SCHEMBL966313

SCHEMBL966313

C=C(CCCCCCCCCCCCCCC(C)C)C(=O)O

nearest known ligand 0.52

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
KDM4C Q9H3R0 2/20 0.47
KDM4A O75164 1/20 0.47
PHF8 Q9UPP1 1/20 0.47
KDM2A Q9Y2K7 1/20 0.47
TBXAS1 P24557 2/20 0.40
BLM P54132 1/20 0.39
FFAR4 Q5NUL3 1/20 0.37
FFAR1 O14842 1/20 0.37
CA1 P00915 2/20 0.37
LTA4H P09960 1/20 0.36
ALDH1A1 P00352 1/20 0.36
LMNA P02545 1/20 0.36
DEGS1 O15121 1/20 0.36
KDM1A O60341 1/20 0.35
TET2 Q6N021 1/20 0.34

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL26700 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL513804 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL14936541 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL1026046 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL8647496 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL920756 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL10788708 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL24391 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL138197 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1
SCHEMBL14936108 1.00 KDM4C (0.47) KDM4CKDM4APHF8KDM2ATBXAS1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4202004-A1 PRESSURE-SENSITIVE ADHESIVE FOR BONDING PRINTING PLATES tesa SE (DE) 2023-06-28 EP claimed
US-9046515-B2 Polymer compound for medical material, and biochip substrate using the polymer compound SUMITOMO BAKELITE COMPANY, LTD. (JP) 2015-06-02 US claimed
WO-2024009895-A1 COMPOSITION CONTAINING (METH)ACRYLIC POLYMER AND METAL PARTICLES 株式会社レゾナック 2024-01-11 WO disclosed
WO-2023248906-A1 SHEET PROVIDED WITH HEAT INSULATING LAYER AND ADHESIVE LAYER 株式会社レゾナック 2023-12-28 WO disclosed
WO-2023248902-A1 SHEET COMPRISING THERMAL INSULATION LAYER AND ADHESIVE LAYER 株式会社レゾナック 2023-12-28 WO disclosed
WO-2023223978-A1 COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ESTER-BASED THIXOTROPY-IMPARTING AGENT 株式会社レゾナック 2023-11-23 WO disclosed
WO-2023223979-A1 COMPOSITION THAT CONTAINS COMPOUND HAVING POLYOXYALKYLENE CHAIN AND ACRYLIC COPOLYMER 株式会社レゾナック 2023-11-23 WO disclosed
EP-4202004-A1 PRESSURE-SENSITIVE ADHESIVE FOR BONDING PRINTING PLATES tesa SE (DE) 2023-06-28 EP disclosed
US-20200254734-A1 DOUBLE-SIDED PRESSURE-SENSITIVE ADHESIVE TAPE NITTO DENKO CORPORATION (JP) 2020-08-13 US disclosed
EP-3395910-A1 RESIN COMPOSITION, SUBSTRATE, AND CELL CULTURE METHOD AGC Inc. (JP) 2018-10-31 EP disclosed
EP-2935346-B1 POLYMER COMPOSITIONS OF ETHYLENE-VINYL ESTER COPOLYMERS AND ALKYL(METH)ACRYLATES, METHOD FOR THE PRODUCTION THEREOF AND USE THEREOF AS POUR-POINT DEPRESSANTS FOR CRUDE OILS, MINERAL OILS OR MINERAL OIL PRODUCTS BASF SE (DE) 2017-04-26 EP disclosed
US-20130316932-A1 GLYCOPEPTIDE ARRAY SUMITOMO BAKELITE CO., LTD. (JP) 2013-11-28 US disclosed
US-8557911-B2 Aqueous colloidal dispersions stabilized with polymeric dispersants EASTMAN KODAK COMPANY (US) 2013-10-15 US disclosed
US-20130260137-A1 ADHESIVE COMPOSITION SOLVENTUM INTELLECTUAL PROPERTIES COMPANY 2013-10-03 US disclosed
EP-2645103-A1 GLYCOPEPTIDE ARRAY National University Corporation Hokkaido University (JP) 2013-10-02 EP disclosed
US-20130196881-A1 SUGAR CHAIN ARRAY NATIONAL UNIVERSITY CORPORATION HOKKAIDO UNIVERSITY (JP) 2013-08-01 US disclosed
EP-2600152-A1 SUGAR CHAIN ARRAY Sumitomo Bakelite Co., Ltd. (JP) 2013-06-05 EP disclosed
US-20130122288-A1 PRESSURE-SENSITIVE ADHESIVE COMPOSITION AND PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2013-05-16 US disclosed
US-20110003091-A1 ACRYLIC PRESSURE SENSITIVE ADHESIVE COMPOSITIONS HAVING PLASTICIZER LG CHEM, LTD. (KR) 2011-01-06 US disclosed
US-20090170989-A1 AQUEOUS COLLOIDAL DISPERSIONS STABILIZED WITH POLYMERIC DISPERSANTS BANK OF AMERICA, N.A., AS AGENT 2009-07-02 US disclosed