SCHEMBL513591

SCHEMBL513591

OCCN(CCO)Cn1nnc2ccccc21

nearest known ligand 0.53

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
SLC9A1 P19634 8/20 0.53
GRM2 Q14416 2/20 0.50
KCNMA1 Q12791 1/20 0.49
EGLN3 Q9H6Z9 1/20 0.49
RAB9A P51151 2/20 0.48
MGAM O43451 1/20 0.48
AMY1A P0DUB6 1/20 0.48
GAA P10253 1/20 0.48
SI P14410 1/20 0.48
MGAM2 Q2M2H8 1/20 0.48
NPC1 O15118 1/20 0.47
MAPT P10636 1/20 0.47
RPS6KA3 P51812 1/20 0.47
TDP1 Q9NUW8 1/20 0.46
GLA P06280 1/20 0.46
TSHR P16473 1/20 0.46
APAF1 O14727 1/20 0.46
POLB P06746 1/20 0.46

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29765594 1.00 SLC9A1 (0.53) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL11536425 0.97 SLC9A1 (0.53) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL22280919 0.91 SLC9A1 (0.50) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL20713929 0.87 SLC9A1 (0.56) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL31483490 0.86 SLC9A1 (0.63) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL5788883 0.86 SLC9A1 (0.57) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL29413796 0.86 SLC9A1 (0.57) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL31483489 0.84 SLC9A1 (0.61) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL8511223 0.84 SLC9A1 (0.63) SLC9A1GRM2KCNMA1EGLN3RAB9A
SCHEMBL31344211 0.83 SLC9A1 (0.59) SLC9A1GRM2KCNMA1EGLN3RAB9A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 246 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9902925-B2 Cleaner composition for process of manufacturing semiconductor and display SAMSUNG DISPLAY CO., LTD. (KR) 2018-02-27 US claimed
US-9869027-B2 Cleaning composition and method of manufacturing metal wiring using the same SAMSUNG DISPLAY CO., LTD. (KR) 2018-01-16 US claimed
US-9486892-B2 Polishing composition FUJIMI INCORPORATED (JP) 2016-11-08 US claimed
US-20160230289-A1 CLEANING COMPOSITION AND METHOD OF MANUFACTURING METAL WIRING USING THE SAME SAMSUNG DISPLAY CO LTD (KR) 2016-08-11 US claimed
US-20160215241-A1 CLEANER COMPOSITION FOR PROCESS OF MANUFACTURING SEMICONDUCTOR AND DISPLAY SAMSUNG DISPLAY CO., LTD. (KR) 2016-07-28 US claimed
US-20150136728-A1 CLEANING COMPOSITION AND METHOD OF MANUFACTURING METAL WIRING USING THE SAME SAMSUNG DISPLAY CO., LTD. (KR) 2015-05-21 US claimed
CN-102277242-B Cleaning agent composition DONGWOO FINE CHEM CO LTD 2015-01-07 CN claimed
US-8864860-B2 Polishing composition FUJIMI INCORPORATED (JP) 2014-10-21 US claimed
US-8715524-B2 Polishing liquid FUJIFILM CORPORATION (JP) 2014-05-06 US claimed
US-20090004863-A1 POLISHING LIQUID AND POLISHING METHOD USING THE SAME FUJIFILM CORPORATION (JP) 2009-01-01 US claimed
US-20080203354-A1 POLISHING LIQUID FUJIFILM CORPORATION (JP) 2008-08-28 US claimed
US-20070181534-A1 Barrier polishing liquid and chemical mechanical polishing method FUJIFILM CORPORATION (JP) 2007-08-09 US claimed
US-6814767-B2 SILICA SOL, POLYOXYETHYLENE ALKYL ETHER SULFATE, BENZOTRIAZOLE CORROSION INHIBITOR, ACID AND WATER; INSULATING LAYER EROSION PREVENTION FUJIMI INCORPORATED (JP) 2004-11-09 US claimed
US-20040134376-A1 Polishing composition FUJIMI INCORPORATED (JP) 2004-07-15 US claimed
EP-4471834-B1 POLISHING SOLUTION AND POLISHING METHOD FUJIFILM CORP (JP) 2026-03-04 EP disclosed
US-20250189895-A1 METHOD OF MANUFACTURING PLATED ARTICLE TOKYO OHKA KOGYO CO., LTD. (JP) 2025-06-12 US disclosed
WO-2025105122-A1 METHOD FOR MANUFACTURING MODIFIED SUBSTRATE, METHOD FOR MANUFACTURING ELECTRONIC DEVICE, AND KIT 富士フイルム株式会社 2025-05-22 WO disclosed
US-6814767-B2 SILICA SOL, POLYOXYETHYLENE ALKYL ETHER SULFATE, BENZOTRIAZOLE CORROSION INHIBITOR, ACID AND WATER; INSULATING LAYER EROSION PREVENTION FUJIMI INCORPORATED (JP) 2004-11-09 US disclosed
US-20040134376-A1 Polishing composition FUJIMI INCORPORATED (JP) 2004-07-15 US disclosed
US-4407882-A FOAMING INHIBITOR CIBA-GEIGY CORPORATION (US) 1983-10-04 US disclosed