SCHEMBL5024600

SCHEMBL5024600

O[SiH](c1ccccc1)C1CCCCO1

nearest known ligand 0.38

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
SLC6A3 Q01959 2/20 0.36
SMN1; SMN2 Q16637 2/20 0.34
GAA P10253 2/20 0.34
HPGD P15428 2/20 0.33
MGLL Q99685 2/20 0.32
MEN1 O00255 1/20 0.31
KMT2A Q03164 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL35819 0.81 SMN1; SMN2 (0.36) SLC6A3SMN1; SMN2GAAHPGDMGLL
SCHEMBL28876704 0.81 SLC6A3 (0.35) SLC6A3SMN1; SMN2GAAHPGDMGLL
Methane SCHEMBL7528421 0.80 SMN1; SMN2 (0.35) SLC6A3SMN1; SMN2GAAHPGDMGLL
SCHEMBL11049060 0.79 SMN1; SMN2 (0.34) SLC6A3SMN1; SMN2GAA
SCHEMBL28723399 0.79 SMN1; SMN2 (0.34) SLC6A3SMN1; SMN2GAA
SCHEMBL36086 0.79 SLC6A3 (0.36) SLC6A3SMN1; SMN2GAAHPGD
SCHEMBL2424491 0.79 SMN1; SMN2 (0.34) SLC6A3SMN1; SMN2GAAMGLL
SCHEMBL8099322 0.79 SLC6A3 (0.36) SLC6A3SMN1; SMN2GAA
SCHEMBL9615984 0.79 SMN1; SMN2 (0.34) SLC6A3SMN1; SMN2GAA
SCHEMBL11767953 0.78 SLC6A3 (0.34) SLC6A3SMN1; SMN2GAAHPGDMGLL

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10242925-B2 Encapsulation of electronic components in polymer materials INSTITUT VEDECOM (FR) 2019-03-26 US claimed
US-20180312640-A1 ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS INSTITUT VEDECOM (FR) 2018-11-01 US claimed
CN-114760982-B Composition comprising a cationic polysaccharide and an anionic antioxidant 莱雅公司 2024-05-31 CN disclosed
US-11854726-B2 Magnetic base body containing metal magnetic particles composed mainly of Fe and electronic component including the same TAIYO YUDEN CO., LTD. (JP) 2023-12-26 US disclosed
US-20200312498-A1 MAGNETIC BASE BODY CONTAINING METAL MAGNETIC PARTICLES COMPOSED MAINLY OF Fe AND ELECTRONIC COMPONENT INCLUDING THE SAME TAIYO YUDEN CO., LTD. (JP) 2020-10-01 US disclosed
US-10242925-B2 Encapsulation of electronic components in polymer materials INSTITUT VEDECOM (FR) 2019-03-26 US disclosed
US-20180312640-A1 ENCAPSULATION OF ELECTRONIC COMPONENTS IN POLYMER MATERIALS INSTITUT VEDECOM (FR) 2018-11-01 US disclosed
US-7393911-B2 Organosilicon fine particles and method of producing same TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) 2008-07-01 US disclosed
US-20060089478-A1 antireflection and antiblocking characteristics to synthetic polymer films and sheets when applied to their surface or caused to be contained, respectively, and adherence and slip characteristics to a skin care cosmetic material when caused to be contained TAKEMOTO YUSHI KABUSHIKI KAISHA (JP) 2006-04-27 US disclosed
US-4792516-A AROMATIC AZIDE, ALKALI SOLUBLE POLYMERS, ALKYLAMMONIUM COMPOUNDS HITACHI CHEMICAL COMPANY (JP) 1988-12-20 US disclosed