SCHEMBL51699

SCHEMBL51699

CCC(C)c1ccc(OCC2CO2)cc1

nearest known ligand 0.55

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 8/20 0.55
TSHR P16473 4/20 0.55
TP53 P04637 3/20 0.55
MAPT P10636 3/20 0.55
MEN1 O00255 3/20 0.55
KMT2A Q03164 3/20 0.55
HPGD P15428 2/20 0.55
HIF1A Q16665 2/20 0.55
CYP1A2 P05177 1/20 0.55
PPARG P37231 1/20 0.55
TDP1 Q9NUW8 2/20 0.54
PKM P14618 2/20 0.51
GAA P10253 2/20 0.51
LMNA P02545 1/20 0.51
CYP3A4 P08684 1/20 0.49
SMN1; SMN2 Q16637 1/20 0.49
NPC1 O15118 2/20 0.44
RAB9A P51151 2/20 0.44
GLA P06280 1/20 0.42
HSP90AA1 P07900 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL13084017 0.93 ALDH1A1 (0.49) ALDH1A1TSHRTP53MAPTMEN1
SCHEMBL19523007 0.89 ALDH1A1 (0.56) ALDH1A1TSHRTP53MAPTMEN1
SCHEMBL21914002 0.86 ALDH1A1 (0.54) ALDH1A1TSHRTP53MAPTMEN1
SCHEMBL19701081 0.85 ALDH1A1 (0.57) ALDH1A1TSHRTP53MAPTMEN1
SCHEMBL232507 0.85 TDP1 (0.61) ALDH1A1TSHRTP53MAPTMEN1
SCHEMBL7966299 0.85 KMT2A (0.60) ALDH1A1TSHRTP53MAPTMEN1
SCHEMBL234681 0.85 ALDH1A1 (0.60) ALDH1A1TSHRTP53MAPTMEN1
SCHEMBL3143396 0.85 KMT2A (0.60) ALDH1A1TSHRTP53MAPTMEN1
SCHEMBL7966302 0.85 KMT2A (0.60) ALDH1A1TSHRTP53MAPTMEN1
SCHEMBL6743722 0.84 TDP1 (0.56) ALDH1A1TSHRTP53MAPTMEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 906 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116621869-A Alkoxy silanization epoxy resin, modified epoxy resin-based ultra-low CTE underfill, preparation method and application thereof 深圳先进电子材料国际创新研究院 2023-08-22 CN claimed
EP-3369297-B1 A CONDUCTIVE COMPOSITION FOR LOW FREQUENCY EMI SHIELDING HENKEL AG & CO KGAA (DE) 2022-12-28 EP claimed
CN-109863201-B Resin composition, molded article, and method for producing same 旭有机材株式会社 2022-07-12 CN claimed
CN-108350381-B Refrigerating machine oil JXTG能源株式会社 2021-11-16 CN claimed
CN-109563238-B Epoxy resin composition and conductive adhesive containing same 三键有限公司 2021-08-27 CN claimed
CN-113122057-A Quantum dot ink and preparation method of quantum dot film TCL集团股份有限公司 2021-07-16 CN claimed
US-10995245-B2 Epoxy resin composition and electro-conductive adhesive containing the same THREEBOND CO., LTD. (JP) 2021-05-04 US claimed
CN-107250332-B Refrigerator oil and working fluid composition for refrigerator JXTG能源株式会社 2021-02-12 CN claimed
US-10899923-B2 Resin composition, molded product and production method thereof ASAHI YUKIZAI CORPORATION (JP) 2021-01-26 US claimed
CN-107406783-B Refrigerator oil and working fluid composition for refrigerator JXTG能源株式会社 2020-11-24 CN claimed
US-20060103028-A1 Electronic component unit NITTO DENKO CORPORATION (JP) 2006-05-18 US claimed
US-6674016-B2 Electronic component NITTO DENKO CORPORATION (JP) 2004-01-06 US claimed
US-20030116347-A1 Electronic component NITTO DENKO CORPORATION 2003-06-26 US claimed
EP-0709418-B1 Aqueous self-emulsifiable epoxy resin curing agent MITSUBISHI GAS CHEMICAL CO (JP) 2003-05-02 EP claimed
US-6498200-B1 OXIRANE OR OXETANE RING COMPOUND, ORGANIC PEROXIDE, ONIUM SALT CATALYST, AND ALKALINE FILLER; CURES RAPIDLY; STABLE DOES NOT CAUSE INCREASE IN ELECTROCONDUCTIVITY OR CORROSION; SEALANT, BINDER, ENCAPSULATING AGENT, DIELECTRIC FILM NAMICS CORPORATION (JP) 2002-12-24 US claimed
EP-0733689-B1 Chloroprene rubber adhesive composition KONISHI CO LTD (JP) 1998-10-07 EP claimed
US-5753727-A Chloroprene rubber adhesive with chlorinated polyolefin and epoxy resin KONISHI CO., LTD. (JP) 1998-05-19 US claimed
US-5670612-A BLEND OF A POLYAMINE, EPOXY COMPOUND AND A UNSATURATED COMPOUND MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1997-09-23 US claimed
EP-0733689-A1 Chloroprene rubber adhesive composition KONISHI CO., LTD. (JP) 1996-09-25 EP claimed
EP-0709418-A2 Aqueous self-emulsifiable epoxy resin curing agent MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) 1996-05-01 EP claimed