECQL P46063 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4742 0.97
SCHEMBL28743872 0.93
Hydrogen Peroxide SCHEMBL8586801 0.93
SCHEMBL27627358 0.93
SCHEMBL27527758 0.93
SCHEMBL10442088 0.93 ALDH1A1 (0.40) ALDH1A1GAATSHRSMN1; SMN2LMNA
Methyl Alcohol SCHEMBL14861499 0.93
SCHEMBL28072038 0.93
Hydrochloric Acid SCHEMBL5618162 0.93
SCHEMBL27614475 0.93

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109906122-A Coating composition and coating system PPG工业俄亥俄公司 2019-06-18 CN disclosed
CN-108473795-A Coating composition comprising thermosetting resin and thermoplastic resin PPG工业俄亥俄公司 2018-08-31 CN disclosed
CN-108463520-A Coating composition comprising a powder dispersed in a liquid carrier PPG工业俄亥俄公司 2018-08-28 CN disclosed
CN-107567477-A Pull tab for food and/or beverage can PPG工业俄亥俄公司 2018-01-09 CN disclosed
CN-106715602-A Coating composition PPG涂料欧洲有限责任公司 2017-05-24 CN disclosed
EP-1487888-B1 POLYMERISABLE COMPOSITION HUNTSMAN ADV MAT SWITZERLAND (CH) 2008-10-22 EP disclosed
US-5439774-A For forming printed wiring photoresists KANSAI PAINT CO., LTD. (JP) 1995-08-08 US disclosed