SCHEMBL514583

SCHEMBL514583

O=S(=O)(O)C(N(CCN(C(S(=O)(=O)O)S(=O)(=O)O)C(S(=O)(=O)O)S(=O)(=O)O)C(S(=O)(=O)O)S(=O)(=O)O)S(=O)(=O)O

nearest known ligand 0.31

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
CA5A P35218 1/20 0.31
CA5B Q9Y2D0 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL9318656 0.85 MAPT (0.30)
SCHEMBL7740217 0.81
SCHEMBL11221172 0.75
SCHEMBL2809414 0.72 CA5A (0.36) CA5ACA5B
SCHEMBL10598793 0.69 SLC22A6 (0.36)
SCHEMBL9318543 0.67 CA5A (0.31) CA5ACA5B
SCHEMBL9169563 0.67 CA5A (0.31) CA5ACA5B
SCHEMBL29373753 0.59
SCHEMBL2531569 0.59
SCHEMBL9127553 0.57

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 381 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10607865-B2 Plate-shaped workpiece processing method DISCO CORPORATION (JP) 2020-03-31 US claimed
US-9486892-B2 Polishing composition FUJIMI INCORPORATED (JP) 2016-11-08 US claimed
US-20160136784-A1 Polishing Composition and Polishing Method FUJIMI INCORPORATED (JP) 2016-05-19 US claimed
US-7667953-B2 Electrolytic capacitor RUBYCON CORPORATION (JP) 2010-02-23 US claimed
US-20070121276-A1 Electrolytic solution for use in electrolytic capacitor, and electrolytic capacitor RUBYCON CORPORATION (JP) 2007-05-31 US claimed
EP-1760737-A1 ELECTROLYTE FOR DRIVING ELECTROLYTIC CAPACITOR AND ELECTROLYTIC CAPACITOR Rubycon Corporation (JP) 2007-03-07 EP claimed
US-20240218208-A1 POLISHING COMPOSITION, POLISHING METHOD, AND METHOD FOR PRODUCING SEMICONDUCTOR SUBSTRATE FUJIMI INCORPORATED (JP) 2024-07-04 US disclosed
US-11992914-B2 Polishing composition, polishing method, and method for producing substrate FUJIMI INCORPORATED (JP) 2024-05-28 US disclosed
WO-2024034618-A1 POLISHING LIQUID, POLISHING LIQUID SET AND POLISHING METHOD 株式会社レゾナック 2024-02-15 WO disclosed
US-11749531-B2 Polishing method, and polishing composition and method for producing the same FUJIMI INCORPORATED (JP) 2023-09-05 US disclosed
WO-2023140049-A1 POLISHING SOLUTION AND POLISHING METHOD 富士フイルム株式会社 2023-07-27 WO disclosed
US-11643573-B2 Polishing composition, production method therefor, and polishing method and production method for substrate, using polishing composition FUJIMI INCORPORATED (JP) 2023-05-09 US disclosed
WO-2023032716-A1 POLISHING COMPOSITION 株式会社フジミインコーポレーテッド 2023-03-09 WO disclosed
US-4965175-A CONTINUOUS PROCESSING OF CHLORIDE-RICH EMULSION, REDUCING BATH OPENING RATIO FOR DEVELOPER, OXIDATION RESISTANT PRESERVATIVE FUJI PHOTO FILM CO., LTD. (JP) 1990-10-23 US disclosed
EP-0362794-A2 Method for processing a silver halide photosensitive material for color photography FUJI PHOTO FILM CO., LTD. (JP) 1990-04-11 EP disclosed
US-4908300-A Developing imagewise exposed silver halide photographic material, maintaining dry thickness, bleach-fixing with organic acid ferric complex KONISHIROKU PHOTO INDUSTRY CO., LTD. (JP) 1990-03-13 US disclosed
EP-0312999-A1 Silver halide photographic materials FUJI PHOTO FILM CO., LTD. (JP) 1989-04-26 EP disclosed
EP-0213710-A2 Method of processing silver halide color photographic material KONICA CORPORATION (JP) 1987-03-11 EP disclosed
US-4356190-A TOPICAL APPLICATION PERSONAL PRODUCTS COMPANY (US) 1982-10-26 US disclosed
US-4144068-A BLEACHING, FIXING, BLEACH ACCELERATOR, FERRIC ION COMPLEX AS BLEACHING AGENT FUJI PHOTO FILM CO., LTD. (JP) 1979-03-13 US disclosed