SCHEMBL5024256

SCHEMBL5024256

O=P(OCCOCCO)(OCCOCCO)OCCOCCO

nearest known ligand 0.58

Predicted protein targets (top 10)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 3/20 0.58
KMT2A Q03164 3/20 0.58
TSHR P16473 4/20 0.54
CYP3A4 P08684 2/20 0.54
MAPK1 P28482 1/20 0.53
ALDH1A1 P00352 2/20 0.42
THRB P10828 1/20 0.39
HTT P42858 1/20 0.39
MAPT P10636 1/20 0.39
PPARD Q03181 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL832376 1.00 MEN1 (0.58) MEN1KMT2ATSHRCYP3A4MAPK1
SCHEMBL6401387 0.89 ALDH1A1 (0.62) MEN1KMT2ATSHRCYP3A4MAPK1
SCHEMBL10416347 0.89 TSHR (0.55) MEN1KMT2ATSHRCYP3A4MAPK1
SCHEMBL27905381 0.89 TSHR (0.61) MEN1KMT2ATSHRCYP3A4MAPK1
SCHEMBL20357374 0.85 TSHR (0.47) MEN1KMT2ATSHRCYP3A4MAPK1
SCHEMBL632894 0.83 ALDH1A1 (0.50) MEN1KMT2ATSHRCYP3A4MAPK1
SCHEMBL1627450 0.82 MEN1 (0.55) MEN1KMT2ATSHRCYP3A4MAPK1
SCHEMBL125343 0.82 MEN1 (0.55) MEN1KMT2ATSHRCYP3A4MAPK1
SCHEMBL899138 0.82 MEN1 (0.55) MEN1KMT2ATSHRCYP3A4MAPK1
SCHEMBL8860368 0.82 MEN1 (0.55) MEN1KMT2ATSHRCYP3A4MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12049541-B2 Polyester resin composition MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2024-07-30 US disclosed
EP-3778772-B1 POLYESTER RESIN COMPOSITION MITSUBISHI GAS CHEMICAL CO (JP) 2023-11-29 EP disclosed
EP-3778772-A1 POLYESTER RESIN COMPOSITION MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 2021-02-17 EP disclosed
EP-2805996-B1 THERMOPLASTIC ELASTOMER COMPOSITION ARON KASEI KK (JP) 2017-11-22 EP disclosed
EP-2746329-B1 THERMOSETTING AQUEOUS RESIN COMPOSITION AND USE THEREOF AS BINDER FOR MINERAL WOOL SAINT GOBAIN ISOVER (FR) 2015-12-02 EP disclosed
EP-2805996-A1 THERMOPLASTIC ELASTOMER COMPOSITION Aronkasei CO., LTD. (JP) 2014-11-26 EP disclosed
EP-2746329-A1 Thermosetting aqueous resin composition and use thereof as binder for mineral wool ISOVER SAINT-GOBAIN (FR) 2014-06-25 EP disclosed
EP-1437373-B1 PROCESS FOR PRODUCING POLY(ETHYLENE-AROMATIC DICARBOXYLATE ESTER) RESIN AND RESIN PRODUCT TEIJIN LTD (JP) 2008-02-20 EP disclosed
US-7189797-B2 Process for producing poly(ethylene-aromatic dicarboxylate ester) resin and resin product TEIJIN LIMITED (JP) 2007-03-13 US disclosed
US-20040254331-A1 Process for producing poly(ethylene-aromatic dicarboxylate ester) resin and resin product TEIJIN LIMITED (JP) 2004-12-16 US disclosed
EP-1437373-A1 PROCESS FOR PRODUCING POLY(ETHYLENE-AROMATIC DICARBOXYLATE ESTER) RESIN AND RESIN PRODUCT TEIJIN LIMITED (JP) 2004-07-14 EP disclosed
US-5981612-A Production of flameproofed, rigid, isocyanate-based foams BASF AKTIENGESELLSCHAFT (DE) 1999-11-09 US disclosed
EP-0908464-A1 Process for the preparation of hydroxyphosphonates and their use as flame retardants in polymers BASF AKTIENGESELLSCHAFT (DE) 1999-04-14 EP disclosed