SCHEMBL515428

SCHEMBL515428

CCP(CC)CC.[Cu]C1=CC=CC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2988710 0.83
SCHEMBL7647795 0.81
SCHEMBL7644177 0.80
Phosphine SCHEMBL7153914 0.80
SCHEMBL7153912 0.80
Ethylene SCHEMBL9982853 0.78
SCHEMBL9715239 0.75
SCHEMBL10580601 0.73
SCHEMBL7645558 0.73
Hydrochloric Acid SCHEMBL11676668 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 96 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8841153-B2 Method for producing a doped organic semiconducting layer OSRAM OPTO SEMICONDUCTORS GMBH (DE) 2014-09-23 US claimed
US-6174563-B1 FORMING AN INTEGRATED CIRCUIT WHICH INCLUDES A METAL FILM LAYER FOR WIRING NEC CORPORATION (JP) 2001-01-16 US claimed
US-5627102-A UNDERCOATING WITH A HIGH MELTING METAL OR COMPOUND KAWASAKI STEEL CORPORATION (JP) 1997-05-06 US claimed
US-5019531-A Heating decomposition of organic copper or gold compound NIPPON TELEGRAPH AND TELEPHONE CORPORATION (JP) 1991-05-28 US claimed
EP-0407081-A2 Lithoplate production Horsell Plc (GB) 1991-01-09 EP claimed
US-4869930-A Method for preparing substrates for deposition of metal seed from an organometallic vapor for subsequent electroless metallization INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1989-09-26 US claimed
JP-5299374-A None JP disclosed
US-20260031365-A1 ELECTROCATALYST STRUCTURES FOR AN ELECTRODE UNIV WEST VIRGINIA (US) 2026-01-29 US disclosed
WO-2025073702-A1 PROCESS FOR PREPARING AROMATIC AMINES FROM ARYL CHLORIDES BASF SE (DE) 2025-04-10 WO disclosed
WO-2025045564-A1 ISOCYANURATES TECHNISCHE UNIVERSITÄT WIEN (AT) 2025-03-06 WO disclosed
US-20220320526-A1 ELECTROCATALYST STRUCTURES FOR AN ELECTRODE WEST VIRGINIA UNIVERSITY 2022-10-06 US disclosed
US-11316169-B2 Methods for forming electrocatalyst structures and electrodes comprising same WEST VIRGINIA UNIVERSITY (US) 2022-04-26 US disclosed
US-10903257-B2 Solid-state imaging device, driving method for solid-state imaging device, and electronic appliance SONY SEMICONDUCTOR SOLUTIONS CORPORATION (JP) 2021-01-26 US disclosed
US-4948623-A Method of chemical vapor deposition of copper, silver, and gold using a cyclopentadienyl/metal complex INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1990-08-14 US disclosed
US-4919971-A Self-induced repairing of conductor lines INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 1990-04-24 US disclosed
EP-0359930-A2 Self-induced repairing of conductor lines International Business Machines Corporation (US) 1990-03-28 EP disclosed
US-4880670-A Chemical vapor deposition of Group IB metals GEORGIA TECH RESEARCH CORPORATION (US) 1989-11-14 US disclosed
EP-0297348-A1 Method for chemical vapor deposition of copper, silver, and gold using a cyclopentadienyl metal complex International Business Machines Corporation (US) 1989-01-04 EP disclosed
EP-0297348-A1 Method for chemical vapor deposition of copper, silver, and gold using a cyclopentadienyl metal complex International Business Machines Corporation (US) 1989-01-04 EP disclosed
EP-0284441-A2 II-VI Group compound crystal article and process for producing the same CANON KABUSHIKI KAISHA (JP) 1988-09-28 EP disclosed