SCHEMBL5011503

SCHEMBL5011503

C=CCN(C)C(=S)NC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28491839 0.79 CYP1A2 (0.48)
SCHEMBL19956904 0.77
SCHEMBL11221898 0.75 TAS2R38 (0.33)
SCHEMBL7154654 0.73
SCHEMBL4017366 0.73
SCHEMBL4556481 0.71
SCHEMBL8076279 0.71 TAS2R38 (0.43)
SCHEMBL80294 0.70
SCHEMBL8755242 0.70
SCHEMBL29044314 0.70

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 6 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2008056938-A1 METHOD FOR REMOVING CATALYST RESIDUES FROM POLYMER SOLUTION AND POLYMERS PURIFIED BY THE METHOD LG CHEM, LTD. (KR) 2008-05-15 WO claimed
US-20040187731-A1 Acid copper electroplating solutions WANG QING MIN (US) 2004-09-30 US claimed
EP-1069211-A2 Electroplating solutions THE BOC GROUP, INC. (US) 2001-01-17 EP claimed
US-20070040151-A1 Two-component initiator system (amine-free) with very good storage stability and particular suitability for acid systems HERAEUS KULZER GMBH (DE) 2007-02-22 US disclosed
US-20040187731-A1 Acid copper electroplating solutions WANG QING MIN (US) 2004-09-30 US disclosed
EP-1069211-A2 Electroplating solutions THE BOC GROUP, INC. (US) 2001-01-17 EP disclosed