⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Phosphine SCHEMBL5014348 | 0.89 | — | — | |
| SCHEMBL28817151 | 0.89 | — | — | |
| SCHEMBL196797 | 0.87 | — | — | |
| SCHEMBL1783879 | 0.87 | — | — | |
| SCHEMBL1343557 | 0.87 | — | — | |
| SCHEMBL11153571 | 0.87 | — | — | |
| SCHEMBL2159811 | 0.87 | — | — | |
| SCHEMBL15106679 | 0.82 | — | — | |
| SCHEMBL4072519 | 0.75 | — | — | |
| SCHEMBL240496 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2014137638-A1 | HIGH SPEED COPPER PLATING PROCESS | MACDERMID ACUMEN, INC. (US) | 2014-09-12 | — | — | WO | disclosed |
| US-20140256083-A1 | High Speed Copper Plating Process | MACDERMID ACUMEN, INC. (US) | 2014-09-11 | — | — | US | disclosed |
| US-7442634-B2 | Method for constructing contact formations | INTEL CORPORATION (US) | 2008-10-28 | — | — | US | disclosed |
| US-20070158199-A1 | Method to modulate the surface roughness of a plated deposit and create fine-grained flat bumps | INTEL CORPORATION | 2007-07-12 | — | — | US | disclosed |
| US-20060134902-A1 | Method for constructing contact formations | INTEL CORPORATION | 2006-06-22 | — | — | US | disclosed |