SCHEMBL5164546

SCHEMBL5164546

CCC(CCCO)(CCCO)C(=O)O

nearest known ligand 0.57

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
CYP4F2 P78329 4/20 0.57
CYP4A11 Q02928 4/20 0.57
SMN1; SMN2 Q16637 2/20 0.38
ARG2 P78540 2/20 0.37
GPR84 Q9NQS5 1/20 0.37
FFAR1 O14842 1/20 0.37
FFAR4 Q5NUL3 1/20 0.37
ALDH1A1 P00352 3/20 0.36
LMNA P02545 2/20 0.36
MEN1 O00255 2/20 0.36
KMT2A Q03164 2/20 0.36
HSD17B10 Q99714 1/20 0.36
TSHR P16473 1/20 0.36
KDM4E B2RXH2 1/20 0.35
CAMK2A Q9UQM7 1/20 0.35
CYP1A2 P05177 1/20 0.34
THRB P10828 1/20 0.34
TDP1 Q9NUW8 1/20 0.34
ARG1 P05089 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL11416969 0.96 CYP4F2 (0.53) CYP4F2CYP4A11SMN1; SMN2ARG2GPR84
SCHEMBL26679469 0.95 CYP4F2 (0.57) CYP4F2CYP4A11SMN1; SMN2ARG2GPR84
SCHEMBL27598062 0.93 CYP4F2 (0.60) CYP4F2CYP4A11SMN1; SMN2ARG2GPR84
SCHEMBL6118938 0.92 CYP4F2 (0.55) CYP4F2CYP4A11SMN1; SMN2ARG2ALDH1A1
SCHEMBL11417682 0.91 CYP4F2 (0.53) CYP4F2CYP4A11SMN1; SMN2ARG2GPR84
SCHEMBL3153948 0.90 CYP4F2 (0.53) CYP4F2CYP4A11SMN1; SMN2GPR84FFAR1
SCHEMBL11429864 0.89 CYP4F2 (0.56) CYP4F2CYP4A11SMN1; SMN2ARG2GPR84
SCHEMBL692369 0.85 CYP4F2 (0.41) CYP4F2CYP4A11ARG2ALDH1A1MEN1
SCHEMBL5161125 0.85 GPR84 (0.43) CYP4F2CYP4A11SMN1; SMN2ARG2GPR84
SCHEMBL17451110 0.85 CYP4F2 (0.43) CYP4F2CYP4A11SMN1; SMN2GPR84FFAR1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 30 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
WO-2025242379-A1 BONDED STRUCTURE COMPRISING AN ELECTROCHEMICALLY DEBONDABLE ADHESIVE FILM HENKEL AG & CO. KGAA (DE) 2025-11-27 WO disclosed
WO-2022202082-A1 METHOD FOR PRODUCING FLEXIBLE PRINTED BOARDS 株式会社カネカ 2022-09-29 WO disclosed
WO-2022202081-A1 METHOD FOR PRODUCING FLEXIBLE PRINTED BOARD 株式会社カネカ 2022-09-29 WO disclosed
WO-2022202080-A1 METHOD FOR MANUFACTURING FLEXIBLE PRINTED CIRCUIT BOARD 株式会社カネカ 2022-09-29 WO disclosed
US-10292262-B2 Reinforcing-plate-integrated flexible printed circuit board KANEKA CORPORATION (JP) 2019-05-14 US disclosed
US-10045433-B2 Conductive-layer-integrated flexible printed circuit board KANEKA CORPORATION (JP) 2018-08-07 US disclosed
US-10030133-B2 Black photosensitive resin composition and use of same KANEKA CORPORATION (JP) 2018-07-24 US disclosed
US-9957390-B2 Resin composition for pigment-containing insulating film, and use thereof KANEKA CORPORATION (JP) 2018-05-01 US disclosed
US-9835942-B2 Photosensitive resin composition and use thereof KANEKA CORPORATION (JP) 2017-12-05 US disclosed
US-20170290141-A1 CONDUCTIVE-LAYER-INTEGRATED FLEXIBLE PRINTED CIRCUIT BOARD KANEKA CORPORATION 2017-10-05 US disclosed
US-8883894-B2 Insulating film and printed wiring board provided with insulating film KANEKA CORPORATION (JP) 2014-11-11 US disclosed
US-20140069702-A1 NOVEL PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF KANEKA CORPORATION (JP) 2014-03-13 US disclosed
US-20140054081-A1 NOVEL FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH CONDUCTIVE LAYER KANEKA CORPORATION (JP) 2014-02-27 US disclosed
US-20140048314-A1 FLEXIBLE PRINTED CIRCUIT INTEGRATED WITH REINFORCING PLATE KANEKA CORPORATION (JP) 2014-02-20 US disclosed
US-20130333931-A1 NOVEL INSULATING FILM AND PRINTED WIRING BOARD PROVIDED WITH INSULATING FILM KANEKA CORPORATION (JP) 2013-12-19 US disclosed
US-20130264099-A1 NOVEL PHOTOSENSITIVE RESIN COMPOSITION AND USE THEREOF KANEKA CORPORATION (JP) 2013-10-10 US disclosed
EP-1582548-B1 PROCESS FOR PRODUCING POLYMERIZABLE POLYBRANCHED POLYESTER DAINIPPON INK & CHEMICALS (JP) 2007-03-28 EP disclosed
US-6468725-B2 SILVER HALIDE, ORGANOSILIVER SALT, REDUCING AGENT AND BINDER KONICA CORPORATION (JP) 2002-10-22 US disclosed
US-20010014433-A1 Photothermographic material KONICA CORPORATION, A CORPORATION OF JAPAN (JP) 2001-08-16 US disclosed
US-6235462-B1 SILVER SALT OF A POLYMER KONICA CORPORATION (JP) 2001-05-22 US disclosed