⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL10649657 | 0.82 | — | — | |
| SCHEMBL19303005 | 0.74 | GGPS1 (0.41) | — | |
| SCHEMBL18163273 | 0.72 | GGPS1 (0.40) | — | |
| SCHEMBL23278099 | 0.71 | SIGMAR1 (0.39) | — | |
| SCHEMBL5021077 | 0.69 | GGPS1 (0.44) | — | |
| SCHEMBL5021079 | 0.68 | GGPS1 (0.45) | — | |
| SCHEMBL9926297 | 0.67 | GGPS1 (0.47) | — | |
| SCHEMBL13073400 | 0.67 | GGPS1 (0.47) | — | |
| SCHEMBL5021140 | 0.67 | GGPS1 (0.47) | — | |
| SCHEMBL5021145 | 0.67 | GGPS1 (0.47) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20070039246-A1 | Method for preparing polishing slurry | LIU ZHENDONG | 2007-02-22 | — | — | US | claimed |
| EP-1548075-A2 | Compositons and methods for barrier removal | Rohm and Haas Electronic Materials CMP Holdings, Inc. (US) | 2005-06-29 | — | — | EP | claimed |
| US-20050097825-A1 | Compositions and methods for a barrier removal | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2005-05-12 | — | — | US | claimed |
| US-3948703-A | Method of chemically polishing copper and copper alloy | TOKAI DENKA KOGYO KABUSHIKI KAISHA (JA) | 1976-04-06 | — | — | US | claimed |
| CN-101240146-A | Metal-polishing composition and chemical mechanical polishing method by using the same | FUJIFILM CORP (JP) | 2008-08-13 | — | — | CN | disclosed |
| US-20080188079-A1 | METAL-POLISHING COMPOSITION AND CHEMICAL MECHANICAL POLISHING METHOD BY USING THE SAME | FUJIFILM CORPORATION (JP) | 2008-08-07 | — | — | US | disclosed |
| US-20070039246-A1 | Method for preparing polishing slurry | LIU ZHENDONG | 2007-02-22 | — | — | US | disclosed |
| EP-1548075-A2 | Compositons and methods for barrier removal | Rohm and Haas Electronic Materials CMP Holdings, Inc. (US) | 2005-06-29 | — | — | EP | disclosed |
| US-20050097825-A1 | Compositions and methods for a barrier removal | ROHM AND HAAS ELECTRONIC MATERIALS CMP HOLDINGS, INC. | 2005-05-12 | — | — | US | disclosed |
| US-3948703-A | Method of chemically polishing copper and copper alloy | TOKAI DENKA KOGYO KABUSHIKI KAISHA (JA) | 1976-04-06 | — | — | US | disclosed |