Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | CYP2C19 | P33261 | 2/20 | 0.50 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.50 |
| ▸ | SRC | P12931 | 2/20 | 0.48 |
| ▸ | INPPL1 | O15357 | 4/20 | 0.46 |
| ▸ | INPP5A | Q14642 | 4/20 | 0.46 |
| ▸ | HCRTR1 | O43613 | 1/20 | 0.43 |
| ▸ | MEN1 | O00255 | 1/20 | 0.40 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.40 |
| ▸ | INPP5B | P32019 | 1/20 | 0.39 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.38 |
| ▸ | GAA | P10253 | 1/20 | 0.37 |
| ▸ | ALOX15 | P16050 | 1/20 | 0.37 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.37 |
| ▸ | LMNA | P02545 | 2/20 | 0.37 |
| ▸ | MAPT | P10636 | 1/20 | 0.37 |
| ▸ | HTT | P42858 | 1/20 | 0.37 |
| ▸ | PTPN2 | P17706 | 1/20 | 0.37 |
| ▸ | PTPN1 | P18031 | 1/20 | 0.37 |
| ▸ | PTPRB | P23467 | 1/20 | 0.37 |
| ▸ | PTPN6 | P29350 | 1/20 | 0.37 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28074475 | 0.92 | HCRTR1 (0.54) | CYP2C19SMN1; SMN2SRCHCRTR1MEN1 | |
| SCHEMBL2910659 | 0.88 | CYP3A4 (0.52) | CYP2C19SMN1; SMN2SRCMEN1KMT2A | |
| SCHEMBL28074472 | 0.86 | ALDH1A1 (0.44) | CYP2C19SMN1; SMN2SRCKMT2AGAA | |
| SCHEMBL28074474 | 0.86 | NPC1 (0.47) | CYP2C19SMN1; SMN2SRCMEN1KMT2A | |
| SCHEMBL1363549 | 0.84 | SRC (0.67) | CYP2C19SMN1; SMN2SRCCYP2C9L3MBTL1 | |
| SCHEMBL19764645 | 0.83 | PTPN5 (0.47) | CYP2C19SMN1; SMN2SRCALOX15LMNA | |
| SCHEMBL17626586 | 0.82 | SRC (0.64) | CYP2C19SMN1; SMN2SRCCYP2C9L3MBTL1 | |
| SCHEMBL17626462 | 0.82 | SRC (0.64) | CYP2C19SMN1; SMN2SRCCYP2C9L3MBTL1 | |
| SCHEMBL14975466 | 0.82 | SRC (0.64) | CYP2C19SMN1; SMN2SRCCYP2C9L3MBTL1 | |
| SCHEMBL30438735 | 0.82 | ACP3 (0.49) | L3MBTL1LMNAMAPTCES2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 144 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12173112-B2 | Epoxy resin systems | WESTLAKE EPOXY INC (US) | 2024-12-24 | — | — | US | claimed |
| EP-4375310-A2 | EPOXY RESIN SYSTEMS | Westlake Epoxy Inc. (US) | 2024-05-29 | — | — | EP | claimed |
| CN-111094422-B | Epoxy resin system | 瀚森公司 | 2022-11-08 | — | — | CN | claimed |
| CN-115260453-A | Epoxy resin system | 瀚森公司 | 2022-11-01 | — | — | CN | claimed |
| US-20220298295-A1 | EPOXY RESIN SYSTEMS | WESTLAKE EPOXY INC (US) | 2022-09-22 | — | — | US | claimed |
| US-11359047-B2 | Epoxy resin systems | HEXION INC. (US) | 2022-06-14 | — | — | US | claimed |
| US-10072148-B2 | Resin composition, copper clad laminate and printed circuit board using same | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD. (CN) | 2018-09-11 | — | — | US | claimed |
| US-20180072884-A1 | RESIN COMPOSITION, COPPER CLAD LAMINATE AND PRINTED CIRCUIT BOARD USING SAME | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD. (CN) | 2018-03-15 | — | — | US | claimed |
| US-9850375-B2 | Resin composition, copper clad laminate and printed circuit board using same | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO. LTD. (CN) | 2017-12-26 | — | — | US | claimed |
| US-9650512-B2 | Halogen-free resin composition, copper clad laminate using the same, and printed circuit board using the same | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD (CN) | 2017-05-16 | — | — | US | claimed |
| US-20140178697-A1 | HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME | ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD (CN) | 2014-06-26 | — | — | US | claimed |
| US-20140178656-A1 | HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME | ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD (CN) | 2014-06-26 | — | — | US | claimed |
| US-20140178696-A1 | RESIN COMPOSITION, COPPER-CLAD LAMINATE AND PRINTED CIRCUIT BOARD FOR USE THEREWITH | Elite Material Co., Ltd. (TW) | 2014-06-26 | — | — | US | claimed |
| US-20140023839-A1 | HALOGEN-FREE RESIN COMPOSITION, COPPER CLAD LAMINATE USING THE SAME, AND PRINTED CIRCUIT BOARD USING THE SAME | ELITE ELECTRONIC MATERIAL (KUNSHAN) CO., LTD (CN) | 2014-01-23 | — | — | US | claimed |
| US-20130316155-A1 | HALOGEN-FREE RESIN COMPOSITION | ELITE ELECTRONIC MATERIAL (ZHONGSHAN) CO.,LTD (CN) | 2013-11-28 | — | — | US | claimed |
| CN-102250447-A | Halogen-free flame-retardant epoxy resin composition, and prepreg and printed circuit board made of same | TAIWAN UNION TECHNOLOGY CORP | 2011-11-23 | — | — | CN | claimed |
| CN-102134377-A | Electronic material composition | TAIWAN UNION TECHNOLOGY CORP | 2011-07-27 | — | — | CN | claimed |
| JP-2007530769-A | — | — | 2007-11-01 | — | — | JP | claimed |
| EP-1751222-A2 | LOW HEAT RELEASE AND LOW SMOKE REINFORCING FIBER/EPOXY COMPOSITES | Supresta U.S. LLC. (US) | 2007-02-14 | — | — | EP | claimed |
| WO-2005118276-A2 | LOW HEAT RELEASE AND LOW SMOKE REINFORCING FIBER/EPOXY COMPOSITES | SUPRESTA LLC. (US) | 2005-12-15 | — | — | WO | claimed |