SCHEMBL503319

SCHEMBL503319

C[C](C)C(F)(F)C(F)(F)C(F)(F)C(F)F

nearest known ligand 0.38

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
KDM4E B2RXH2 1/20 0.38
TSHR P16473 1/20 0.38
TDP1 Q9NUW8 1/20 0.38

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL503850 0.82 KDM4E (0.31) KDM4ETSHRTDP1
SCHEMBL6338465 0.79 KDM4E (0.40) KDM4ETSHRTDP1
SCHEMBL8737960 0.79 KDM4E (0.35) KDM4ETSHRTDP1
SCHEMBL482327 0.74 KDM4E (0.39) KDM4ETSHRTDP1
SCHEMBL6264907 0.72 TSHR (0.43) KDM4ETSHRTDP1
SCHEMBL11273041 0.72 TSHR (0.39) KDM4ETSHRTDP1
SCHEMBL525795 0.71 KDM4E (0.50) KDM4ETSHRTDP1
SCHEMBL498059 0.71 KDM4E (0.43) KDM4ETSHRTDP1
SCHEMBL29379153 0.70 KDM4E (0.37) KDM4ETSHRTDP1
SCHEMBL251092 0.70 KDM4E (0.37) KDM4ETSHRTDP1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2023238764-A1 COMPOSITION, FILM, ORGANIC PHOTOELECTRIC CONVERSION ELEMENT, AND PHOTODETECTION ELEMENT 住友化学株式会社 2023-12-14 WO disclosed
EP-1708027-B1 UPPER LAYER FILM FORMING COMPOSITION FOR LIQUID IMMERSION AND METHOD OF FORMING PHOTORESIST PATTERN JSR CORP (JP) 2019-03-13 EP disclosed
US-9182674-B2 Immersion upper layer film forming composition and method of forming photoresist pattern JSR CORPORATION (JP) 2015-11-10 US disclosed
EP-2468780-B1 Copolymer and top coating composition JSR CORP (JP) 2013-11-13 EP disclosed
US-8580482-B2 Copolymer and top coating composition JSR CORPORATION (JP) 2013-11-12 US disclosed
US-8501389-B2 Upper layer-forming composition and resist patterning method JSR CORPORATION (JP) 2013-08-06 US disclosed
EP-1806370-B1 COPOLYMER AND UPPER FILM-FORMING COMPOSITION JSR CORP (JP) 2013-05-22 EP disclosed
US-8435718-B2 Upper layer-forming composition and photoresist patterning method JSR CORPORATION (JP) 2013-05-07 US disclosed
EP-2277929-B1 Copolymer and top coating composition JSR CORP (JP) 2012-11-21 EP disclosed
US-20120282553-A1 IMMERSION UPPER LAYER FILM FORMING COMPOSITION AND METHOD OF FORMING PHOTORESIST PATTERN JSR CORPORATION (JP) 2012-11-08 US disclosed
US-20100003615-A1 UPPER LAYER-FORMING COMPOSITION AND PHOTORESIST PATTERNING METHOD JSR CORPORATION (JP) 2010-01-07 US disclosed
EP-1950610-A1 COMPOSITION FOR FORMING UPPER FILM AND METHOD FOR FORMING PHOTORESIST PATTERN JSR Corporation (JP) 2008-07-30 EP disclosed
US-20080124524-A1 Composition For Forming Antireflection Film, Layered Product, And Method Of Forming Resist Pattern JSR CORPORATION (JP) 2008-05-29 US disclosed
US-20080038661-A1 Copolymer and Top Coating Composition JSR CORPORATION (JP) 2008-02-14 US disclosed
EP-1818723-A1 COMPOSITION FOR FORMING ANTIREFLECTION FILM, LAYERED PRODUCT, AND METHOD OF FORMING RESIST PATTERN JSR Corporation (JP) 2007-08-15 EP disclosed
EP-1806370-A1 COPOLYMER AND UPPER FILM-FORMING COMPOSITION JSR Corporation (JP) 2007-07-11 EP disclosed
EP-1708027-A1 UPPER LAYER FILM FORMING COMPOSITION FOR LIQUID IMMERSION AND METHOD OF FORMING PHOTORESIST PATTERN JSR Corporation (JP) 2006-10-04 EP disclosed
US-5235013-A Copolymerizing an alkene of 6-10 carbons having one double bond and a side chain methyl group and an acrylic or fluoroacrylic ester CIBA-GEIGY CORPORATION 1993-08-10 US disclosed
EP-0478261-A2 Process for producing oxygen-permeable polymer CIBA-GEIGY AG (CH) 1992-04-01 EP disclosed
EP-0226020-A2 Plastic optical fibers and transparent resin used therefor HITACHI, LTD. (JP) 1987-06-24 EP disclosed