SCHEMBL4988591

SCHEMBL4988591

CCO[Si](OCC)(N(C)C)N(C)C

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL4990077 0.75
SCHEMBL495704 0.73
SCHEMBL4987267 0.71
SCHEMBL10949205 0.71
SCHEMBL235326 0.71
SCHEMBL10948694 0.71
SCHEMBL10947506 0.71
SCHEMBL235635 0.67
SCHEMBL1143073 0.67
SCHEMBL4209661 0.67 LMNA (0.30)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4747425-A1 INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC ON PATTERNED SUBSTRATE GELEST, INC. (US) 2026-05-27 EP claimed
US-20250112041-A1 INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC ON PATTERNED SUBSTRATE GELEST, INC. 2025-04-03 US claimed
WO-2025019704-A1 INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC ON PATTERNED SUBSTRATE GELEST, INC. (US) 2025-01-23 WO claimed
EP-4747425-A1 INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC ON PATTERNED SUBSTRATE GELEST, INC. (US) 2026-05-27 EP disclosed
US-20250112041-A1 INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC ON PATTERNED SUBSTRATE GELEST, INC. 2025-04-03 US disclosed
WO-2025019704-A1 INHERENT AREA SELECTIVE DEPOSITION OF SILICON-CONTAINING DIELECTRIC ON PATTERNED SUBSTRATE GELEST, INC. (US) 2025-01-23 WO disclosed
US-20240026527-A1 METHOD OF DEPOSITING SILICON BASED DIELECTRIC FILM APPLIED MATERIALS, INC. (US) 2024-01-25 US disclosed
WO-2024020132-A1 METHOD OF DEPOSITING SILICON BASED DIELECTRIC FILM APPLIED MATERIALS, INC. (US) 2024-01-25 WO disclosed
US-7396951-B2 Process for production of trialkoxyhalosilanes UBE INDUSTRIES, LTD. (JP) 2008-07-08 US disclosed
US-7396950-B2 Process for production of trialkoxyhalosilanes UBE INDUSTRIES, LTD. (JP) 2008-07-08 US disclosed
US-20070255067-A1 PROCESS FOR PRODUCTION OF TRIALKOXYHALOSILANES UBE INDUSTRIES, LTD. (JP) 2007-11-01 US disclosed
US-20070255068-A1 Reacting a tetrahalosilane with a tetraalkoxysilane in an alkanol with the same alkoxy group to form a triethoxysilyl halide, and aminating the halide with a dialkylamine to form a (dialkylamino)trialkoxysilane; lower cost UBE INDUSTRIES, LTD. (JP) 2007-11-01 US disclosed
US-20060258825-A1 Process for production of trialkoxyhalosilanes, process for production of alkoxy (dialkylamino) silanes, catalysts for (co)polymerization of a-olefins, catalyst components therefor, and processes for polymerization of a-olefins with the catalysts UBE INDUSTRIES, LTD. (JP) 2006-11-16 US disclosed
EP-1671977-A1 PROCESS FOR PRODUCTION OF TRIALKOXYHALOSILANES, PROCESS FOR PRODUCTION OF ALKOXY(DIALKYLAMINO)SILANES, CATALYSTS FOR (CO)POLYMERIZATION OF ALPHA-OLEFINS, CATALYST COMPONENTS THEREFOR, AND PROCESS ES FOR POLYMERIZATION OF ALPHA-OLEFINS WITH THE CATALYSTS Ube Industries, Ltd. (JP) 2006-06-21 EP disclosed