Predicted protein targets (top 4)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HCAR2 | Q8TDS4 | 4/20 | 0.42 |
| ▸ | KEAP1 | Q14145 | 1/20 | 0.42 |
| ▸ | NFE2L2 | Q16236 | 1/20 | 0.42 |
| ▸ | ATM | Q13315 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL5079220 | 1.00 | HCAR2 (0.42) | HCAR2KEAP1NFE2L2ATM | |
| SCHEMBL8907820 | 0.96 | HCAR2 (0.44) | HCAR2KEAP1NFE2L2ATM | |
| SCHEMBL10942191 | 0.96 | HCAR2 (0.44) | HCAR2KEAP1NFE2L2ATM | |
| SCHEMBL25292534 | 0.84 | — | — | |
| SCHEMBL28283660 | 0.83 | KEAP1 (0.33) | HCAR2KEAP1NFE2L2 | |
| SCHEMBL28673375 | 0.78 | — | — | |
| SCHEMBL28039316 | 0.78 | — | — | |
| SCHEMBL26645226 | 0.78 | — | — | |
| SCHEMBL8064428 | 0.72 | — | — | |
| SCHEMBL4637708 | 0.72 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-1497374-B1 | FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | GEN ELECTRIC (US) | 2008-08-13 | — | — | EP | disclosed |
| US-7244778-B2 | Filler reinforced polyether imide resin composition and molded article thereof | GENERAL ELECTRIC COMPANY (US) | 2007-07-17 | — | — | US | disclosed |
| US-20050131105-A1 | Filler reinforced polyether imide resin composition and molded article thereof | SHPP GLOBAL TECHNOLOGIES B.V. (NL) | 2005-06-16 | — | — | US | disclosed |
| EP-1497374-A1 | FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | GENERAL ELECTRIC COMPANY (US) | 2005-01-19 | — | — | EP | disclosed |
| WO-2003087226-A1 | FILLER REINFORCED POLYETHER IMIDE RESIN COMPOSITION AND MOLDED ARTICLE THEREOF | GENERAL ELECTRIC COMPAMY (US) | 2003-10-23 | — | — | WO | disclosed |