SCHEMBL5148402

SCHEMBL5148402

COc1cc(C(=O)Nc2ccc(N)cc2)ccc1N

nearest known ligand 0.60

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MEN1 O00255 5/20 0.60
KMT2A Q03164 5/20 0.60
PKM P14618 4/20 0.60
POLB P06746 2/20 0.60
LMNA P02545 1/20 0.60
APEX1 P27695 1/20 0.60
TDP1 Q9NUW8 1/20 0.60
ALDH1A1 P00352 1/20 0.56
NPC1 O15118 5/20 0.54
RAB9A P51151 5/20 0.54
SMN1; SMN2 Q16637 4/20 0.54
AURKB Q96GD4 1/20 0.53
HDAC3 O15379 1/20 0.53
BRAF P15056 1/20 0.53
HDAC4 P56524 1/20 0.53
HDAC1 Q13547 1/20 0.53
HDAC7 Q8WUI4 1/20 0.53
HDAC2 Q92769 1/20 0.53
HDAC10 Q969S8 1/20 0.53
HDAC11 Q96DB2 1/20 0.53

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19810501 0.91 NPC1 (0.61) MEN1KMT2APKMPOLBLMNA
SCHEMBL11315443 0.90 NPC1 (0.60) MEN1KMT2APKMPOLBALDH1A1
SCHEMBL13175829 0.90 NPC1 (0.67) MEN1KMT2AALDH1A1NPC1RAB9A
SCHEMBL18993437 0.89 MEN1 (0.54) MEN1KMT2APKMPOLBLMNA
SCHEMBL359029 0.88 MEN1 (0.68) MEN1KMT2APKMPOLBLMNA
SCHEMBL28707478 0.88 AURKB (0.67) MEN1KMT2APKMPOLBLMNA
SCHEMBL13175761 0.86 KMT2A (0.77) MEN1KMT2APKMPOLBLMNA
SCHEMBL16692709 0.85 MEN1 (0.51) MEN1KMT2APKMPOLBLMNA
SCHEMBL28653236 0.84 ABCB1 (0.74) MEN1KMT2APKMPOLBLMNA
SCHEMBL28034904 0.83 NPC1 (0.59) MEN1KMT2APKMPOLBLMNA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107660100-B Graphite member and method for producing same 现代自动车株式会社 2020-03-13 CN claimed
CN-107660100-B Graphite member and method for producing same 现代自动车株式会社 2020-03-13 CN disclosed
US-20070169886-A1 Heat-resistant resin laminated film, multilayer film with metal layer including same and semiconductor device TORAY INDUSTRIES, INC. (JP) 2007-07-26 US disclosed
EP-1721740-A1 HEAT-RESISTANT RESIN LAMINATED FILM, MULTILAYER FILM WITH METAL LAYER INCLUDING SAME, AND SEMICONDUCTOR DEVICE TORAY INDUSTRIES, INC. (JP) 2006-11-15 EP disclosed