SCHEMBL5150180

SCHEMBL5150180

C=Cc1cccc(CCCCCC)c1C=C

nearest known ligand 0.46

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LIPG Q9Y5X9 1/20 0.46
THRA P10827 1/20 0.46
THRB P10828 1/20 0.46
BID P55957 3/20 0.43
MCL1 Q07820 3/20 0.43
BCL2L1 Q07817 2/20 0.43
BAK1 Q16611 2/20 0.43
KAT8 Q9H7Z6 2/20 0.43
SAE1 Q9UBE0 2/20 0.43
PPARA Q07869 2/20 0.43
PPARG P37231 1/20 0.43
EP300 Q09472 1/20 0.43
KAT2A Q92830 1/20 0.43
KAT2B Q92831 1/20 0.43
KAT5 Q92993 1/20 0.43
KCNH2 Q12809 2/20 0.42
ALOX5 P09917 1/20 0.41
PTGS2 P35354 1/20 0.41
F7 P08709 3/20 0.40
F3 P13726 3/20 0.40

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL10743985 1.00 LIPG (0.46) LIPGTHRATHRBBIDMCL1
SCHEMBL8062103 1.00 LIPG (0.46) LIPGTHRATHRBBIDMCL1
SCHEMBL6939140 1.00 LIPG (0.46) LIPGTHRATHRBBIDMCL1
SCHEMBL21055952 0.98 LIPG (0.43) LIPGTHRATHRBBIDMCL1
SCHEMBL4951173 0.93 CYP3A4 (0.38) LIPGTHRATHRBBIDMCL1
SCHEMBL12802299 0.89 LIPG (0.52) LIPGTHRATHRBBIDMCL1
SCHEMBL12802010 0.87 LIPG (0.48) LIPGTHRATHRBBIDMCL1
SCHEMBL7796978 0.86 LIPG (0.53) LIPGTHRATHRBBIDMCL1
SCHEMBL465113 0.86 LIPG (0.53) LIPGTHRATHRBBIDMCL1
SCHEMBL9488801 0.86 LIPG (0.53) LIPGTHRATHRBBIDMCL1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-113614172-B Resin composition and use thereof 四国化成工业株式会社 2024-05-31 CN disclosed
US-11702507-B2 Resin composition and use thereof SHIKOKU CHEMICALS CORPORATION (JP) 2023-07-18 US disclosed
US-20220185960-A1 RESIN COMPOSITION AND USE THEREOF SHIKOKU CHEMICALS CORPORATION (JP) 2022-06-16 US disclosed
CN-113614172-A Resin composition and use thereof 四国化成工业株式会社 2021-11-05 CN disclosed
WO-2020196718-A1 RESIN COMPOSITION AND USE THEREOF 四国化成工業株式会社 2020-10-01 WO disclosed
US-7193009-B2 Electronic device using low dielectric loss tangent insulators for high frequency signals HITACHI, LTD. (JP) 2007-03-20 US disclosed
CN-1273544-C Electronic element for high frequency using low-dielectric loss angle tangent insulating material HITACHI LTD (JP) 2006-09-06 CN disclosed
CN-1249182-C Low dielectric loss tangent film and wiring film HITACHI LTD (JP) 2006-04-05 CN disclosed
US-20050020781-A1 Resin composition containing rubber component, and film and electronic part using the same HITACHI, LTD. (JP) 2005-01-27 US disclosed
CN-1478824-A Electronic element for high frequency using low-dielectric loss angle tangent insulating material ������������ʽ���� 2004-03-03 CN disclosed
CN-1478831-A Low dielectric loss tangent film and wiring film 株式会社日立制作所 2004-03-03 CN disclosed
US-20040039127-A1 Electronic device using low dielectric loss tangent insulators for high frequency signals HITACHI, LTD. (JP) 2004-02-26 US disclosed
US-4634651-A NARROW PARTICLE SIZE DISTRIBUTION RICOH CO., LTD. (JP) 1987-01-06 US disclosed