SCHEMBL516925

SCHEMBL516925

C=COC(=O)C(=C)C.N=C=O

nearest known ligand 0.41

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.41
TSHR P16473 3/20 0.33
THRB P10828 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL28339448 0.89 ALDH1A1 (0.42) ALDH1A1TSHRTHRB
SCHEMBL35971 0.89
Ethylene SCHEMBL27433922 0.86 ALDH1A1 (0.48) ALDH1A1TSHRTHRB
Water SCHEMBL27430114 0.86
SCHEMBL11590228 0.86
SCHEMBL11256472 0.86
SCHEMBL11854992 0.86
SCHEMBL28126634 0.86
Bicarbonate SCHEMBL28402036 0.84 ALDH1A1 (0.46) ALDH1A1TSHRTHRB
Hydrochloric Acid SCHEMBL28368190 0.84 ALDH1A1 (0.46) ALDH1A1TSHRTHRB

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 49 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
JP-11043501-A None JP disclosed
EP-1880843-B1 Pressure-sensitive adhesive sheet for use in dicing NITTO DENKO CORP (JP) 2014-11-19 EP disclosed
US-8652938-B2 Thermally releasable sheet-integrated film for semiconductor back surface, method of collecting semiconductor element, and method of producing semiconductor device NITTO DENKO CORPORATION (JP) 2014-02-18 US disclosed
US-20130260120-A1 HEAT-PEELABLE PRESSURE-SENSITIVE ADHESIVE SHEET NITTO DENKO CORPORATION (JP) 2013-10-03 US disclosed
EP-2644669-A1 Heat-peelable pressure-sensitive adhesive sheet NITTO DENKO CORPORATION (JP) 2013-10-02 EP disclosed
US-20120223455-A1 METHOD FOR MANUFACTURING THIN-FILM SUBSTRATE NITTO DENKO CORPORATION (JP) 2012-09-06 US disclosed
EP-2495779-A2 Method for manufacturing thin-film substrate Nitto Denko Corporation (JP) 2012-09-05 EP disclosed
CN-101108953-B Heat-resistant dicing tape or sheet NITTO DENKO CORP 2012-05-23 CN disclosed
US-20120028442-A1 THERMALLY RELEASABLE SHEET-INTEGRATED FILM FOR SEMICONDUCTOR BACK SURFACE, METHOD OF COLLECTING SEMICONDUCTOR ELEMENT, AND METHOD OF PRODUCING SEMICONDUCTOR DEVICE NITTO DENKO CORPORATION (JP) 2012-02-02 US disclosed
US-20110030881-A1 ADHESIVE SHEET FOR SUPPORTING AND PROTECTING SEMICONDUCTOR WAFER AND METHOD FOR GRINDING BACK OF SEMICONDUCTOR WAFER NITTO DENKO CORPORATION (JP) 2011-02-10 US disclosed
EP-1354925-A1 Heat-peelable pressure-sensitive adhesive sheet for electronic part, method of processing electronic part, and electronic part NITTO DENKO CORPORATION (JP) 2003-10-22 EP disclosed
US-20020192463-A1 Heat-peelable pressure-sensitive adhesive sheet NITTO DENKO CORPORATION 2002-12-19 US disclosed
US-6054545-A CELLULOSE MODIFIED WITH CARBOXYLATED ISOCYANATE TOKYO OHKA KOGYO CO., LTD. (JP) 2000-04-25 US disclosed
US-5989426-A Osmosis membrane NITTO DENKO CORP. (JP) 1999-11-23 US disclosed
JP-H1143501-A MODIFIED CELLULOSE COMPOUND AND PHOTO POLYMERIZABLE RESIN COMPOSITION CONTAINING THE SAME TOKYO OHKA KOGYO CO LTD 1999-02-16 JP disclosed
EP-0894808-A1 Modified cellulose compound and photopolymerizable resin composition containing the same TOKYO OHKA KOGYO CO., LTD. (JP) 1999-02-03 EP disclosed
US-5843351-A Highly permeable composite reverse osmosis membrane, method of producing the same NITTO DENKO CORPORATION (JP) 1998-12-01 US disclosed
US-5614099-A POLYAMIDE SKIN LAYER COATED WITH CROSSLINKED POLYETHYLENIMINE, ANIONIC AND CATIONIC POLYMERS, MULTISTAGE DESALINATION NITTO DENKO CORPORATION (JP) 1997-03-25 US disclosed
EP-0752266-A2 Highly permeable composite reverse osmosis membrane NITTO DENKO CORPORATION (JP) 1997-01-08 EP disclosed
EP-0718030-A2 Highly permeable composite reverse osmosis membrane, method of producing the same, and method of using the same NITTO DENKO CORPORATION (JP) 1996-06-26 EP disclosed