SCHEMBL5144718

SCHEMBL5144718

CCCCC(CCC)C1CCCO1

nearest known ligand 0.33

Predicted protein targets (top 5)

geneUniProtsupporting neighboursconfidence
EPHX1 P07099 1/20 0.33
THRB P10828 1/20 0.32
PDK1 Q15118 1/20 0.32
HPGD P15428 1/20 0.31
ALDH1A1 P00352 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19333960 0.89 EPHX1 (0.41) EPHX1PDK1HPGDALDH1A1
SCHEMBL11574125 0.86 EPHX1 (0.32) EPHX1THRBPDK1HPGD
SCHEMBL15695053 0.85 ALDH1A1 (0.33) HPGDALDH1A1
SCHEMBL10856188 0.84 EPHX1 (0.32) EPHX1HPGD
SCHEMBL10854491 0.84 EPHX1 (0.35) EPHX1PDK1HPGDALDH1A1
SCHEMBL10859462 0.84 EPHX1 (0.35) EPHX1PDK1HPGDALDH1A1
SCHEMBL10850977 0.82 EPHX1 (0.33) EPHX1PDK1
SCHEMBL27544461 0.81 HPGD (0.31) HPGD
SCHEMBL10855457 0.80 EPHX1 (0.39) EPHX1PDK1HPGDALDH1A1
SCHEMBL10855727 0.80 EPHX1 (0.39) EPHX1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-100477178-C Printed circuit board SONY CORP TAKAHASHI KEN (JP) 2009-04-08 CN disclosed
US-7297423-B2 An insulator containing dispersed superparamagnetic nanoparticles having a blocking temperature at 80 degrees C. or lower, a volume filling rate between 5 and 60%, and whose surfaces are coated with an organic stabilizer. SONY CORPORATION (JP) 2007-11-20 US disclosed
CN-1694244-A Printed circuit board SONY CORP (JP) 2005-11-09 CN disclosed
US-20050238858-A1 An insulator containing dispersed superparamagnetic nanoparticles having a blocking temperature at 80 degrees C. or lower, a volume filling rate between 5 and 60%, and whose surfaces are coated with an organic stabilizer. SONY CORPORATION (JP) 2005-10-27 US disclosed