SCHEMBL513201

SCHEMBL513201

OCCCCCCCCCC=COC=CCCCCCCCCCO

nearest known ligand 0.33

Predicted protein targets (top 8)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.33
ALDH1A1 P00352 1/20 0.33
HSD17B10 Q99714 1/20 0.33
MEN1 O00255 1/20 0.33
KMT2A Q03164 1/20 0.33
TSHR P16473 1/20 0.33
CNR2 P34972 2/20 0.30
TRPV1 Q8NER1 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL3231035 1.00 LMNA (0.33) LMNAALDH1A1HSD17B10MEN1KMT2A
SCHEMBL2414547 1.00 LMNA (0.33) LMNAALDH1A1HSD17B10MEN1KMT2A
SCHEMBL9189894 1.00 LMNA (0.33) LMNAALDH1A1HSD17B10MEN1KMT2A
SCHEMBL2413354 1.00 LMNA (0.33) LMNAALDH1A1HSD17B10MEN1KMT2A
SCHEMBL9190940 1.00 LMNA (0.33) LMNAALDH1A1HSD17B10MEN1KMT2A
SCHEMBL7556956 1.00 LMNA (0.33) LMNAALDH1A1HSD17B10MEN1KMT2A
SCHEMBL7554752 1.00 LMNA (0.33) LMNAALDH1A1HSD17B10MEN1KMT2A
SCHEMBL75522 0.97 SMN1; SMN2 (0.30)
SCHEMBL1048508 0.89
SCHEMBL9512584 0.84

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 42 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8742025-B2 Adhesive composition and polarizing plate comprising the same DONGWOO FINE-CHEM CO., LTD. (KR) 2014-06-03 US claimed
US-20110293933-A1 Adhesive composition and polarizing plate comprising the same DONGWOO FINE-CHEM CO., LTD. (KR) 2011-12-01 US claimed
CN-113272383-B Composition and method for producing the same 电化株式会社 2023-11-17 CN disclosed
CN-113227169-B Sealant, cured body, organic electroluminescent display device, and method for manufacturing device 电化株式会社 2023-10-31 CN disclosed
CN-115279768-A Stereoisomer of epoxy compound, curable composition containing same, and cured product obtained by curing curable composition 引能仕株式会社 2022-11-01 CN disclosed
CN-114746392-A Alicyclic acrylate compound, alicyclic epoxy acrylate compound, curable composition, and cured product 引能仕株式会社 2022-07-12 CN disclosed
CN-113646354-A Curable composition and cured product thereof 引能仕株式会社 2021-11-12 CN disclosed
CN-109312056-B Epoxy compound, curable composition containing same, and cured product obtained by curing curable composition JXTG能源株式会社 2021-10-01 CN disclosed
CN-109311906-B Epoxy compound, curable composition containing same, and cured product obtained by curing curable composition JXTG能源株式会社 2021-08-03 CN disclosed
CN-113072684-A Curable composition and cured product obtained by curing same JXTG能源株式会社 2021-07-06 CN disclosed
CN-109071776-B Curable composition and cured product obtained by curing same JXTG能源株式会社 2021-06-08 CN disclosed
US-20090087626-A1 INK COMPOSITION, INKJET RECORDING METHOD, PRINTED MATERIAL, AND PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
US-20090085256-A1 IMAGE FORMING METHOD AND APPARATUS FUJIFILM CORPORATION (JP) 2009-04-02 US disclosed
EP-2042574-A1 White ink composition, inkjet recording method, and printed material FUJIFILM Corporation (JP) 2009-04-01 EP disclosed
EP-2042572-A1 Ink composition, inkjet recording method, printed material, and process for producing molded printed material FUJIFILM Corporation (JP) 2009-04-01 EP disclosed
EP-1975213-A1 Ink composition, injet recording method, printed material, and process for producing lithographic printing plate FUJIFILM Corporation (JP) 2008-10-01 EP disclosed
US-20080075882-A1 PROCESS FOR PRODUCING MOLDED PRINTED MATERIAL, AND MOLDED PRINTED MATERIAL FUJIFILM CORPORATION (JP) 2008-03-27 US disclosed
US-20080008966-A1 Ink composition, inkjet recording method, printed material, and process for producing lithographic printing plate FUJIFILM CORPORATION (JP) 2008-01-10 US disclosed
EP-1876209-A1 Ink composition, inkjet recording method, printed material, and process for producing lithographic printing plate FUJIFILM Corporation (JP) 2008-01-09 EP disclosed
US-20030105266-A1 Curable resin composition YOKOHAMA RUBBER CO., LTD. (JP) 2003-06-05 US disclosed