Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6905075 | 0.82 | TSHR (0.32) | TSHRTDP1 | |
| SCHEMBL167171 | 0.80 | TSHR (0.39) | TSHRTDP1 | |
| SCHEMBL2979150 | 0.79 | — | — | |
| SCHEMBL11645650 | 0.79 | TSHR (0.33) | TSHRTDP1 | |
| SCHEMBL4636455 | 0.79 | — | — | |
| SCHEMBL28201968 | 0.79 | — | — | |
| SCHEMBL4073252 | 0.77 | — | — | |
| SCHEMBL11421925 | 0.76 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL26665097 | 0.76 | TSHR (0.35) | TSHRTDP1 | |
| SCHEMBL987910 | 0.75 | CTSK (0.33) | TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 29 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116888189-A | Thermosetting resin composition, cured product, resin sheet, prepreg, metal foil-clad laminate, multilayer printed wiring board, sealing material, fiber-reinforced composite material, adhesive, and semiconductor device | 日本化药株式会社 | 2023-10-13 | — | — | CN | disclosed |
| CN-114072460-A | Acrylic rubber sheet having excellent storage stability and processability | 日本瑞翁株式会社 | 2022-02-18 | — | — | CN | disclosed |
| US-10968339-B2 | Antioxidant-containing foamable resin particles, method for producing same, foamable particles, and foam-molded article | SEKISUI PLASTICS CO., LTD. (JP) | 2021-04-06 | — | — | US | disclosed |
| EP-3438172-B1 | ANTIOXIDANT-CONTAINING FOAMABLE RESIN PARTICLES, METHOD FOR PRODUCING SAME, FOAMABLE PARTICLES, AND FOAM-MOLDED ARTICLE | SEKISUI PLASTICS (JP) | 2020-12-09 | — | — | EP | disclosed |
| CN-107250184-B | Composite resin particles, expandable particles thereof, expanded particles, and expanded molded article | 积水化成品工业株式会社 | 2020-05-19 | — | — | CN | disclosed |
| US-20190085160-A1 | ANTIOXIDANT-CONTAINING FOAMABLE RESIN PARTICLES, METHOD FOR PRODUCING SAME, FOAMABLE PARTICLES, AND FOAM-MOLDED ARTICLE | SEKISUI PLASTICS CO., LTD. (JP) | 2019-03-21 | — | — | US | disclosed |
| EP-3438172-A1 | ANTIOXIDANT-CONTAINING FOAMABLE RESIN PARTICLES, METHOD FOR PRODUCING SAME, FOAMABLE PARTICLES, AND FOAM-MOLDED ARTICLE | Sekisui Plastics Co., Ltd. (JP) | 2019-02-06 | — | — | EP | disclosed |
| EP-2980145-B1 | COMPOSITE RESIN PARTICLES AND FOAMABLE COMPOSITE RESIN PARTICLES, PRE-FOAMED RESIN PARTICLES, AND MOLDED FOAM BODY USING SAME | SEKISUI PLASTICS (JP) | 2018-02-28 | — | — | EP | disclosed |
| US-20160060444-A1 | COMPOSITE RESIN PARTICLES, AND FOAMABLE COMPOSITE RESIN PARTICLES, PRE-FOAMED RESIN PARTICLES, AND MOLDED FOAM BODY USING SAME | SEKISUI PLASTICS CO., LTD. (JP) | 2016-03-03 | — | — | US | disclosed |
| US-20160060413-A1 | MOLDED BODY OF COMPOSITE RESIN FOAM | SEKISUI PLASTICS CO., LTD. (JP) | 2016-03-03 | — | — | US | disclosed |
| US-5652290-A | Thermally conductive silicone rubber compositions with low permanent compression strain ratios | DOW CORNING TORAY SILICONE CO., LTD. (JP) | 1997-07-29 | — | — | US | disclosed |
| EP-0530537-B1 | Condensed pyrimidine derivatives, their production and use as antitumor agents | TAKEDA CHEMICAL INDUSTRIES LTD (JP) | 1997-01-08 | — | — | EP | disclosed |
| US-5403843-A | Pyrrolopyrimidinyalglutaminate derivatives and their use | TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) | 1995-04-04 | — | — | US | disclosed |
| EP-0530537-A1 | Condensed pyrimidine derivatives, their production and use as antitumor agents | TAKEDA CHEMICAL INDUSTRIES, LTD. (JP) | 1993-03-10 | — | — | EP | disclosed |
| US-5178951-A | Thermosetting resin composition | OSAKA SODA CO., LTD. (JP) | 1993-01-12 | — | — | US | disclosed |
| US-5110873-A | Molding materials | OSAKA SODA CO., LTD. (JP) | 1992-05-05 | — | — | US | disclosed |
| EP-0295347-B1 | THERMOSETTING RESIN COMPOSITION | Daiso Co., Ltd. (JP) | 1991-08-28 | — | — | EP | disclosed |
| US-5032459-A | Rubber, unsaturated acid or epoxy, unsaturated aromatic | SUMITOMO CHEMICAL COMPANY, LIMITED (JP) | 1991-07-16 | — | — | US | disclosed |
| EP-0295347-A1 | Thermosetting resin composition | Daiso Co., Ltd. (JP) | 1988-12-21 | — | — | EP | disclosed |
| US-4518764-A | POLYDIALLYL TEREPHTHALATE ENDCAPPED WITH ALKLARYL HYDROCARBON | OSAKA SODA CO. LTD. (JP) | 1985-05-21 | — | — | US | disclosed |