SCHEMBL5069827

SCHEMBL5069827

C=CC(=O)OC[SiH2]OC(=O)C=C(C)C

nearest known ligand 0.40

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
TSHR P16473 8/20 0.40
HPGD P15428 1/20 0.39
ALDH1A1 P00352 5/20 0.38
TP53 P04637 3/20 0.38
HIF1A Q16665 3/20 0.38
CYP3A4 P08684 2/20 0.38
HSD17B10 Q99714 1/20 0.38
MAPK1 P28482 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
THRB P10828 2/20 0.33
ALOX15 P16050 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28035286 0.85 TSHR (0.46) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL7508195 0.80 TSHR (0.50) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL5406669 0.76 TSHR (0.50) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL28039850 0.75
SCHEMBL230818 0.74 TSHR (0.52) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL13750180 0.72 TSHR (0.47) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL10915048 0.71
SCHEMBL7262723 0.70 TSHR (0.42) TSHRHPGDALDH1A1TP53HIF1A
SCHEMBL14566179 0.70
SCHEMBL28473633 0.69 TSHR (0.53) TSHRHPGDALDH1A1TP53HIF1A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7368519-B2 Fast moisture curing and UV-moisture dual curing compositions HENKEL CORPORATION (US) 2008-05-06 US disclosed
EP-1578810-B1 FAST MOISTURE CURING AND UV-MOISTURE DUAL CURING COMPOSITIONS HENKEL CORP (US) 2007-03-28 EP disclosed
EP-1578810-A4 FAST MOISTURE CURING AND UV-MOISTURE DUAL CURING COMPOSITIONS HENKEL CORP (US) 2006-01-18 EP disclosed
US-20050267276-A1 Fast moisture curing and uv-moisture dual curing compositions HENKEL AG & CO. KGAA (DE) 2005-12-01 US disclosed
EP-1578810-A1 FAST MOISTURE CURING AND UV-MOISTURE DUAL CURING COMPOSITIONS Henkel Corporation (US) 2005-09-28 EP disclosed
US-6828355-B1 Resin-reinforced silicone compositions curable upon exposure to radiation in the electromagnetic spectrum, which when cured demonstrate improved elastomeric properties, such as tensile strength, modulus and elongation HENKEL CORPORATION 2004-12-07 US disclosed
WO-2004037868-A1 FAST MOISTURE CURING AND UV-MOISTURE DUAL CURING COMPOSITIONS HENKEL CORPORATION (US) 2004-05-06 WO disclosed
WO-2001005846-A1 RESIN-REINFORCED UV, MOISTURE AND UV/MOISTURE DUAL CURABLE SILICONE COMPOSITIONS LOCTITE CORPORATION (US) 2001-01-25 WO disclosed
EP-0487291-B1 Photocurable silicon composition, and method of making same LOCTITE CORP (US) 1999-09-29 EP disclosed
US-5348986-A Polysiloxanes capped with mixture of curable groups, gels, acrylated polymers LOCTITE CORPORATION (US) 1994-09-20 US disclosed
US-5212211-A Adhesives, coatings LOCTITE CORPORATION (US) 1993-05-18 US disclosed
US-5182315-A Endcapping LOCTITE CORPORATION (US) 1993-01-26 US disclosed
US-5179134-A Acryloyloxysilyl compound with a silicone and a photoinitiator for sealants, coatings and potting material which are curable LOCTITE CORPORATION (US) 1993-01-12 US disclosed
EP-0487291-A2 Photocurable silicon composition, and method of making same LOCTITE CORPORATION (US) 1992-05-27 EP disclosed