SCHEMBL5088882

SCHEMBL5088882

CCCCC(CC)c1ncc[nH]1

nearest known ligand 0.72

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
CYP1A2 P05177 1/20 0.41
CYP3A4 P08684 1/20 0.41
CYP2D6 P10635 1/20 0.41
CYP19A1 P11511 1/20 0.41
CYP2C9 P11712 1/20 0.41
CYP2C19 P33261 1/20 0.41
F2RL1 P55085 8/20 0.38
TXN P10599 1/20 0.37
TXNRD1 Q16881 1/20 0.37
FPR2 P25090 3/20 0.36
ALDH1A1 P00352 1/20 0.33
SMN1; SMN2 Q16637 1/20 0.33
ADRA2A P08913 1/20 0.33
ADRA2B P18089 1/20 0.33
ADRA2C P18825 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18923160 1.00 CYP1A2 (0.41) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9
SCHEMBL10627595 0.95 CYP1A2 (0.41) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9
Hydrochloric Acid SCHEMBL29272006 0.93 CYP1A2 (0.40) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9
SCHEMBL31296113 0.93 CYP1A2 (0.40) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9
SCHEMBL23317281 0.93 CYP1A2 (0.44) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9
SCHEMBL11489170 0.89 CYP1A2 (0.41) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9
SCHEMBL11576785 0.89 FPR2 (0.41) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9
SCHEMBL20098056 0.88 CYP1A2 (0.41) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9
SCHEMBL9228883 0.88 CYP1A2 (0.41) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9
SCHEMBL10612996 0.88 CYP1A2 (0.41) CYP1A2CYP3A4CYP2D6CYP19A1CYP2C9

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 9 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240118612-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING RESIST PATTERN FILM, AND METHOD FOR MANUFACTURING PLATED SHAPED ARTICLE JSR CORPORATION (JP) 2024-04-11 US disclosed
CN-117784520-A Photosensitive resin composition, method for producing resist pattern film, and method for producing plating molded article JSR株式会社 2024-03-29 CN disclosed
CN-114644860-A Pigment dispersion composition for black matrix, resist composition for black matrix, and black matrix 阪田油墨株式会社 2022-06-21 CN disclosed
EP-3369732-B1 ANDROGEN RECEPTOR MODULATING COMPOUNDS ORION CORP (FI) 2021-05-26 EP disclosed
CN-105087182-B Circuit board having solder solidified thereon, method for producing circuit board having electronic component mounted thereon, and cleaning agent composition for flux 花王株式会社 2020-08-14 CN disclosed
WO-2008006834-A2 USE OF IMIDAZOLE COMPOUNDS AS PLASTICISERS BASF SE (DE) 2008-01-17 WO disclosed
US-4776979-A POLYMER CONTAINING POWDER COATED WITH AMINE AND SILANE MITSUBISHI PETROCHEMICAL COMPANY LIMITED (JP) 1988-10-11 US disclosed
US-4680140-A Metal powder-containing compositions MITSUBISHI PETROCHEMICAL COMPANY LIMITED (JP) 1987-07-14 US disclosed
US-4074054-A Imidazoles and 2-alkyl imidazoles and method for their manufacture NOBEL HOECHST CHIMIE (FR) 1978-02-14 US disclosed