SCHEMBL513804

SCHEMBL513804

C=C(CCCCCCCCCCCCC(C)C)C(=O)O

nearest known ligand 0.52

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KDM4C Q9H3R0 2/20 0.47
KDM4A O75164 1/20 0.47
PHF8 Q9UPP1 1/20 0.47
KDM2A Q9Y2K7 1/20 0.47
TBXAS1 P24557 2/20 0.40
BLM P54132 1/20 0.39
FFAR4 Q5NUL3 1/20 0.37
FFAR1 O14842 1/20 0.37
CA1 P00915 2/20 0.37
LTA4H P09960 1/20 0.36
ALDH1A1 P00352 1/20 0.36
LMNA P02545 1/20 0.36
DEGS1 O15121 1/20 0.36
KDM1A O60341 1/20 0.35
TET2 Q6N021 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL966313 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL26700 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL14936541 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL1026046 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL8647496 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL920756 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL10788708 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL24391 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL138197 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL14936108 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 244 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-9046515-B2 Polymer compound for medical material, and biochip substrate using the polymer compound SUMITOMO BAKELITE COMPANY, LTD. (JP) 2015-06-02 US claimed
US-12036808-B2 Ink jet recording method using temporary curing radiation SEIKO EPSON CORPORATION (JP) 2024-07-16 US disclosed
US-20240141192-A1 ACTIVE ENERGY RAY-CURABLE INKJET INK COMPOSITION SAKATA INX CORPORATION (JP) 2024-05-02 US disclosed
WO-2024047976-A1 PHOTOCURABLE INK-JET INK COMPOSITION サカタインクス株式会社 2024-03-07 WO disclosed
WO-2024029176-A1 PHOTOCURABLE INKJET INK COMPOSITION KJケミカルズ株式会社 2024-02-08 WO disclosed
EP-4316848-A1 ACTIVE ENERGY RAY-CURABLE INK COMPOSITION FOR INKJET Sakata INX Corporation (JP) 2024-02-07 EP disclosed
US-20230407129-A1 COATING COMPOSITION HAVING HIGH SOLID CONTENT AND METHOD FOR FORMING MULTILAYER COATING FILM KANSAI PAINT CO., LTD. (JP) 2023-12-21 US disclosed
EP-4289931-A1 MICROCARRIER FOR CELL CULTURE AND CELL CULTURE METHOD SEKISUI CHEMICAL CO., LTD. (JP) 2023-12-13 EP disclosed
US-20230392035-A1 COATING COMPOSITION HAVING HIGH SOLID CONTENT AND METHOD FOR FORMING MULTILAYER COATING FILM KANSAI PAINT CO., LTD. (JP) 2023-12-07 US disclosed
EP-4279553-A2 INK COMPOSITION, PROCESS FOR PRODUCING SAME, AND INK-JET INK SET AND INK-JET PRINTING SYSTEM BOTH INCLUDING SAID INK COMPOSITION Maxell, Ltd. (JP) 2023-11-22 EP disclosed
US-20080220249-A1 Adhesive Sheet for Glass Protection and Protective Film for Automobile Glass NITTO DENKO CORPORATION (JP) 2008-09-11 US disclosed
US-7385007-B2 Pressure sensitive adhesive composition for optical members, pressure sensitive adhesive layer for optical members, pressure sensitive adhesive optical member and image display NITTO DENKO CORPORATION (JP) 2008-06-10 US disclosed
US-7282531-B2 Acrylic resin composition dispersed in water NIPPON SHOKUBAI CO., LTD. (JP) 2007-10-16 US disclosed
EP-1582570-B1 Acrylic resin composition dispersed in water NIPPON CATALYTIC CHEM IND (JP) 2007-04-11 EP disclosed
US-20070037942-A1 Preparation of reactive polymeric nanoparticles BORBELY JANOS 2007-02-15 US disclosed
US-7135518-B2 Curable compositions, sealing material, and adhesive SEKISUI CHEMICAL CO., LTD. (JP) 2006-11-14 US disclosed
US-20050221107-A1 Acrylic resin composition dispersed in water NIPPON SHOKUBAI CO., LTD. (JP) 2005-10-06 US disclosed
EP-1582570-A1 Acrylic resin composition dispersed in water Nippon Shokubai Co., Ltd. (JP) 2005-10-05 EP disclosed
US-20050014879-A1 Pressure sensitive adhesive composition for optical members, pressure sensitive adhesive layer for optical members, pressure sensitive adhesive optical member and image display NITTO DENKO CORPORATION (JP) 2005-01-20 US disclosed
US-6465537-B1 TACKIFYING POLYMER VIA RADICAL POLYMERIZATION WHICH RAPIDLY CURES VIA CATIONIC POLYMERIZATION; ETHYLENICALLY UNSATURATED COMPOUND, EPOXY RESIN, FREE RADICAL AND CATIONIC CATALYSTS AND A CROWN ETHER SEKISUI CHEMICAL CO., LTD. (JP) 2002-10-15 US disclosed