⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2723985 | 0.78 | — | — | |
| SCHEMBL27941492 | 0.63 | — | — | |
| SCHEMBL20240849 | 0.63 | — | — | |
| SCHEMBL208611 | 0.62 | — | — | |
| SCHEMBL8375510 | 0.59 | — | — | |
| SCHEMBL12769065 | 0.59 | — | — | |
| SCHEMBL28364192 | 0.59 | — | — | |
| SCHEMBL2406650 | 0.59 | — | — | |
| SCHEMBL7713866 | 0.59 | — | — | |
| SCHEMBL15180183 | 0.59 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 577 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-6348725-B1 | — | — | None | — | — | US | claimed |
| WO-2025229081-A1 | ORGANOAMINO-CARBOSILANES AND METHODS FOR DEPOSITING SILICONCONTAINING FILMS USING SAME | MERCK PATENT GMBH (DE) | 2025-11-06 | — | — | WO | claimed |
| EP-3684778-B1 | INTEGRATED PROCESS FOR THE MANUFACTURE OF METHYLCHLOROHYDRIDOMONOSILANES | MOMENTIVE PERFORMANCE MAT INC (US) | 2023-08-02 | — | — | EP | claimed |
| US-11518773-B2 | Integrated process for the manufacture of methylchlorohydridomonosilanes | MOMENTIVE PERFORMANCE MATERIALS INC. (US) | 2022-12-06 | — | — | US | claimed |
| US-11090683-B2 | Cure method for cross-linking Si-hydroxyl bonds | APPLIED MATERIALS, INC. (US) | 2021-08-17 | — | — | US | claimed |
| WO-2020117496-A1 | CURE METHODS FOR CROSS-LINKING SI-HYDROXYL BONDS | APPLIED MATERIALS, INC. (US) | 2020-06-11 | — | — | WO | claimed |
| US-20200171536-A1 | CURE METHOD FOR CROSS-LINKING SI-HYDROXYL BONDS | APPLIED MATERIALS, INC. | 2020-06-04 | — | — | US | claimed |
| US-20190221771-A1 | BUFFER LAYER FOR ORGANIC LIGHT EMITTING DEVICES AND METHOD OF MAKING THE SAME | UNIVERSAL DISPLAY CORPORATION | 2019-07-18 | — | — | US | claimed |
| US-20170117503-A1 | BUFFER LAYER FOR ORGANIC LIGHT EMITTING DEVICES AND METHOD OF MAKING THE SAME | UNIVERSAL DISPLAY CORPORATION | 2017-04-27 | — | — | US | claimed |
| US-20160118621-A1 | HYBRID BARRIER LAYER FOR SUBSTRATES AND ELECTRONIC DEVICES | UNIVERSAL DISPLAY CORPORATION | 2016-04-28 | — | — | US | claimed |
| US-6348725-B2 | Plasma processes for depositing low dielectric constant films | APPLIED MATERIALS, INC. | 2002-02-19 | — | — | US | claimed |
| EP-1148539-A2 | Method of depositing low K films using an oxidizing plasma | APPLIED MATERIALS, INC. (US) | 2001-10-24 | — | — | EP | claimed |
| US-20010026849-A1 | Method of improving moisture resistance of low dielectric constant films | APPLIED MATERIALS, INC. | 2001-10-04 | — | — | US | claimed |
| EP-1131846-A1 | CVD NANOPOROUS SILICA LOW DIELECTRIC CONSTANT FILMS | Applied Materials, Inc. (US) | 2001-09-12 | — | — | EP | claimed |
| EP-1119035-A2 | Method for depositing a low dielectric constant film | Applied Materials, Inc. (US) | 2001-07-25 | — | — | EP | claimed |
| US-20010005546-A1 | PLASMA PROCESSES FOR DEPOSITING LOW DIELECTRIC CONSTANT FILMS | APPLIED MATERIALS, INC. | 2001-06-28 | — | — | US | claimed |
| US-6245690-B1 | EXPOSING PLASMA ENHANCED CHEMICAL VAPOR DEPOSITED FILM OF OXIDIZED ORGANOSILICON COMPOUND TO A HYDROPHOBIC-IMPARTING SURFACTANT SUCH AS HEXAMETHYLDISILAZANE PRIOR TO THERMALLY CURING TO CONTROL CARBON CONTENT IN DEPOSITED FILM | APPLIED MATERIALS, INC. | 2001-06-12 | — | — | US | claimed |
| US-6171945-B1 | CVD nanoporous silica low dielectric constant films | APPLIED MATERIALS, INC. | 2001-01-09 | — | — | US | claimed |
| EP-1063692-A1 | Process for depositing a low dielectric constant film | Applied Materials, Inc. (US) | 2000-12-27 | — | — | EP | claimed |
| WO-2000024050-A1 | CVD NANOPOROUS SILICA LOW DIELECTRIC CONSTANT FILMS | APPLIED MATERIALS, INC. (US) | 2000-04-27 | — | — | WO | claimed |