Predicted protein targets (top 7)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | APP | P05067 | 1/20 | 0.50 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.41 |
| ▸ | PDE4A | P27815 | 1/20 | 0.41 |
| ▸ | LMNA | P02545 | 1/20 | 0.41 |
| ▸ | SLC6A6 | P31641 | 1/20 | 0.41 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.41 |
| ▸ | BLM | P54132 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL565134 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL15297851 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL518580 | 0.97 | APP (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL564743 | 0.95 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL27175673 | 0.95 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL28042194 | 0.95 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL14856462 | 0.90 | TDP1 (0.48) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL27175667 | 0.89 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL11756346 | 0.89 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 | |
| SCHEMBL27175669 | 0.89 | APP (0.46) | APPPTGS1PDE4ALMNASLC6A6 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 242 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11746433-B2 | Single step electrolytic method of filling through holes in printed circuit boards and other substrates | MACDERMID ENTHONE INC. (US) | 2023-09-05 | — | — | US | claimed |
| US-10982343-B2 | Plating compositions for electrolytic copper deposition, its use and a method for electrolytically depositing a copper or copper alloy layer onto at least one surface of a substrate | ATOTECH DEUTSCHLAND GMBH (DE) | 2021-04-20 | — | — | US | claimed |
| US-20200347504-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-11-05 | — | — | US | claimed |
| EP-3483307-B1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH DEUTSCHLAND GMBH (DE) | 2020-04-01 | — | — | EP | claimed |
| EP-3483307-A1 | PLATING COMPOSITIONS FOR ELECTROLYTIC COPPER DEPOSITION, ITS USE AND A METHOD FOR ELECTROLYTICALLY DEPOSITING A COPPER OR COPPER ALLOY LAYER ONTO AT LEAST ONE SURFACE OF A SUBSTRATE | ATOTECH Deutschland GmbH (DE) | 2019-05-15 | — | — | EP | claimed |
| US-20180355499-A1 | MANUFACTURING METHOD OF ULTRA-LARGE COPPER GRAINS WITHOUT HEAT TREATMENT | LHTECH CO., LTD. (TW) | 2018-12-13 | — | — | US | claimed |
| EP-2576867-B1 | METHOD FOR ETCHING SURFACES OF CIRCUIT STRUCTURES OF PLATED COPPER AND PLATED COPPER ALLOYS | ATOTECH DEUTSCHLAND GMBH (DE) | 2018-04-04 | — | — | EP | claimed |
| WO-2017052002-A1 | ORGANIC ADDITIVE FOR ELECTROLYTIC COPPER PLATING COMPRISING TWO TYPES OF LEVELERS, AND ELECTROLYTIC COPPER PLATING SOLUTION CONTAINING SAME | 한국생산기술연구원 | 2017-03-30 | — | — | WO | claimed |
| EP-2855738-A1 | ADDITIVES FOR PRODUCING COPPER ELECTRODEPOSITS HAVING LOW OXYGEN CONTENT | MacDermid Acumen, Inc. (US) | 2015-04-08 | — | — | EP | claimed |
| CN-104428452-A | Additive for preparing copper electrodeposits having low oxygen content | MACDERMID ACUMEN INC | 2015-03-18 | — | — | CN | claimed |
| US-20080142370-A1 | Aqueous, Acidic Solution and Method for Electrolytically Depositing Copper Coatings as Well as Use of Said Solution | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-06-19 | — | — | US | claimed |
| EP-1651801-B1 | AQUEOUS, ACIDIC SOLUTION AND METHOD FOR ELECTROLYTICALLY DEPOSITING COPPER COATINGS AS WELL AS USE OF SAID SOLUTION | ATOTECH DEUTSCHLAND GMBH (DE) | 2008-01-23 | — | — | EP | claimed |
| US-7153449-B2 | Acidic treatment liquid and method of treating copper surfaces | ATOTECH DEUTSCHLAND GMBH (DE) | 2006-12-26 | — | — | US | claimed |
| EP-1299575-B1 | ACIDIC TREATMENT LIQUID AND METHOD OF TREATING COPPER SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2004-08-25 | — | — | EP | claimed |
| US-20030164466-A1 | Acidic treatment liquid and method of treating copper surfaces | ATOTECH DEUTSCHLAND GMBH & CO. KG (F/K/A ATOTECH DEUTSCHLAND GMBH) (DE) | 2003-09-04 | — | — | US | claimed |
| EP-1299575-A2 | ACIDIC TREATMENT LIQUID AND METHOD OF TREATING COPPER SURFACES | ATOTECH Deutschland GmbH (DE) | 2003-04-09 | — | — | EP | claimed |
| WO-2002004706-A9 | ACIDIC TREATMENT LIQUID AND METHOD OF TREATING COPPER SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2002-09-19 | — | — | WO | claimed |
| WO-2002004706-A1 | ACIDIC TREATMENT LIQUID AND METHOD OF TREATING COPPER SURFACES | ATOTECH DEUTSCHLAND GMBH (DE) | 2002-01-17 | — | — | WO | claimed |
| EP-0598763-B1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1995-12-13 | — | — | EP | claimed |
| WO-1993003204-A1 | ACID BATH FOR THE GALVANIC DEPOSITION OF COPPER, AND THE USE OF SUCH A BATH | ATOTECH DEUTSCHLAND GMBH (DE) | 1993-02-18 | — | — | WO | claimed |