⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL704982 | 0.84 | — | — | |
| SCHEMBL31096364 | 0.69 | — | — | |
| SCHEMBL3423924 | 0.65 | — | — | |
| SCHEMBL960448 | 0.65 | — | — | |
| SCHEMBL1451452 | 0.65 | — | — | |
| SCHEMBL1277405 | 0.65 | — | — | |
| SCHEMBL8068777 | 0.65 | — | — | |
| SCHEMBL2247304 | 0.65 | — | — | |
| SCHEMBL1238451 | 0.65 | — | — | |
| SCHEMBL9187316 | 0.65 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 232 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-117264404-A | Quick self-healing double-network anti-icing organogel and preparation method and application thereof | 济南大学 | 2023-12-22 | — | — | CN | claimed |
| CN-116745361-A | Resin composition, resin film, substrate, polymer, and polymerizable monomer | 中央硝子株式会社 | 2023-09-12 | — | — | CN | claimed |
| CN-1779569-A | Fluorinated cyclic olefin polymer and application thereof in deep ultraviolet photoresist | KEHUA MIRCOELECTRONICS MATERIA (CN) | 2006-05-31 | — | — | CN | claimed |
| CN-117264404-A | Quick self-healing double-network anti-icing organogel and preparation method and application thereof | 济南大学 | 2023-12-22 | — | — | CN | disclosed |
| CN-110609445-B | Polyoxometalate and heteropolyoxometalate compositions and methods of use thereof | 默克专利有限公司 | 2023-10-03 | — | — | CN | disclosed |
| CN-116848162-A | Fluorine-containing polymer | 中央硝子株式会社 | 2023-10-03 | — | — | CN | disclosed |
| CN-116615410-A | Method for producing fluorine-containing polymer and composition | 中央硝子株式会社 | 2023-08-18 | — | — | CN | disclosed |
| CN-114656594-B | Preparation method and application of high-strength anti-icing organogel | 济南大学 | 2023-08-15 | — | — | CN | disclosed |
| CN-114656594-B | Preparation method and application of high-strength anti-icing organogel | 济南大学 | 2023-08-15 | — | — | CN | disclosed |
| US-11421128-B2 | Composition of spin-on materials containing metal oxide nanoparticles and an organic polymer | MERCK PATENT GMBH (DE) | 2022-08-23 | — | — | US | disclosed |
| CN-114656594-A | Preparation method and application of high-strength anti-icing organogel | 济南大学 | 2022-06-24 | — | — | CN | disclosed |
| CN-1779569-A | Fluorinated cyclic olefin polymer and application thereof in deep ultraviolet photoresist | KEHUA MIRCOELECTRONICS MATERIA (CN) | 2006-05-31 | — | — | CN | disclosed |
| WO-2006046137-A1 | A COMPOSITION FOR COATING OVER A PHTORESIST PATTERN | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2006-05-04 | — | — | WO | disclosed |
| US-20060088788-A1 | Composition for coating over a photoresist pattern | MERCK PATENT GMBH (DE) | 2006-04-27 | — | — | US | disclosed |
| WO-2005088397-A2 | A PROCESS OF IMAGING A DEEP ULTRAVIOLET PHOTORESIST WITH A TOP COATING AND MATERIALS THEREOF | AZ ELECTRONIC MATERIALS USA CORP. (DE) | 2005-09-22 | — | — | WO | disclosed |
| US-20050202351-A1 | Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof | CLARIANT INTERNATIONAL LTD. (CH) | 2005-09-15 | — | — | US | disclosed |
| US-20050202340-A1 | Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof | MERCK PATENT GMBH (DE) | 2005-09-15 | — | — | US | disclosed |
| US-20050202347-A1 | Process of imaging a deep ultraviolet photoresist with a top coating and materials thereof | AZ ELECTRONIC MATERIALS USA CORP. | 2005-09-15 | — | — | US | disclosed |
| US-20040166434-A1 | Photoresist composition for deep ultraviolet lithography | AZ ELECTRONIC MATERIALS USA CORP. | 2004-08-26 | — | — | US | disclosed |
| US-20040166433-A1 | Photoresist composition for deep ultraviolet lithography | AZ ELECTRONIC MATERIALS USA CORP. | 2004-08-26 | — | — | US | disclosed |