SCHEMBL513176

SCHEMBL513176

[c]1ccc2cc3ccc[c]c3cc2c1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL511953 1.00
SCHEMBL4321151 0.98
SCHEMBL17044566 0.86
SCHEMBL18832 0.83 ALDH1A1 (0.36)
SCHEMBL17044609 0.82
SCHEMBL25147 0.81 ALDH1A1 (0.39)
SCHEMBL28997726 0.81 ALDH1A1 (0.39)
SCHEMBL15366695 0.81 ALDH1A1 (0.39)
SCHEMBL28474556 0.81 ALDH1A1 (0.39)
SCHEMBL29033245 0.81 ALDH1A1 (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 106 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20210069963-A1 METHOD FOR MANUFACTURING A THREE-DIMENSIONAL OBJECT SOLVAY SPECIALITY POLYMERS USA, LLC 2021-03-11 US claimed
CN-111479874-A Method for producing a three-dimensional object 索尔维特殊聚合物美国有限责任公司 2020-07-31 CN claimed
EP-4398285-A1 ADHESIVE COMPOSITION, MULTILAYER BODY, AND METHOD FOR PRODUCING PROCESSED SEMICONDUCTOR SUBSTRATE Nissan Chemical Corporation (JP) 2024-07-10 EP disclosed
US-20240201593-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM NISSAN CHEMICAL CORPORATION (JP) 2024-06-20 US disclosed
WO-2024122572-A1 WAVELENGTH CONVERSION FILM-FORMING COMPOSITION AND FUSED THIOPHENE COMPOUND 日産化学株式会社 2024-06-13 WO disclosed
EP-4369380-A1 LAYERED BODY MANUFACTURING METHOD, AND KIT FOR ADHESIVE COMPOSITION Nissan Chemical Corporation (JP) 2024-05-15 EP disclosed
CN-117940850-A Composition for forming silicon-containing resist underlayer film, laminate using same, and method for producing semiconductor element 日产化学株式会社 2024-04-26 CN disclosed
CN-117882172-A Adhesive composition, laminate, and method for producing processed semiconductor substrate 日产化学株式会社 2024-04-12 CN disclosed
WO-2024063044-A1 COMPOSITION FOR FORMING SILICON-CONTAINING RESIST UNDERLAYER FILM 日産化学株式会社 2024-03-28 WO disclosed
CN-117716295-A Composition for forming silicon-containing resist underlayer film and silicon-containing resist underlayer film 日产化学株式会社 2024-03-15 CN disclosed
CN-117716474-A Method for producing laminate and kit of adhesive composition 日产化学株式会社 2024-03-15 CN disclosed
US-20090069511-A1 Polyarylene Composition and Articles Made Therefrom SOLVAY ADVANCED POLYMERS, L.L.C. (US) 2009-03-12 US disclosed
US-20090036594-A1 Reinforced Blend SOLVAY ADVANCED POLYMERS, L.L.C. (US) 2009-02-05 US disclosed
US-20080312387-A1 New Polyarylene Composition SOLVAY ADVANCED POLYMERS, L.L.C. (US) 2008-12-18 US disclosed
EP-2001955-A2 NEW POLYARYLENE COMPOSITION AND ARTICLES MADE THEREFROM Solvay Advanced Polymers, L.L.C. (US) 2008-12-17 EP disclosed
EP-1994093-A2 NEW POLYARYLENE COMPOSITION Solvay Advanced Polymers, L.L.C. (US) 2008-11-26 EP disclosed
WO-2007101857-A2 NEW POLYARYLENE COMPOSITION SOLVAY ADVANCED POLYMERS, L.L.C. (US) 2007-09-13 WO disclosed
WO-2007101852-A2 NEW POLYARYLENE COMPOSITION AND ARTICLES MADE THEREFROM SOLVAY ADVANCED POLYMERS, L.L.C. (US) 2007-09-13 WO disclosed
CN-1281440-A Perylene imide monocarboxylic acids as colorants CIBA SC HOLDING AG (CH) 2001-01-24 CN disclosed
US-6166210-A Perylene imide monocarboxylic acids CIBA SPECIALTY CHEMICALS CORPORATION (US) 2000-12-26 US disclosed